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公开(公告)号：US20220416900A1
公开(公告)日：2022-12-29
申请号：US17857397
申请日：2022-07-05
IPC分类号： H04B10/40 , G02B6/42 , H01S5/02 , H01S5/0234
摘要： An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals. The receiver circuitry includes a photodetector configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals and a transimpedance amplifier device configured to receive the electrical signals and output the electrical signals from the silicon photonics substrate as electrical outputs.
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公开(公告)号：US11218242B2
公开(公告)日：2022-01-04
申请号：US16894597
申请日：2020-06-05
摘要： An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.
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公开(公告)号：US11388268B1
公开(公告)日：2022-07-12
申请号：US16777655
申请日：2020-01-30
IPC分类号： G06F13/12 , G06F13/38 , H04B10/278 , H04B10/80 , H04L1/00 , H04L69/10 , H04L69/12 , H04L69/16 , H04L69/18
摘要： A first processing unit for a computer server apparatus includes a first circuit configured to process a first type of data to be transmitted and received over a communication channel in accordance with a peripheral component interconnect express (PCIe) protocol, a second circuit configured to process a second type of data to be transmitted and received over the communication channel in accordance with a compute express link (CXL) protocol, and an optical communication interface configured to modulate the first type of data and the second type of data into a first signal in a PAM format to be transmitted over the communication channel to a second processing unit and receive, from the second processing unit over the communication channel, a second signal including either one of the first type of data and the second type of data modulated in the PAM format.
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公开(公告)号：US11341083B2
公开(公告)日：2022-05-24
申请号：US17088197
申请日：2020-11-03
IPC分类号： G06F15/78 , G06F13/42 , H04B10/80 , H04B10/40 , H04B10/556 , H04B10/54 , H04B10/516 , H04B10/69 , H04B14/02 , G02B6/12 , H04L27/00 , G06F13/364 , G06F13/40 , H04L1/00 , H04L25/03 , H04L5/14 , H04L27/02 , H04L27/18 , H04L27/34
摘要： The present invention includes an integrated system-on-chip device configured on a substrate member. The device has a data input/output interface provided on the substrate member and configured for a predefined data rate and protocol. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The input/output block comprises a SerDes block, a CDR block, a compensation block, and an equalizer block. The SerDes block is configured to convert a first data stream of N having a first predefined data rate at a first clock rate into a second data stream of M having a second predefined data rate at a second clock rate. The device has a driver module provided on the substrate member and coupled to a signal processing block, and a driver interface provided on the substrate member and coupled to the driver module and a silicon photonics device.
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公开(公告)号：US11329452B2
公开(公告)日：2022-05-10
申请号：US16818801
申请日：2020-03-13
IPC分类号： H01S3/10 , H01S5/0687 , H01S5/343 , H01S5/40 , H01S5/10 , H01S5/06 , H01S5/028 , H01S5/026 , H01S5/02 , H01S5/14 , H01S5/0234 , H01S5/02375 , H01S5/02326 , H01S5/065 , H01S5/0625
摘要： A tunable laser device based on silicon photonics includes a substrate configured with a patterned region comprising one or more vertical stoppers, an edge stopper facing a first direction, a first alignment feature structure formed in the patterned region along the first direction, and a bond pad disposed between the vertical stoppers. Additionally, the tunable laser includes an integrated coupler built in the substrate located at the edge stopper and a laser diode chip including a gain region covered by a P-type electrode and a second alignment feature structure formed beyond the P-type electrode. The laser diode chip is flipped to rest against the one or more vertical stoppers with the P-type electrode attached to the bond pad and the gain region coupled to the integrated coupler. Moreover, the tunable laser includes a tuning filter fabricated in the substrate and coupled via a wire waveguide to the integrated coupler.
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公开(公告)号：US11238428B1
公开(公告)日：2022-02-01
申请号：US15962906
申请日：2018-04-25
IPC分类号： G06Q20/22 , H04L9/08 , H03M13/01 , H04L9/06 , G06Q20/06 , G06Q20/38 , G06Q20/36 , H04B10/40 , H04B10/077 , G06N10/00
摘要： The present invention is directed to an optical module based on silicon photonics. The optical module provides a cyptocurrency wallet stored in a memory resource and includes an optical communication block with a direct-to-cloud interface for connecting to entities in a cloud infrastructure. The optical module further includes an application block to enable a cryptocurrency transaction via the direct-to-cloud interface. The optical module is configured to be an optical Quantum Key Generation Distribution device using a quantum key generation encryption protocol to encrypt a private key protected transaction in an encrypted transaction envelope. Furthermore, the optical module includes an external interface connecting the application block to a user/host via a physical layer to establish a secure link before executing a peer-to-peer transaction between entities in the cloud infrastructure.
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公开(公告)号：US11575245B2
公开(公告)日：2023-02-07
申请号：US16805526
申请日：2020-02-28
IPC分类号： G02F1/01 , H01S5/10 , H01S5/323 , H01S5/028 , H01S5/0234
摘要： A thin-film device for a wavelength-tunable semiconductor laser. The device includes a cavity between a high-reflectivity facet and an anti-reflection facet designed to emit a laser light of a wavelength in a tunable range determined by two Vernier-ring resonators with a joint-free-spectral-range between a first wavelength and a second wavelength. The device further includes a film including multiple pairs of a first layer and a second layer sequentially stacking to an outer side of the high-reflectivity facet. Each layer in each pair has one unit of respective optical thickness except one first or second layer in one pair having a larger optical thickness. The film is configured to produce inner reflectivity of the laser light from the high-reflectivity facet at least >90% for wavelengths in the tunable range starting from the first wavelength but at least
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公开(公告)号：US11483089B2
公开(公告)日：2022-10-25
申请号：US17168931
申请日：2021-02-05
摘要： An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.
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公开(公告)号：US11444429B2
公开(公告)日：2022-09-13
申请号：US17169037
申请日：2021-02-05
IPC分类号： H04B10/00 , H01S5/00 , H01S5/02 , H01S5/323 , H04B10/27 , H04B10/07 , G01R31/26 , G02B6/12 , H01S5/0234 , H01S5/12
摘要： A photonics device includes a silicon wafer including an upper surface region, a trench region, and a ridge structure. The ridge structure electrically isolates the upper surface region from the trench region. A laser diode chip flip-bonded onto the silicon wafer includes an electrode region bonded with the upper surface region, a gain region bonded with the trench region, and an isolation region bonded with the ridge structure. The isolation region electrically isolates the gain region from the electrode region. A conductor layer arranged between the silicon wafer and the laser diode chip includes a first section electrically connecting the gain region to a first electrode of the photonics device and a second section configured to electrically connect the electrode region to a second electrode of the photonics device. The first section is electrically isolated from the second section by the isolation region.
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公开(公告)号：US11355900B2
公开(公告)日：2022-06-07
申请号：US17115296
申请日：2020-12-08
IPC分类号： H01S5/06 , H04B10/50 , H01S5/024 , H01S5/00 , G02B6/42 , H01S5/0234 , H01S5/02251 , H01S5/02253 , H01S5/068 , H01S5/125 , H01S5/02325
摘要： A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
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