公开(公告)号：US20060180269A1

公开(公告)日：2006-08-17

申请号：US10550743

申请日：2004-03-31

申请人： Masahiro Karatsu ,  Shigekl Sato ,  Masaaki Kanasugi

发明人： Masahiro Karatsu ,  Shigekl Sato ,  Masaaki Kanasugi

IPC分类号： B32B37/02 ,  B32B37/12 ,  B32B38/10

CPC分类号： H01G4/30

摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.

摘要翻译： 本发明的目的是提供一种制造多层陶瓷电子部件的方法，其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元，从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤：将多个多层单元层压在该层叠单元上，所述多层单元通过在该支撑片上层叠剥离层，电极层和陶瓷生片 该方法还包括以下步骤：将多层单元定位在基底基板上，使得陶瓷生片的表面与形成在基底基板的表面上的凝集层接触， 其本身和支撑基底的高度大于支撑片和剥离层之间的结合强度，并且低于其本身与陶瓷生片之间的接合强度，将其压制并层压在基底上的多层单元。