WAFER FILL PATTERNS AND USES
    2.
    发明申请
    WAFER FILL PATTERNS AND USES 有权
    WAFER FILL PATTERNS和用途

    公开(公告)号:US20120126294A1

    公开(公告)日:2012-05-24

    申请号:US12949148

    申请日:2010-11-18

    摘要: A method of forming a semiconductor device having a substrate, an active region and an inactive region includes: forming a hardmask layer over the substrate; transferring a first pattern into the hardmask layer in the active region of the semiconductor device; forming one or more fills in the inactive region; forming a cut-away hole within, covering, or partially covering, the one or more fills to expose a portion of the hardmask layer, the exposed portion being within the one or more fills; and exposing the hardmask layer to an etchant to divide the first pattern into a second pattern including at least two separate elements.

    摘要翻译: 一种形成具有衬底,有源区和非活性区的半导体器件的方法包括:在衬底上形成硬掩模层; 将第一图案转移到半导体器件的有源区中的硬掩模层中; 在非活性区域中形成一个或多个填充物; 在所述一个或多个填充物内部,覆盖或部分地覆盖所述硬掩模层的一部分以暴露所述硬掩模层的一部分内的切除孔,所述暴露部分在所述一个或多个填充物内; 以及将所述硬掩模层暴露于蚀刻剂以将所述第一图案划分成包括至少两个分离元件的第二图案。

    Line ends forming
    5.
    发明授权
    Line ends forming 有权
    线端成型

    公开(公告)号:US07993815B2

    公开(公告)日:2011-08-09

    申请号:US11853353

    申请日:2007-09-11

    IPC分类号: H01L21/8229

    摘要: Methods of forming line ends and a related memory cell including the line ends are disclosed. In one embodiment, the method includes forming a first device element and a second device element separated from the first device element by a space; and forming a first line extending from the first device element, the first line including a bulbous line end over the space and distanced from the first device element, and a second line extending from the second device element, the second line including a bulbous line end over the space and distanced from the second device element.

    摘要翻译: 公开了形成线端的方法和包括线端的相关存储单元。 在一个实施例中,该方法包括通过空间形成与第一器件元件分离的第一器件元件和第二器件元件; 以及形成从所述第一装置元件延伸的第一线,所述第一线包括在所述空间上并与所述第一装置元件间隔开的球形线端,以及从所述第二装置元件延伸的第二线,所述第二线包括球根线端 并且与第二设备元件分开。

    MEMORY CELL
    6.
    发明申请
    MEMORY CELL 审中-公开
    记忆体

    公开(公告)号:US20090065956A1

    公开(公告)日:2009-03-12

    申请号:US11853358

    申请日:2007-09-11

    IPC分类号: H01L23/48

    摘要: Methods of forming line ends and a related memory cell including the line ends are disclosed. In one embodiment, the memory cell includes fa first device having a first conductive line extending over a first active region and having a first line end of the first conductive line positioned over an isolation region adjacent to the first active region; and a second device having a second conductive line extending over one of a second active region and a contact element and having a second line end of the second conductive line positioned over the isolation region adjacent to the one of the second active region and the contact element, wherein the first line end and the second line end each include a bulbous end that is distanced from a respective active region or contact element.

    摘要翻译: 公开了形成线端的方法和包括线端的相关存储单元。 在一个实施例中,存储单元包括fa第一器件,其具有在第一有源区上延伸的第一导线,并且第一导线的第一线端位于与第一有源区相邻的隔离区上; 以及第二装置,具有延伸到第二有源区和接触元件之一上的第二导线,并且第二导线的第二线端位于与第二有源区和接触元件中的一个相邻的隔离区上方 ,其中所述第一线端和所述第二线端各自包括与相应的有源区域或接触元件间隔开的球状端。

    LINE ENDS FORMING
    7.
    发明申请
    LINE ENDS FORMING 有权
    线端形成

    公开(公告)号:US20090068837A1

    公开(公告)日:2009-03-12

    申请号:US11853353

    申请日:2007-09-11

    IPC分类号: H01L21/44

    摘要: Methods of forming line ends and a related memory cell including the line ends are disclosed. In one embodiment, the method includes forming a first device element and a second device element separated from the first device element by a space; and forming a first line extending from the first device element, the first line including a bulbous line end over the space and distanced from the first device element, and a second line extending from the second device element, the second line including a bulbous line end over the space and distanced from the second device element.

    摘要翻译: 公开了形成线端的方法和包括线端的相关存储单元。 在一个实施例中,该方法包括通过空间形成与第一器件元件分离的第一器件元件和第二器件元件; 以及形成从所述第一装置元件延伸的第一线,所述第一线包括在所述空间上并与所述第一装置元件间隔开的球形线端,以及从所述第二装置元件延伸的第二线,所述第二线包括球根线端 并且与第二设备元件分开。

    METHODS FOR FORMING A COMPOSITE PATTERN INCLUDING PRINTED RESOLUTION ASSIST FEATURES
    8.
    发明申请
    METHODS FOR FORMING A COMPOSITE PATTERN INCLUDING PRINTED RESOLUTION ASSIST FEATURES 有权
    用于形成复合图案的方法,包括印刷分辨率辅助特征

    公开(公告)号:US20090181330A1

    公开(公告)日:2009-07-16

    申请号:US12013627

    申请日:2008-01-14

    IPC分类号: G03F7/20

    摘要: An underlayer to be patterned with a composite pattern is formed on a substrate. The composite pattern is decomposed into a first pattern and a second pattern, each having reduced complexity than the composite pattern. A hard mask layer is formed directly on the underlying layer. A first photoresist is applied over the hard mask layer and lithographically patterned with the first pattern, which is transferred into the hard mask layer by a first etch. A second photoresist is applied over the hard mask layer. The second photoresist is patterned with the second pattern to expose portions of the underlying layer. The exposed portions of the underlying layer are etched employing the second photoresist and the hard mask layer, which contains the first pattern so that the composite pattern is transferred into the underlying layer.

    摘要翻译: 在基板上形成图案化复合图案的底层。 复合图案被分解为第一图案和第二图案,每个图案具有比复合图案更低的复杂度。 硬掩模层直接形成在下层上。 将第一光致抗蚀剂施加在硬掩模层上并用第一图案进行光刻图案化,其通过第一蚀刻转移到硬掩模层中。 在硬掩模层上施加第二光致抗蚀剂。 用第二图案对第二光致抗蚀剂进行图案化以暴露下层的部分。 使用包含第一图案的第二光致抗蚀剂和硬掩模层来蚀刻下层的暴露部分,使得复合图案被转移到下层中。

    Methods for forming a composite pattern including printed resolution assist features
    9.
    发明授权
    Methods for forming a composite pattern including printed resolution assist features 有权
    用于形成包括印刷分辨率辅助特征的复合图案的方法

    公开(公告)号:US08158334B2

    公开(公告)日:2012-04-17

    申请号:US12013627

    申请日:2008-01-14

    IPC分类号: G03F7/26

    摘要: An underlayer to be patterned with a composite pattern is formed on a substrate. The composite pattern is decomposed into a first pattern and a second pattern, each having reduced complexity than the composite pattern. A hard mask layer is formed directly on the underlying layer. A first photoresist is applied over the hard mask layer and lithographically patterned with the first pattern, which is transferred into the hard mask layer by a first etch. A second photoresist is applied over the hard mask layer. The second photoresist is patterned with the second pattern to expose portions of the underlying layer. The exposed portions of the underlying layer are etched employing the second photoresist and the hard mask layer, which contains the first pattern so that the composite pattern is transferred into the underlying layer.

    摘要翻译: 在基板上形成图案化复合图案的底层。 复合图案被分解为第一图案和第二图案,每个图案具有比复合图案更低的复杂度。 硬掩模层直接形成在下层上。 将第一光致抗蚀剂施加在硬掩模层上并用第一图案进行光刻图案化,其通过第一蚀刻转移到硬掩模层中。 在硬掩模层上施加第二光致抗蚀剂。 用第二图案对第二光致抗蚀剂进行图案化以暴露下层的部分。 使用包含第一图案的第二光致抗蚀剂和硬掩模层来蚀刻下层的暴露部分,使得复合图案被转移到下层中。

    GATE PATTERNING SCHEME WITH SELF ALIGNED INDEPENDENT GATE ETCH
    10.
    发明申请
    GATE PATTERNING SCHEME WITH SELF ALIGNED INDEPENDENT GATE ETCH 失效
    具有自对准独立门控阀的门控方案

    公开(公告)号:US20090203200A1

    公开(公告)日:2009-08-13

    申请号:US12027444

    申请日:2008-02-07

    IPC分类号: H01L21/027

    摘要: A method for self-aligned gate patterning is disclosed. Two masks are used to process adjacent semiconductor components, such as an nFET and pFET that are separated by a shallow trench isolation region. The mask materials are chosen to facilitate selective etching. The second mask is applied while the first mask is still present, thereby causing the second mask to self align to the first mask. This avoids the undesirable formation of a stringer over the shallow trench isolation region, thereby improving the yield of a semiconductor manufacturing operation.

    摘要翻译: 公开了一种用于自对准栅极图案化的方法。 使用两个掩模来处理相邻的半导体部件,例如由浅沟槽隔离区分隔的nFET和pFET。 选择掩模材料以便于选择性蚀刻。 当第一掩模仍然存在时,施加第二掩模,从而使第二掩模与第一掩模自对准。 这避免了在浅沟槽隔离区域上不期望地形成纵梁,从而提高半导体制造操作的产量。