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公开(公告)号:US20110228485A1
公开(公告)日:2011-09-22
申请号:US12960962
申请日:2010-12-06
申请人: Masahiko USUI , Takafumi ENAMI , Sho IKEDA , Shigeyasu TSUBAKI
发明人: Masahiko USUI , Takafumi ENAMI , Sho IKEDA , Shigeyasu TSUBAKI
IPC分类号: H05K7/20
CPC分类号: H05K7/20509 , H01L25/0655 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/13091
摘要: A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member.
摘要翻译: 电子设备的冷却结构包括在相同基板上的多个冷却结构件。 在冷却结构构件中,具有相同形状的多个加热构件通过第一导热构件连接到一个热扩散部分。 多个冷却结构构件的每个热扩散部分通过第二导热构件连接到一个散热器。