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    Multilayer wiring substrate and manufacturing method of multilayer wiring substrate
    3.
    发明授权
    Multilayer wiring substrate and manufacturing method of multilayer wiring substrate 失效
    多层布线基板及多层布线基板的制造方法

    公开(公告)号：US08604350B2

    公开(公告)日：2013-12-10

    申请号：US13143490

    申请日：2011-02-22

    申请人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

    发明人： Tsuyoshi Himori ,  Shogo Hirai ,  Hiroyuki Ishitomi ,  Satoru Tomekawa ,  Yutaka Nakayama

    IPC分类号： H05K1/09 ,  H05K1/11 ,  H01K3/10

    CPC分类号： H05K3/4069 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2203/0425

    摘要： A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.

    摘要翻译： 多层布线板包括绝缘树脂层，布置在其绝缘树脂层的相应相对表面上的布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括第一金属区域，其包括由用于连接布线的铜颗粒形成的接合单元，主要由例如锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第二金属区域和第三金属区域 主要由铋组成并与第二金属区域接触。 形成接合单元的铜粒子彼此平面接触以形成平面接触部分，并且第二金属区域至少部分地与第一金属区域接触。

    1, 3-benzothiazinone derivatives and use thereof
    5.
    发明申请
    1, 3-benzothiazinone derivatives and use thereof 有权
    1,3-苯并噻嗪酮衍生物及其用途

    公开(公告)号：US20050032786A1

    公开(公告)日：2005-02-10

    申请号：US10488384

    申请日：2002-09-02

    申请人： Masahiro Kajino ,  Akira Kawada ,  Yutaka Nakayama ,  Haruhide Kimura

    发明人： Masahiro Kajino ,  Akira Kawada ,  Yutaka Nakayama ,  Haruhide Kimura

    IPC分类号： A61K31/5415 ,  A61P1/00 ,  A61P9/00 ,  A61P9/08 ,  A61P9/10 ,  A61P13/12 ,  A61P17/00 ,  A61P19/00 ,  A61P19/02 ,  A61P25/00 ,  A61P31/00 ,  A61P43/00 ,  C07D417/04 ,  C07D417/14 ,  C07D279/16

    CPC分类号： C07D417/04 ,  A61K31/5415 ,  C07D417/14

    摘要： This invention provides a compound represented by the formula (I): wherein R1 is a hydrogen atom, a halogen atom, hydroxy, nitro, optionally halogenated alkyl, alkoxy optionally having substituents, acyl or amino optionally having substituents; R2 is pyridyl, furyl, thienyl, pyrrolyl, quinolyl, pyrazinyl, pyrimidinyl, pyridazinyl, indolyl, tetrahydroquinolyl or thiazolyl, each of which may have substituents; n is 1 or 2; or a salt. And this invention provides a safe pharmaceutical comprising the compound of the formula (I), which has an excellent apoptosis inhibitory effect and MIF binding effect, for preventing and/or treating heart disease, nervous degenerative disease, cerebrovascular disease, central nervous infectious disease, traumatorathy, demyelinating disease, bone and articular disease, kidney disease, liver disease, osteomyelodysplasia, AIDS, cancer, and the like.

    摘要翻译： 本发明提供由式（I）表示的化合物：其中R 1为氢原子，卤素原子，羟基，硝基，任选卤代烷基，任选具有取代基的烷氧基，任选具有取代基的酰基或氨基; R 2是吡啶基，呋喃基，噻吩基，吡咯基，喹啉基，吡嗪基，嘧啶基，哒嗪基，吲哚基，四氢喹啉基或噻唑基，其各自可以具有取代基; n为1或2; 或盐。 本发明提供一种安全药物，其包含具有优异的细胞凋亡抑制作用和MIF结合作用的式（I）化合物，用于预防和/或治疗心脏病，神经退行性疾病，脑血管病，中枢神经感染性疾病， 外伤，脱髓鞘疾病，骨和关节疾病，肾脏疾病，肝病，骨发育不良，艾滋病，癌症等。

    Oxygen sensor
    7.
    发明授权
    Oxygen sensor 失效
    氧传感器

    公开(公告)号：US4450065A

    公开(公告)日：1984-05-22

    申请号：US402071

    申请日：1982-07-26

    申请人： Tetsusyo Yamada ,  Yutaka Nakayama

    发明人： Tetsusyo Yamada ,  Yutaka Nakayama

    IPC分类号： G01N27/409 ,  F02D41/14 ,  G01N27/407 ,  G01N27/413 ,  G01N27/417 ,  G01N27/419 ,  G01N27/58

    CPC分类号： G01N27/417 ,  G01N27/4072

    摘要： The disclosed oxygen sensor has a plate-like oxygen pump element with electrodes, a plate-like oxygen concentration cell element with electrodes, and a means to couple the two elements in parallel to each other while forming a gap between those electrodes of the two elements which face with each other, so that the oxygen concentration cell element measures a ratio between oxygen concentration in said gap and oxygen concentration of a gas surrounding outside of the oxygen sensor, while said oxygen pump element causes diffusion of oxygen between said gap and the outside of the oxygen sensor.

    摘要翻译： 所公开的氧传感器具有带电极的板状氧泵元件，具有电极的板状氧浓度电池元件和用于将两个元件彼此平行地耦合的装置，同时在两个元件的这些电极之间形成间隙 所述氧浓度电池元件测量所述间隙中的氧浓度与氧传感器外部的气体的氧浓度之间的比例，同时所述氧气泵元件引起所述间隙和外部之间的氧的扩散 的氧传感器。

    WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
    8.
    发明申请
    WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE 审中-公开
    接线板，其生产方法，通过PASTE

    公开(公告)号：US20130068513A1

    公开(公告)日：2013-03-21

    申请号：US13700999

    申请日：2011-12-19

    申请人： Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

    发明人： Shogo Hirai ,  Tsuyoshi Himori ,  Hiroyuki Ishitomi ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

    IPC分类号： H01B1/02 ,  H05K3/10 ,  H05K1/09

    CPC分类号： H01B1/02 ,  H05K1/09 ,  H05K1/095 ,  H05K3/10 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49155

    摘要： Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.

    摘要翻译： 公开了一种具有通孔导体的多层布线板，该通孔导体包括金属部分和树脂部分。 金属部分包括第一金属区域，其包括形成电连接第一布线和第二布线的路径的铜颗粒的连接; 主要由选自锡，锡 - 铜合金和锡 - 铜金属间化合物的金属组成的第二金属区域; 主要由铋组成的第三金属区域; 以及由锡 - 铋焊料颗粒组成的第四金属区域。 该连接件具有平面至平面的接触部分，其中铜颗粒彼此面对面地接触。 第二金属区域的至少一部分与第一金属区域接触。 由树脂部分包围的锡 - 铋焊料颗粒散布在通孔导体中。

    Image forming apparatus including a blower member and a heating device
    9.
    发明授权
    Image forming apparatus including a blower member and a heating device 有权
    图像形成装置，包括鼓风机构件和加热装置

    公开(公告)号：US08396382B2

    公开(公告)日：2013-03-12

    申请号：US12905768

    申请日：2010-10-15

    申请人： Masahiro Mori ,  Yutaka Nakayama ,  Akio Fukuyama ,  Yousuke Hasegawa ,  Takeshi Yoneyama

    发明人： Masahiro Mori ,  Yutaka Nakayama ,  Akio Fukuyama ,  Yousuke Hasegawa ,  Takeshi Yoneyama

    IPC分类号： G03G15/00 ,  G03G21/20

    CPC分类号： G03G15/6573 ,  G03G2221/1645

    摘要： An image forming apparatus includes: a heating device that heats images that have been formed on a sheet-like recording medium to thereby fix the images to the recording medium; an ejection member that rotates in a forward direction and ejects to the outside the recording medium that has been conveyed from the heating device; a blower member that blows air onto the recording medium conveyed between the heating device and the ejection member; and a controller that controls the blower member such that the blower member operates when a recording page count where images are continuously formed on the recording medium is equal to or greater than a predetermined recording page count.

    摘要翻译： 图像形成装置包括：加热装置，其加热已经形成在片状记录介质上的图像，从而将图像固定到记录介质上; 排出构件，其向前旋转并向从加热装置输送的记录介质的外部排出; 吹送构件，其将空气吹送到在加热装置和排出构件之间输送的记录介质上; 以及控制器，其控制鼓风机构件，使得当在记录介质上连续形成图像的记录页计数等于或大于预定记录页数时，鼓风机构件工作。

    MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
    10.
    发明申请
    MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE 审中-公开
    多层接线板，其生产方法和通过浆料

    公开(公告)号：US20130008698A1

    公开(公告)日：2013-01-10

    申请号：US13636055

    申请日：2011-12-06

    申请人： Tsuyoshi Himori ,  Shogo Hirai ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

    发明人： Tsuyoshi Himori ,  Shogo Hirai ,  Takayuki Higuchi ,  Satoru Tomekawa ,  Yutaka Nakayama

    IPC分类号： H05K1/09 ,  B23K35/24 ,  H05K3/46

    CPC分类号： H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425

    摘要： A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi).

    摘要翻译： 一种多孔布线基板，其具有导通导体，该多孔布线基板以布线的方式电连接多个布线，使得绝缘树脂层位于布线之间，其中：所述通孔导体各自包括铜，锡和铋， 第一金属区域，包括铜颗粒彼此平面接触的连接部，所述连接部电连接布线，主要由锡，锡 - 铜合金和锡中的一种或多种构成的第二金属区域 - 金属间化合物和主要由铋组成的第三金属区域; 所述第二金属区域的至少一部分与所述铜粒子的表面接触，所述表面除了所述连接体的所述平面对接触部分的面积; 并且金属部分中的Cu，Sn和Bi具有比重（Cu：Sn：Bi）的组成。