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公开(公告)号：USRE38854E1
公开(公告)日：2005-10-25
申请号：US10142980
申请日：2002-05-13
CPC分类号： B24B37/042 , B24B37/30 , B24B49/16
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
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公开(公告)号：USRE38826E1
公开(公告)日：2005-10-11
申请号：US09589388
申请日：2000-06-08
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环，并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口，用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上，使得加压流体可以选择性地从相应区域中的开口排出。
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公开(公告)号：USRE39471E1
公开(公告)日：2007-01-16
申请号：US10976330
申请日：2004-10-29
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B37/30 , B24B49/16
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环，并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口，用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上，使得加压流体可以选择性地从相应区域中的开口排出。
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公开(公告)号：US5762539A
公开(公告)日：1998-06-09
申请号：US807463
申请日：1997-02-27
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有带有抛光表面的转台和用于保持工件的顶环，并且在第一次压制下将工件压靠在抛光表面上。 抛光装置具有用于供应加压流体的加压流体源和设置在顶环的保持表面中的多个开口，用于喷射从加压流体源供应的加压流体。 每个具有开口的多个区域被限定在保持表面上，使得加压流体可以选择性地从相应区域中的开口排出。
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公开(公告)号：US06350346B1
公开(公告)日：2002-02-26
申请号：US09288768
申请日：1999-04-09
IPC分类号： C23C1600
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的研磨布的转台和用于保持工件的顶环，并且在第一按压力下将工件压靠在研磨布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环垂直移动，并以可变的第二按压力压在研磨布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。
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公开(公告)号：US5916412A
公开(公告)日：1999-06-29
申请号：US728069
申请日：1996-10-09
IPC分类号： B24B37/30 , B24B37/32 , H01L21/306
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the abrasive cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and pressed against the abrasive cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.
摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的研磨布的转台和用于保持工件的顶环，并且在第一按压力下将工件压靠在研磨布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环垂直移动，并以可变的第二按压力压在研磨布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。
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公开(公告)号：US06709636B1
公开(公告)日：2004-03-23
申请号：US09180601
申请日：1998-11-10
IPC分类号： B01J818
CPC分类号： F23G5/027 , C10J3/482 , C10J3/503 , C10J3/523 , C10J3/54 , C10J3/56 , C10J3/66 , C10J2300/0956 , C10J2300/0959 , C10J2300/0993 , C10J2300/165 , C10J2300/1687 , F23C10/06 , F23C10/28 , F23C2206/103 , F23G5/16 , F23G5/30 , F23G5/50 , F23G2201/40 , F23G2202/104 , F23G2202/20 , F23G2203/30 , F23G2207/101 , Y02E20/16 , Y02P20/124
摘要： Combustibles such as wastes are gasified in a fluidized bed. A fluidized-bed furnace has a heat recovery region in addition to a combustion region. The temperature of a fluidized bed or the temperature of a freeboard is controlled so as to be kept at a predetermined value by adjusting the heat recovery rate in the heat recovery region.
摘要翻译： 可燃物如废物在流化床中气化。 除了燃烧区域之外，流化床炉具有热回收区域。 通过调节热回收区域的热回收率，控制流化床的温度或干舷的温度，以保持在预定值。
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