-
1.发明授权Deep trench capacitor in a SOI substrate having a laterally protruding buried strap 有权SOI衬底中的深沟槽电容器具有横向突出的埋入带公开(公告)号：US08198169B2
公开(公告)日：2012-06-12
申请号：US12974451
申请日：2010-12-21
IPC分类号： H01L21/425
CPC分类号： H01L29/66181 , H01L21/84 , H01L27/1087
摘要： A deep trench is formed to a depth midway into a buried insulator layer of a semiconductor-on-insulator (SOI) substrate. A top semiconductor layer is laterally recessed by an isotropic etch that is selective to the buried insulator layer. The deep trench is then etched below a bottom surface of the buried insulator layer. Ion implantation is performed at an angle into the deep trench to dope the sidewalls of the deep trench beneath the buried insulator layer, while the laterally recessed sidewalls of the top semiconductor layer are not implanted with dopant ions. A node dielectric and trench fill materials are deposited into the deep trench. A buried strap has an upper buried strap sidewall that is offset from a lower buried strap sidewall and a deep trench sidewall.
摘要翻译： 深沟槽形成在绝缘体上半导体（SOI）衬底的埋入绝缘体层的中间的深度处。 顶部半导体层通过对掩埋绝缘体层有选择性的各向同性蚀刻而横向凹陷。 然后将深沟槽蚀刻在掩埋绝缘体层的底表面下方。 离子注入以一定角度进入深沟槽以掺杂隐埋绝缘体层下面的深沟槽的侧壁，而顶部半导体层的侧向凹入的侧壁不注入掺杂离子。 节点电介质和沟槽填充材料沉积到深沟槽中。 掩埋带具有从下埋置带侧壁和深沟槽侧壁偏移的上掩埋带侧壁。
-
2.发明申请DEEP TRENCH CAPACITOR IN A SOI SUBSTRATE HAVING A LATERALLY PROTRUDING BURIED STRAP 有权在具有横向延伸的带状纹的SOI衬底中的深度TRENCH电容器公开(公告)号：US20110092043A1
公开(公告)日：2011-04-21
申请号：US12974451
申请日：2010-12-21
IPC分类号： H01L21/02
CPC分类号： H01L29/66181 , H01L21/84 , H01L27/1087
摘要： A deep trench is formed to a depth midway into a buried insulator layer of a semiconductor-on-insulator (SOI) substrate. A top semiconductor layer is laterally recessed by an isotropic etch that is selective to the buried insulator layer. The deep trench is then etched below a bottom surface of the buried insulator layer. Ion implantation is performed at an angle into the deep trench to dope the sidewalls of the deep trench beneath the buried insulator layer, while the laterally recessed sidewalls of the top semiconductor layer are not implanted with dopant ions. A node dielectric and trench fill materials are deposited into the deep trench. A buried strap has an upper buried strap sidewall that is offset from a lower buried strap sidewall and a deep trench sidewall.
摘要翻译： 深沟槽形成在绝缘体上半导体（SOI）衬底的埋入绝缘体层的中间的深度处。 顶部半导体层通过对掩埋绝缘体层有选择性的各向同性蚀刻而横向凹陷。 然后将深沟槽蚀刻在掩埋绝缘体层的底表面下方。 离子注入以一定角度进入深沟槽以掺杂隐埋绝缘体层下面的深沟槽的侧壁，而顶部半导体层的侧向凹入的侧壁不注入掺杂离子。 节点电介质和沟槽填充材料沉积到深沟槽中。 掩埋带具有从下埋置带侧壁和深沟槽侧壁偏移的上掩埋带侧壁。
-
3.发明申请DEEP TRENCH CAPACITOR IN A SOI SUBSTRATE HAVING A LATERALLY PROTRUDING BURIED STRAP 有权在具有横向延伸的带状纹的SOI衬底中的深度TRENCH电容器公开(公告)号：US20090184356A1
公开(公告)日：2009-07-23
申请号：US12016312
申请日：2008-01-18
CPC分类号： H01L29/66181 , H01L21/84 , H01L27/1087
摘要： A deep trench is formed to a depth midway into a buried insulator layer of a semiconductor-on-insulator (SOI) substrate. A top semiconductor layer is laterally recessed by an isotropic etch that is selective to the buried insulator layer. The deep trench is then etched below a bottom surface of the buried insulator layer. Ion implantation is performed at an angle into the deep trench to dope the sidewalls of the deep trench beneath the buried insulator layer, while the laterally recessed sidewalls of the top semiconductor layer are not implanted with dopant ions. A node dielectric and trench fill materials are deposited into the deep trench. A buried strap has an upper buried strap sidewall that is offset from a lower buried strap sidewall and a deep trench sidewall.
摘要翻译： 深沟槽形成在绝缘体上半导体（SOI）衬底的埋入绝缘体层的中间的深度处。 顶部半导体层通过对掩埋绝缘体层有选择性的各向同性蚀刻而横向凹陷。 然后将深沟槽蚀刻在掩埋绝缘体层的底表面下方。 离子注入以一定角度进入深沟槽以掺杂隐埋绝缘体层下面的深沟槽的侧壁，而顶部半导体层的侧向凹入的侧壁不注入掺杂离子。 节点电介质和沟槽填充材料沉积到深沟槽中。 掩埋带具有从下埋置带侧壁和深沟槽侧壁偏移的上掩埋带侧壁。
-
4.发明授权Deep trench capacitor in a SOI substrate having a laterally protruding buried strap 有权SOI衬底中的深沟槽电容器具有横向突出的埋入带公开(公告)号：US07888723B2
公开(公告)日：2011-02-15
申请号：US12016312
申请日：2008-01-18
IPC分类号： H01L29/94
CPC分类号： H01L29/66181 , H01L21/84 , H01L27/1087
摘要： A deep trench is formed to a depth midway into a buried insulator layer of a semiconductor-on-insulator (SOI) substrate. A top semiconductor layer is laterally recessed by an isotropic etch that is selective to the buried insulator layer. The deep trench is then etched below a bottom surface of the buried insulator layer. Ion implantation is performed at an angle into the deep trench to dope the sidewalls of the deep trench beneath the buried insulator layer, while the laterally recessed sidewalls of the top semiconductor layer are not implanted with dopant ions. A node dielectric and trench fill materials are deposited into the deep trench. A buried strap has an upper buried strap sidewall that is offset from a lower buried strap sidewall and a deep trench sidewall.
摘要翻译： 深沟槽形成在绝缘体上半导体（SOI）衬底的埋入绝缘体层的中间的深度处。 顶部半导体层通过对掩埋绝缘体层有选择性的各向同性蚀刻而横向凹陷。 然后将深沟槽蚀刻在掩埋绝缘体层的底表面下方。 离子注入以一定角度进入深沟槽以掺杂隐埋绝缘体层下面的深沟槽的侧壁，而顶部半导体层的侧向凹入的侧壁不注入掺杂离子。 节点电介质和沟槽填充材料沉积到深沟槽中。 掩埋带具有从下埋置带侧壁和深沟槽侧壁偏移的上掩埋带侧壁。
-
公开(公告)号：US20080064178A1
公开(公告)日：2008-03-13
申请号：US11470809
申请日：2006-09-07
申请人： Herbert L. Ho , Kangguo Cheng , Yoichi Otani , Kevin R. Winstel
发明人： Herbert L. Ho , Kangguo Cheng , Yoichi Otani , Kevin R. Winstel
IPC分类号： H01L21/20
CPC分类号： H01L29/66181 , H01L29/945
摘要： Methods of forming a deep trench capacitor through an SOI substrate, and a capacitor are disclosed. In one embodiment, a method includes forming a trench opening into the SOI substrate to the silicon substrate; depositing a sidewall spacer in the trench opening; etching to form the deep trench into the silicon substrate; forming a first electrode by implanting a dopant into the silicon substrate, whereby the sidewall spacer protects the BOX layer and the silicon layer; removing the sidewall spacer; depositing a node dielectric within the deep trench; and forming a second electrode by depositing a conductor in the deep trench. Implanting creates a substantially uniform depth doped region except at a portion adjacent to a lowermost portion of the deep trench, which may be substantially bulbous. The BOX layer is protected from undercutting by the sidewall spacer, and the implantation removes the need for out-diffusing dopant from silica glass.
摘要翻译： 公开了通过SOI衬底形成深沟槽电容器的方法和电容器。 在一个实施例中，一种方法包括在SOI衬底中形成到硅衬底的沟槽开口; 在沟槽开口中沉积侧壁间隔物; 蚀刻以形成深沟槽进入硅衬底; 通过将掺杂剂注入硅衬底中形成第一电极，由此侧壁间隔件保护BOX层和硅层; 去除侧壁间隔物; 在深沟槽内沉积节点电介质; 以及通过在所述深沟槽中沉积导体而形成第二电极。 植入可产生基本上均匀的深度掺杂区域，除了与深沟槽的最下部分相邻的部分，其可以是基本上是球状的。 保护BOX层免受侧壁间隔物的底切，并且注入消除了对来自石英玻璃的扩散掺杂剂的需要。
-
公开(公告)号：US07575970B2
公开(公告)日：2009-08-18
申请号：US11470809
申请日：2006-09-07
申请人： Herbert L. Ho , Kangguo Cheng , Yoichi Otani , Kevin R. Winstel
发明人： Herbert L. Ho , Kangguo Cheng , Yoichi Otani , Kevin R. Winstel
IPC分类号： H01L21/8242
CPC分类号： H01L29/66181 , H01L29/945
摘要： Methods of forming a deep trench capacitor through an SOI substrate, and a capacitor are disclosed. In one embodiment, a method includes forming a trench opening into the SOI substrate to the silicon substrate; depositing a sidewall spacer in the trench opening; etching to form the deep trench into the silicon substrate; forming a first electrode by implanting a dopant into the silicon substrate, whereby the sidewall spacer protects the BOX layer and the silicon layer; removing the sidewall spacer; depositing a node dielectric within the deep trench; and forming a second electrode by depositing a conductor in the deep trench. Implanting creates a substantially uniform depth doped region except at a portion adjacent to a lowermost portion of the deep trench, which may be substantially bulbous. The BOX layer is protected from undercutting by the sidewall spacer, and the implantation removes the need for out-diffusing dopant from silica glass.
摘要翻译： 公开了通过SOI衬底形成深沟槽电容器的方法和电容器。 在一个实施例中，一种方法包括在SOI衬底中形成到硅衬底的沟槽开口; 在沟槽开口中沉积侧壁间隔物; 蚀刻以形成深沟槽进入硅衬底; 通过将掺杂剂注入硅衬底中形成第一电极，由此侧壁间隔件保护BOX层和硅层; 去除侧壁间隔物; 在深沟槽内沉积节点电介质; 以及通过在所述深沟槽中沉积导体而形成第二电极。 植入可产生基本上均匀的深度掺杂区域，除了与深沟槽的最下部分相邻的部分，其可以是基本上是球状的。 保护BOX层免受侧壁间隔物的底切，并且注入消除了对来自石英玻璃的扩散掺杂剂的需要。
-
公开(公告)号：US07791124B2
公开(公告)日：2010-09-07
申请号：US12124186
申请日：2008-05-21
申请人： Kangguo Cheng , Herbert L. Ho , Paul C. Parries , Geng Wang
发明人： Kangguo Cheng , Herbert L. Ho , Paul C. Parries , Geng Wang
IPC分类号： H01L27/108
CPC分类号： H01L29/945 , H01L21/84 , H01L27/1087 , H01L27/1203 , H01L29/66181
摘要： A bottle shaped trench for an SOI capacitor is formed by a simple processing sequence. A non-conformal dielectric layer with an optional conformal dielectric diffusion barrier layer underneath is formed on sidewalls of a deep trench. Employing an isotropic etch, the non-conformal dielectric layer is removed from a bottom portion of the deep trench, leaving a dielectric spacer covering sidewalls of the buried insulator layer and the top semiconductor layer. The bottom portion of the deep trench is expanded to form a bottle shaped trench, and a buried plated is formed underneath the buried insulator layer. The dielectric spacer may be recessed during formation of a buried strap to form a graded thickness dielectric collar around the upper portion of an inner electrode. Alternately, the dielectric spacer may be removed prior to formation of a buried strap.
摘要翻译： 用于SOI电容器的瓶形沟槽通过简单的处理顺序形成。 在深沟槽的侧壁上形成具有可选的适形电介质扩散阻挡层的非保形介电层。 采用各向同性蚀刻，从深沟槽的底部去除非共形电介质层，留下覆盖掩埋绝缘体层和顶部半导体层的侧壁的电介质间隔物。 深沟槽的底部被膨胀以形成瓶形沟槽，并且在掩埋绝缘体层的下方形成埋入的电镀层。 在形成掩埋带的过程中，电介质间隔物可以是凹陷的，以形成围绕内电极的上部的分级厚度的介质环。 或者，可以在形成掩埋带之前去除电介质间隔物。
-
公开(公告)号：US07705386B2
公开(公告)日：2010-04-27
申请号：US11969989
申请日：2008-01-07
IPC分类号： H01L27/108 , H01L21/8244
CPC分类号： H01L27/1087 , H01L27/10891
摘要： A memory cell has an access transistor and a capacitor with an electrode disposed within a deep trench. STI oxide covers at least a portion of the electrode, and a liner covers a remaining portion of the electrode. The liner may be a layer of nitride over a layer of oxide. Some of the STI may cover a portion of the liner. In a memory array a pass wordline may be isolated from the electrode by the STI oxide and the liner.
摘要翻译： 存储单元具有存取晶体管和具有设置在深沟槽内的电极的电容器。 STI氧化物覆盖电极的至少一部分，衬垫覆盖电极的剩余部分。 衬垫可以是一层氧化物上的氮化物层。 一些STI可以覆盖衬垫的一部分。 在存储器阵列中，可以通过STI氧化物和衬垫从电极隔离通过字线。
-
公开(公告)号：US20090289291A1
公开(公告)日：2009-11-26
申请号：US12124186
申请日：2008-05-21
申请人： Kangguo Cheng , Herbert L. Ho , Paul C. Parries , Geng Wang
发明人： Kangguo Cheng , Herbert L. Ho , Paul C. Parries , Geng Wang
CPC分类号： H01L29/945 , H01L21/84 , H01L27/1087 , H01L27/1203 , H01L29/66181
摘要： A bottle shaped trench for an SOI capacitor is formed by a simple processing sequence. A non-conformal dielectric layer with an optional conformal dielectric diffusion barrier layer underneath is formed on sidewalls of a deep trench. Employing an isotropic etch, the non-conformal dielectric layer is removed from a bottom portion of the deep trench, leaving a dielectric spacer covering sidewalls of the buried insulator layer and the top semiconductor layer. The bottom portion of the deep trench is expanded to form a bottle shaped trench, and a buried plated is formed underneath the buried insulator layer. The dielectric spacer may be recessed during formation of a buried strap to form a graded thickness dielectric collar around the upper portion of an inner electrode. Alternately, the dielectric spacer may be removed prior to formation of a buried strap.
摘要翻译： 用于SOI电容器的瓶形沟槽通过简单的处理顺序形成。 在深沟槽的侧壁上形成具有可选的适形电介质扩散阻挡层的非保形介电层。 采用各向同性蚀刻，从深沟槽的底部去除非共形电介质层，留下覆盖掩埋绝缘体层和顶部半导体层的侧壁的电介质间隔物。 深沟槽的底部被膨胀以形成瓶形沟槽，并且在掩埋绝缘体层的下方形成埋入的电镀层。 在形成掩埋带的过程中，电介质间隔物可以是凹陷的，以形成围绕内电极的上部的分级厚度的介质环。 或者，可以在形成掩埋带之前去除电介质间隔物。
-
公开(公告)号：US20090173980A1
公开(公告)日：2009-07-09
申请号：US11969989
申请日：2008-01-07
IPC分类号： H01L21/8242 , H01L27/108
CPC分类号： H01L27/1087 , H01L27/10891
摘要： A memory cell has an access transistor and a capacitor with an electrode disposed within a deep trench. STI oxide covers at least a portion of the electrode, and a liner covers a remaining portion of the electrode. The liner may be a layer of nitride over a layer of oxide. Some of the STI may cover a portion of the liner. In a memory array a pass wordline may be isolated from the electrode by the STI oxide and the liner.
摘要翻译： 存储单元具有存取晶体管和具有设置在深沟槽内的电极的电容器。 STI氧化物覆盖电极的至少一部分，衬垫覆盖电极的剩余部分。 衬垫可以是一层氧化物上的氮化物层。 一些STI可以覆盖衬垫的一部分。 在存储器阵列中，可以通过STI氧化物和衬垫从电极隔离通过字线。
-
-
-
-
-
-
-
-
-
搜索结果
98 条记录 (耗时 0.036 秒)