公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/14

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00 ,  H01R43/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US07845954B2

公开(公告)日：2010-12-07

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US07896657B2

公开(公告)日：2011-03-01

申请号：US12442341

申请日：2006-09-22

申请人： Masahiro Ono ,  Hiroyuki Suzuki ,  Haruo Hayakawa ,  Iwao Matuura ,  Akihiro Miyashita

发明人： Masahiro Ono ,  Hiroyuki Suzuki ,  Haruo Hayakawa ,  Iwao Matuura ,  Akihiro Miyashita

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： H05K3/368 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018

摘要： A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.

摘要翻译： 提供可以以窄间距形成端子部分的电路装置，电路装置的制造方法和连接构件。 电路装置10包括：沿着基板12,16的厚度方向布置的第一印刷电路板11和第二印刷电路板15; 以及连接构件20，其插入在第一印刷电路板11和第二印刷电路板15之间。第一印刷电路板11和第二印刷电路板15通过形成在连接件上的端子部分21彼此电连接 电路装置10通过电镀在框体25上一体地形成端子部21。

公开(公告)号：US20090311884A1

公开(公告)日：2009-12-17

申请号：US12442341

申请日：2006-09-22

申请人： Masahiro Ono ,  Hiroyuki Suzuki ,  Haruo Hayakawa ,  Iwao Matuura ,  Akihiro Miyashita

发明人： Masahiro Ono ,  Hiroyuki Suzuki ,  Haruo Hayakawa ,  Iwao Matuura ,  Akihiro Miyashita

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018

摘要： A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device 10 includes: a first printed circuit board 11 and a second printed circuit board 15 which are arranged along the thickness direction of substrates 12, 16; and a connecting member 20 which is interposed between the first printed circuit board 11 and the second printed circuit board 15. The first printed circuit board 11 and the second printed circuit board 15 are electrically connected with each other by terminal portions 21 formed on the connecting member 20. The circuit device 10 integrally forms the terminal portions 21 on a frame body 25 by plating.

摘要翻译： 提供可以以窄间距形成端子部分的电路装置，电路装置的制造方法和连接构件。 电路装置10包括：沿着基板12,16的厚度方向布置的第一印刷电路板11和第二印刷电路板15; 以及连接构件20，其插入在第一印刷电路板11和第二印刷电路板15之间。第一印刷电路板11和第二印刷电路板15通过形成在连接件上的端子部分21彼此电连接 电路装置10通过电镀在框体25上一体地形成端子部21。

公开(公告)号：US20090309751A1

公开(公告)日：2009-12-17

申请号：US11813131

申请日：2006-03-08

申请人： Hidekazu Kano ,  Akinori Ohta ,  Iwao Matsuura ,  Akihiro Miyashita

发明人： Hidekazu Kano ,  Akinori Ohta ,  Iwao Matsuura ,  Akihiro Miyashita

IPC分类号： G08B5/22 ,  G06F13/42 ,  H04B1/20

CPC分类号： H04B13/005

摘要： An electronic device is provided which executes a function useful in that place without a user in possession of the electronic device being intentional, and which does not receive a signal without providing a special setting if the function is not useful even if the place and the device are the same. There are an electronic device A and an electronic device each having a human body communication function. In a case where a user is holding the electronic device A, the electronic device B outputs a control signal for causing the electronic device A to execute a function aimed to eliminate a danger or an annoyance to the surroundings occurring because of holding it, whereas, due to the fact that the user has the electronic device, the electronic device A receives the control signal irrespective of the user's intention and executes a function based on the control signal.

摘要翻译： 提供一种电子设备，其执行在该地方有用的功能，而没有用户拥有电子设备是有意的，并且如果该功能不起作用，则不接收信号而不提供特殊设置，即使该位置和设备 是相同的。 电子设备A和电子设备都具有人体通信功能。 在用户正在握持电子装置A的情况下，电子装置B输出用于使电子装置A执行旨在消除因保持环境而发生的对周围环境的危险或烦恼的功能的控制信号， 由于用户具有电子设备的事实，电子设备A接收控制信号，而与用户的意图无关，并且基于控制信号执行功能。

公开(公告)号：US20090126839A1

公开(公告)日：2009-05-21

申请号：US12095763

申请日：2005-12-09

申请人： Iwao Matsuura ,  Junichi Yasuno ,  Akihiro Miyashita ,  Koji Taniguchi ,  Akitoshi Mori ,  Saori Suzuki

发明人： Iwao Matsuura ,  Junichi Yasuno ,  Akihiro Miyashita ,  Koji Taniguchi ,  Akitoshi Mori ,  Saori Suzuki

IPC分类号： B65D85/00 ,  A61L9/04

CPC分类号： H04M1/21 ,  A61L9/12 ,  H04M1/0214

摘要： A folding type portable telephone in which a first housing and a second housing are fixed by a hinge includes a face panel fixed to the first housing and aromatic substances are accommodated inside the face panel. When the hinge is rotated, the aromatic substances are released in conjunction with the operation of opening the folding type portable telephone from the closed state. Furthermore, a sounding body is operated at a frequency of strongly generating an air vibration at a time defined in advance by timer control, so that fragrance of the aromatic substances is released outward by the air vibration of the sounding body. The fragrance corresponding to TPO can be generated from the face panel of the portable telephone.

摘要翻译： 一种折叠型便携式电话，其中第一壳体和第二壳体由铰链固定包括固定到第一壳体的面板，并且芳香物质容纳在面板内部。 当铰链旋转时，结合打开折叠式便携式电话机从关闭状态的操作释放芳香物质。 此外，发声体以通过定时器控制提前定义的时间强烈产生空气振动的频率操作，使得芳香物质的香味被发声体的空气振动向外释放。 可以从便携式电话的面板产生与TPO对应的香料。

公开(公告)号：US08223294B2

公开(公告)日：2012-07-17

申请号：US12810794

申请日：2008-09-30

申请人： Akihiro Miyashita ,  Hideki Kuga ,  Takahiro Naruse

发明人： Akihiro Miyashita ,  Hideki Kuga ,  Takahiro Naruse

IPC分类号： G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/133385 ,  G02F1/133605 ,  G02F2001/133317 ,  G02F2001/133334 ,  G02F2201/50 ,  H04M1/0266 ,  H05K1/147 ,  H05K1/18 ,  H05K2201/056 ,  H05K2201/10136

摘要： Disclosed is an electronic device which is formed thin while maintaining good display by a liquid crystal display unit. Specifically disclosed is an electronic device wherein a main substrate (130) mounted with an electronic component is so arranged as to face a reflecting sheet (126) which is formed on the back surface of a liquid crystal display unit (110). A flexible substrate (140) arranged between the liquid crystal display unit (110) and the main substrate (130) is connected to a surface (132) of the main substrate (130), which surface (132) is on the side of the reflecting sheet (126). A protective sheet (150) covering the reflecting sheet (126) is interposed between the flexible substrate (140) and the reflecting sheet (126).

摘要翻译： 公开了一种电子设备，其通过液晶显示单元保持良好的显示而形成为薄型。 具体公开了一种电子装置，其中安装有电子部件的主基板（130）被布置为面对形成在液晶显示单元（110）的背面上的反射片（126）。 布置在液晶显示单元（110）和主基板（130）之间的柔性基板（140）连接到主基板（130）的表面（132），该表面（132）位于主表面 反射片（126）。 覆盖反射片（126）的保护片（150）介于柔性基板（140）和反射片（126）之间。

公开(公告)号：US07806822B2

公开(公告)日：2010-10-05

申请号：US11582571

申请日：2006-10-17

申请人： Kensuke Miyake ,  Chieko Aizawa ,  Tsukasa Ishii ,  Hiroyuki Ushifusa ,  Akihiro Miyashita

发明人： Kensuke Miyake ,  Chieko Aizawa ,  Tsukasa Ishii ,  Hiroyuki Ushifusa ,  Akihiro Miyashita

IPC分类号： A61B1/00

CPC分类号： A61B1/04 ,  A61B1/00006 ,  A61B1/00039 ,  A61B90/30 ,  A61B90/36 ,  A61B2017/00017 ,  A61B2017/00199 ,  G06F19/00

摘要： A medical system control device comprises a first control unit for controlling at least a power supply to a plurality of devices configuring a medical system, a second control unit, the startup process time of which is longer than the first control unit, for controlling the entire medical system, and a storage unit for storing information at the time of an operation termination process for the medical system, which is performed by the second control unit. The first control unit controls a power supply to a predetermined device among the plurality of devices before the startup process of the second control unit is complete, according to the information stored in the storage unit in response to the power-on of the medical system.

摘要翻译： 医疗系统控制装置包括用于至少控制构成医疗系统的多个装置的电源的第一控制单元，其启动处理时间比第一控制单元长的第二控制单元，用于控制整个 医疗系统和用于存储由第二控制单元执行的用于医疗系统的操作终止处理时的信息的存储单元。 根据存储在存储单元中的信息，第一控制单元响应于医疗系统的通电，控制在第二控制单元的启动过程完成之前的多个设备中的预定设备的电力供应。