公开(公告)号：US20100044100A1

公开(公告)日：2010-02-25

申请号：US12065042

申请日：2006-08-03

申请人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

发明人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

摘要： A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

摘要翻译： 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

公开(公告)号：US07969741B2

公开(公告)日：2011-06-28

申请号：US12065177

申请日：2006-02-20

申请人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

发明人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC分类号： H05K7/20

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

摘要翻译： 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

公开(公告)号：US20100020497A1

公开(公告)日：2010-01-28

申请号：US12065177

申请日：2006-02-20

申请人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

发明人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

摘要翻译： 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

公开(公告)号：US08604350B2

公开(公告)日：2013-12-10

申请号：US13143490

申请日：2011-02-22

申请人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

发明人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

IPC分类号： H05K1/09 ,  H05K1/11 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2203/0425

摘要： A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.

摘要翻译： 多层布线板包括绝缘树脂层，布置在其绝缘树脂层的相应相对表面上的布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括第一金属区域，其包括由用于连接布线的铜颗粒形成的接合单元，主要由例如锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第二金属区域和第三金属区域 主要由铋组成并与第二金属区域接触。 形成接合单元的铜粒子彼此平面接触以形成平面接触部分，并且第二金属区域至少部分地与第一金属区域接触。

公开(公告)号：US07752749B2

公开(公告)日：2010-07-13

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： 电子部件的电极端子和布线基板的连接端子之一预先设置有焊料，确保了布线基板和电子部件中的一个，使电极端子和连接端子彼此抵接 保持布线基板和电子部件中的任一个（取决于不固定的）。 电子部件被加热使得焊料熔化，并且焊料在保持电子部件的同时固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔融的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的XY面上的表面相对于彼此微细移动; 方向。

公开(公告)号：US07184617B2

公开(公告)日：2007-02-27

申请号：US11076068

申请日：2005-03-10

申请人： Tsuguhiro Korenaga ,  Kunio Hibino ,  Nobuki Itoh ,  Mikihiro Shimada ,  Yoshihiro Tomita ,  Yasushi Nakagiri ,  Satoru Tomekawa ,  Seiji Karashima

发明人： Tsuguhiro Korenaga ,  Kunio Hibino ,  Nobuki Itoh ,  Mikihiro Shimada ,  Yoshihiro Tomita ,  Yasushi Nakagiri ,  Satoru Tomekawa ,  Seiji Karashima

IPC分类号： G02B6/00 ,  G02B6/12

CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/3608 ,  G02B6/4214 ,  G02B6/4224 ,  H04M1/0214

摘要： A portable device has a configuration such that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device includes a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that their relative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

摘要翻译： 便携式设备具有这样的结构，使得多个壳体在功能上连接，其中壳体之间的连接部分的厚度减小，从而提高了便携性。 便携式设备包括：第一壳体; 设置在第一壳体中的第一板; 第二个住房; 设置在第二壳体中的第二板; 连接部，其以能够改变其相对位置的方式连接第一壳体与第二壳体; 以及具有至少一个光波导的光波导膜，用于通过光布线将第一板与第二板连接。

公开(公告)号：US07047629B2

公开(公告)日：2006-05-23

申请号：US10686576

申请日：2003-10-17

申请人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

发明人： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC分类号： H05K3/20

CPC分类号： H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

摘要： A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

摘要翻译： 一种电路板制造方法，包括以下步骤：在绝缘体层上形成通孔，然后用导电浆料填充所述通孔; 在导体箔的粘合表面上分散形成保护剂，以包括不存在保护剂的粘合表面区域; 将导体箔粘附到绝缘体层上; 并且通过加热和加压绝缘体层和导体箔，通过粘合表面区域将构成导电浆料和导体箔的多个导电粉末彼此邻接。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

公开(公告)号：US20080210458A1

公开(公告)日：2008-09-04

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/03

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate comprises: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US20070151756A1

公开(公告)日：2007-07-05

申请号：US11712943

申请日：2007-03-02

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/16

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.