PLASMA-INDUCED CHARGE DAMAGE CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES
    10.
    发明申请
    PLASMA-INDUCED CHARGE DAMAGE CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES 审中-公开
    用于等离子体增强化学蒸气沉积过程的等离子体诱导电荷损失控制

    公开(公告)号:US20080254233A1

    公开(公告)日:2008-10-16

    申请号:US11733531

    申请日:2007-04-10

    IPC分类号: C23C14/28

    CPC分类号: C23C16/26 C23C16/52

    摘要: Methods of depositing amorphous carbon films on substrates are provided herein. The methods reduce or prevent plasma-induced charge damage to the substrates from the deposition of the amorphous carbon films. In one aspect, an initiation layer of amorphous carbon is deposited at a low RF power level and/or at a low hydrocarbon compound/inert gas flow rate ratio before a bulk layer of amorphous carbon is deposited. After the deposition of the initiation layer, the RF power, hydrocarbon flow rate, and inert gas flow rate may be ramped to final values for the deposition of the bulk layer, wherein the RF power ramp rate is typically greater than the ramp rates of the hydrocarbon compound and of the inert gas. In another aspect, a method of minimizing plasma-induced charge damage includes depositing a seasoning layer on one or more interior surfaces of a chamber before the deposition of the amorphous carbon film on a substrate therein or coating the interior surfaces with an oxide or dielectric layer during manufacturing.

    摘要翻译: 本文提供了在基片上沉积非晶碳膜的方法。 该方法从无定形碳膜的沉积中减少或防止等离子体对基板的电荷损伤。 在一个方面,在堆积无定形碳沉积层之前,以低RF功率水平和/或低烃化合物/惰性气体流速比沉积无定形碳的起始层。 在起始层的沉积之后,RF功率,烃流速和惰性气体流速可以斜坡化到用于沉积体层的最终值,其中RF功率斜坡率通常大于 烃化合物和惰性气体。 在另一方面,一种使等离子体感应的电荷损伤最小化的方法包括在将非晶碳膜沉积在基底上之前,在腔室的一个或多个内表面上沉积调味层,或者用氧化物或介电层涂覆内表面 在制造过程中。