SYSTEM FOR TRANSPORTING SUBSTRATE CARRIERS
    3.
    发明申请
    SYSTEM FOR TRANSPORTING SUBSTRATE CARRIERS 有权
    运输基板运输系统

    公开(公告)号:US20070059145A1

    公开(公告)日:2007-03-15

    申请号:US11554876

    申请日:2006-10-31

    IPC分类号: B65G47/90

    摘要: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

    摘要翻译: 在半导体制造设备中,输送机输送基板载体。 基板载体从输送机卸载并装载到输送机上而不停止输送机。 在卸载操作期间,负载和/或卸载机构将基板载体从输送机提升,同时匹配输送机的水平速度。 类似地,在装载操作期间,装载/卸载机构降低了基板载体与输送机的接合,同时匹配输送机的水平速度。 没有载体的单个基底可以类似地从输送机装载和/或卸载。

    METHODS AND APPARATUS FOR TRANSPORTING SUBSTRATE CARRIERS
    4.
    发明申请
    METHODS AND APPARATUS FOR TRANSPORTING SUBSTRATE CARRIERS 有权
    运输基板载体的方法和装置

    公开(公告)号:US20070056834A1

    公开(公告)日:2007-03-15

    申请号:US11554919

    申请日:2006-10-31

    IPC分类号: B65G17/02

    摘要: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

    摘要翻译: 根据第一方面,提供了一种适于在半导体器件制造设备内传送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭合回路的带状物。 该带适于(1)在水平面上具有柔性并且在垂直平面中是刚性的; 和(2)在所述半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面,以及根据这些和其它方面的系统,方法和计算机程序产品。

    Break-away positioning conveyor mount for accommodating conveyor belt bends

    公开(公告)号:US20060260909A1

    公开(公告)日:2006-11-23

    申请号:US11495052

    申请日:2006-07-28

    IPC分类号: B65G29/00

    摘要: A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt.

    SYSTEMS AND METHODS FOR TRANSFERRING SMALL LOT SIZE SUBSTRATE CARRIERS BETWEEN PROCESSING TOOLS
    9.
    发明申请
    SYSTEMS AND METHODS FOR TRANSFERRING SMALL LOT SIZE SUBSTRATE CARRIERS BETWEEN PROCESSING TOOLS 有权
    用于传送加工工具之间的小尺寸基板载体的系统和方法

    公开(公告)号:US20070059861A1

    公开(公告)日:2007-03-15

    申请号:US11555252

    申请日:2006-10-31

    IPC分类号: H01L21/00

    摘要: In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

    摘要翻译: 在第一方面,提供了一种在小批量半导体器件制造设施内管理正在进行的工作的方法。 第一种方法包括提供具有(1)多个处理工具的小批量半导体器件制造设备; 和(2)适于在处理工具之间运输小批量衬底载体的高速运输系统。 该方法还包括:(1)增加小批量半导体器件制造设备内的低优先级衬底的平均周期时间,使小批量半导体器件制造设备内的预定工作保持在进行中; 和(2)减小小批量半导体器件制造设备内的高优先级衬底的平均周期时间,以便在小批量半导体器件制造设备内大致维持预定工作进行中的水平。 提供了许多其他方面。

    Substrate carrier having reduced height
    10.
    发明申请
    Substrate carrier having reduced height 审中-公开
    基板载体具有降低的高度

    公开(公告)号:US20060061979A1

    公开(公告)日:2006-03-23

    申请号:US11219332

    申请日:2005-09-02

    IPC分类号: G06F19/00 H05K7/04

    CPC分类号: H01L21/67353 H01L21/67379

    摘要: A first substrate carrier is provided that includes a body adapted to store one or more substrates; and either (1) a bottom surface having one or more coupling features that extend into a storage region of the body or (2) coupling features that extend alongside the body, so that the substrate carrier's overall height is not increased by the entire height of the coupling feature. Numerous other aspects are provided.

    摘要翻译: 提供了第一衬底载体,其包括适于存储一个或多个衬底的主体; 和(1)具有一个或多个连接特征的底表面,其延伸到主体的存储区域中,或者(2)耦合沿着身体延伸的特征,使得基板载体的整体高度不会增加整个高度 耦合功能。 提供了许多其他方面。