公开(公告)号：US06673310B2

公开(公告)日：2004-01-06

申请号：US09749606

申请日：2000-12-28

申请人： Masahiro Tadauchi ,  Izuru Komatsu ,  Hiroshi Tateishi ,  Kouichi Teshima ,  Kazutaka Matsumoto ,  Tetsuji Hori

发明人： Masahiro Tadauchi ,  Izuru Komatsu ,  Hiroshi Tateishi ,  Kouichi Teshima ,  Kazutaka Matsumoto ,  Tetsuji Hori

IPC分类号： C22C1300

CPC分类号： B23K35/282 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/28 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K2101/36 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

摘要翻译： 公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。 锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％ 以下。 焊料用于生产电气或电子设备和设备。

公开(公告)号：US06949814B2

公开(公告)日：2005-09-27

申请号：US10252088

申请日：2002-09-23

申请人： Cao Minh Thai ,  Hiroshi Tateishi ,  Koichi Teshima ,  Masahiro Tadauchi ,  Izuru Komatsu ,  Tetsuji Hori

发明人： Cao Minh Thai ,  Hiroshi Tateishi ,  Koichi Teshima ,  Masahiro Tadauchi ,  Izuru Komatsu ,  Tetsuji Hori

IPC分类号： H01L21/52 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/83 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

摘要翻译： 一种半导体器件，包括：包括管芯焊盘和引线部分的框架; 半导体元件 电线，其包括连接到所述半导体元件的一端和连接到所述引线部分的另一端; 由焊料材料形成的至少一个第一接合部分，并且将所述管芯焊盘的上表面的一部分接合到所述半导体元件的下表面上的与所述管芯的上表面的一部分相对的部分 垫; 以及由热固性树脂形成的至少一个第二接合部分，并且将所述管芯焊盘的上表面的另一部分接合到位于所述半导体元件的下表面上并与所述半导体元件的所述上表面的另一部分相对的另一部分 芯片垫。

公开(公告)号：US20130062307A1

公开(公告)日：2013-03-14

申请号：US13230261

申请日：2011-09-12

申请人： Hisayoshi WATANABE ,  Hideyuki Yatsu ,  Takayuki Nishizawa ,  Masashi Sano ,  Hiromichi Umehara ,  Takayasu Kanaya ,  Tetsuji Hori

发明人： Hisayoshi WATANABE ,  Hideyuki Yatsu ,  Takayuki Nishizawa ,  Masashi Sano ,  Hiromichi Umehara ,  Takayasu Kanaya ,  Tetsuji Hori

IPC分类号： C23F1/04 ,  G11B5/31 ,  G03F7/20

CPC分类号： G11B5/3163

摘要： The present invention relates to a method of making a mask for patterning a thin film The method includes a step of forming an inorganic material, which is resolvable into alkali solution, on a substrate; a step of forming the inorganic material in a predetermined pattern; and a step of narrowing the inorganic material with the alkali solution to form the mask.

摘要翻译： 本发明涉及一种制备用于图案化薄膜的掩模的方法。该方法包括在基板上形成可分解成碱溶液的无机材料的步骤; 以预定图案形成无机材料的步骤; 以及用碱溶液使无机材料变窄以形成掩模的步骤。

公开(公告)号：US20090247060A1

公开(公告)日：2009-10-01

申请号：US12078438

申请日：2008-03-31

申请人： Hiroki Aritomo ,  Tetsuji Hori ,  Akira Miyasaka ,  Youji Hirao

发明人： Hiroki Aritomo ,  Tetsuji Hori ,  Akira Miyasaka ,  Youji Hirao

IPC分类号： B24B41/06

CPC分类号： B24B37/042 ,  B24B37/32

摘要： Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic substrate and one or more layers formed thereon, and having the surface to be polished. The polishing method uses a retainer ring made of a ceramic material containing AlTiC.

摘要翻译： 本发明公开了一种用于在使用由含有AlTiC的陶瓷材料制成的陶瓷基板的制造磁头的过程中通过CMP抛光用于磁头制造的结构的表面的抛光方法，包括陶瓷基板和一层或多层的结构 并且具有待抛光的表面。 抛光方法使用由含有AlTiC的陶瓷材料制成的保持环。

公开(公告)号：US20060084270A1

公开(公告)日：2006-04-20

申请号：US11251880

申请日：2005-10-18

申请人： Ai Hiramitsu ,  Takashi Ito ,  Tetsuji Hori

发明人： Ai Hiramitsu ,  Takashi Ito ,  Tetsuji Hori

IPC分类号： H01L21/302

CPC分类号： C09G1/02 ,  H01L21/31053

摘要： To provide a polishing composition whereby the stock removal rate of a silicon nitride layer is higher than the stock removal rate of a silicon oxide layer, there is substantially no adverse effect against polishing planarization, and a sufficient stock removal rate of a silicon nitride layer is obtainable, and a polishing method employing such a composition. A polishing composition which comprises silicon oxide abrasive grains, an acidic additive and water, wherein the acidic additive is such that when it is formed into a 85 wt % aqueous solution, the chemical etching rate of the silicon nitride layer is at most 0.1 nm/hr in an atmosphere of 80° C. Particularly preferred is one wherein the silicon oxide abrasive grains have an average particle size of from 1 to 50 nm, and the pH of the composition is from 3.5 to 6.5.

摘要翻译： 为了提供一种抛光组合物，其中氮化硅层的原料去除率高于氧化硅层的原料去除率，对抛光平面化基本上没有不利影响，并且氮化硅层的充分的除屑率为 以及使用这种组合物的抛光方法。 一种抛光组合物，其包含氧化硅磨粒，酸性添加剂和水，其中所述酸性添加剂使得当其形成为85重量％的水溶液时，所述氮化硅层的化学蚀刻速率为至多0.1nm / hr。特别优选的是其中氧化硅磨粒的平均粒度为1〜50nm，组合物的pH为3.5〜6.5。

公开(公告)号：USD475355S1

公开(公告)日：2003-06-03

申请号：US29167131

申请日：2002-09-10

申请人： Tetsuji Hori ,  Takayuki Yoshihira ,  Yuuji Hiyama ,  Gentaro Ookura

设计人： Tetsuji Hori ,  Takayuki Yoshihira ,  Yuuji Hiyama ,  Gentaro Ookura

公开(公告)号：US20130070364A1

公开(公告)日：2013-03-21

申请号：US13233092

申请日：2011-09-15

申请人： Yuji Matsuura ,  Atsushi Yamaguchi ,  Tetsuji Hori ,  Naoto Matono

发明人： Yuji Matsuura ,  Atsushi Yamaguchi ,  Tetsuji Hori ,  Naoto Matono

IPC分类号： G11B5/17 ,  G11B21/02 ,  G11B5/127 ,  G11B5/48

CPC分类号： G11B5/3123 ,  G11B5/1278 ,  G11B5/3163 ,  Y10T29/49032

摘要： A thin film magnetic head of the present invention is configured to include a main pole layer; a main pole direct junction magnetic layer that has an auxiliary pole layer and an auxiliary yoke layer, the main pole direct junction magnetic layer being directly joined to the main pole layer in a state where a recording gap layer is partially intervened near an air bearing surface (ABS) with respect to the main pole layer; and a first magnetic recording exciting coil that is buried between the auxiliary pole layer and the auxiliary yoke layer configuring the main magnetic direct junction magnetic layer with an insulating layer therebetween. Thereby, an effective magnetic path length can be shortened in order to improve the high-frequency characteristics, and furthermore, simplification of the manufacturing processes becomes possible.

摘要翻译： 本发明的薄膜磁头构造成包括主极层; 具有辅助极层和辅助磁轭层的主极直接结磁性层，在记录间隙层部分地插入到空气轴承表面的状态下，主极直接结磁性层直接接合到主极层 （ABS）相对于主极层; 以及第一磁记录励磁线圈，其被埋在辅助极层和构成主磁性直接结磁性层的辅助磁轭层之间，其间具有绝缘层。 由此，为了提高高频特性，可以缩短有效的磁路长度，进而可以简化制造工序。

公开(公告)号：US07699901B2

公开(公告)日：2010-04-20

申请号：US12081658

申请日：2008-04-18

申请人： Tetsuji Hori

发明人： Tetsuji Hori

IPC分类号： B24D3/02 ,  H01L21/302 ,  C03C15/00

CPC分类号： C09G1/02 ,  B24B37/044

摘要： An alumina-film-polishing composition is for use in chemical mechanical polishing of an object to be polished that includes an alumina film with an irregular surface, so as to planarize the irregular surface. The polishing composition contains an alumina abrasive grain, and a protection-film-forming agent for forming a protection film on the surface of each of the alumina film and the alumina abrasive grain. The protection-film-forming agent is a water-soluble polymer that has a weight average molecular weight within a range of 100 to 1,000,000 and that is obtained by polymerizing a monomer having at least one OH group or COOH group in its molecule.

摘要翻译： 氧化铝膜抛光组合物用于对具有不规则表面的氧化铝膜进行抛光的物体进行化学机械抛光，以平坦化不规则表面。 抛光组合物含有氧化铝磨粒和在每个氧化铝膜和氧化铝磨粒的表面上形成保护膜的保护膜形成剂。 保护膜形成剂是重均分子量在100〜1,000,000范围内的水溶性聚合物，其分子中具有至少一个OH基或COOH基的单体聚合而得到。

公开(公告)号：USD475982S1

公开(公告)日：2003-06-17

申请号：US29167095

申请日：2002-09-10

申请人： Tetsuji Hori ,  Takayuki Yoshihira ,  Yuuji Hiyama ,  Gentaro Ookura

设计人： Tetsuji Hori ,  Takayuki Yoshihira ,  Yuuji Hiyama ,  Gentaro Ookura

公开(公告)号：US06355075B1

公开(公告)日：2002-03-12

申请号：US09502336

申请日：2000-02-11

申请人： Katsuyoshi Ina ,  W. Scott Rader ,  David M. Shemo ,  Tetsuji Hori

发明人： Katsuyoshi Ina ,  W. Scott Rader ,  David M. Shemo ,  Tetsuji Hori

IPC分类号： C09K314

CPC分类号： C09G1/02

摘要： A polishing composition comprising an abrasive, an anticorrosive, an oxidizing agent, an acid, a pH regulator and water and having a pH within a range of from 2 to 5, wherein the abrasive is colloidal silica or fumed silica, and its primary particle size is at most 20 nm.

摘要翻译： 一种抛光组合物，其包含研磨剂，防腐蚀剂，氧化剂，酸，pH调节剂和水，并且pH在2至5的范围内，其中所述研磨剂是胶体二氧化硅或热解法二氧化硅，其初级粒度 至多为20nm。