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公开(公告)号:US20230051507A1
公开(公告)日:2023-02-16
申请号:US17444964
申请日:2021-08-12
IPC分类号: H01L23/367 , H01L23/552 , H01L23/00 , H01L23/42 , H01L23/31 , H01L23/04 , H01L23/373 , H01L21/56 , H01L21/52
摘要: A semiconductor device package includes a semiconductor die having two largest dimensions that define a major plane, a packaging material enclosing the semiconductor die, a plurality of contacts on a first exterior surface of the semiconductor device package that is parallel to the major plane, the first exterior surface defining a bottom of the semiconductor device package, and a pedestal of semiconductor material above the semiconductor die in a thermally-conductive, electrically non-conductive relationship with the semiconductor die. The semiconductor material of the pedestal may be doped to provide electromagnetic shielding of the semiconductor die.