公开(公告)号：US20090282607A1

公开(公告)日：2009-11-19

申请号：US11794913

申请日：2006-02-08

申请人： Masatoshi Kaneda

发明人： Masatoshi Kaneda

IPC分类号： A43B17/00

CPC分类号： A41B11/02 ,  D04B1/108 ,  D04B1/26

摘要： The present invention provides a comfortable sock free from tightness in a sole portion. A sock is constructed so that a bottom extension portion 13 in which the number of courses on the side of a sole portion 8 is larger than that on the side of an instep portion 9 is formed between a toe portion 5 and a heel portion 3, and length in the longitudinal direction of the sole portion 8 is larger than that of the instep portion 9.

摘要翻译： 本发明提供一种在鞋底部分没有紧密性的舒适袜子。 袜子被构造成使得在脚趾部分5和脚后跟部分3之间形成底部延伸部分13，底部延伸部分13在底部部分8的侧面上的横列数量大于脚背部分9侧面上的横列数量， 并且鞋底部分8的纵向方向上的长度大于脚背部分9的长度。

公开(公告)号：US06368776B1

公开(公告)日：2002-04-09

申请号：US09270806

申请日：1999-03-17

申请人： Koji Harada ,  Junichi Nagata ,  Yasunori Kawakami ,  Masatoshi Kaneda ,  Norio Semba ,  Yoshio Kimura ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Nobuyuki Jinnai

发明人： Koji Harada ,  Junichi Nagata ,  Yasunori Kawakami ,  Masatoshi Kaneda ,  Norio Semba ,  Yoshio Kimura ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Nobuyuki Jinnai

IPC分类号： G03C500

CPC分类号： H01L21/67253 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67248

摘要： A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.

摘要翻译： 从气源供给的气体暴露在储存液体的槽内的液面以上的气氛中，然后通过气体供给通路和供给口在处理室内的晶片供给。 在晶片周围供给的气体均匀地从晶片周围朝向晶片的中心方向流动，之后从形成在处理室顶部的排气口排出。 同时，相对于晶片，通过加热机构进行热处理，进行规定的PEB。 将加湿气体供给到处理室，防止处理室内的干燥。 因此，抗蚀剂中的水不会被取出，导致可以在晶片上形成所需的抗蚀剂图案。

公开(公告)号：US6074154A

公开(公告)日：2000-06-13

申请号：US908056

申请日：1997-08-11

申请人： Issei Ueda ,  Masami Akimoto ,  Kazuhiko Ito ,  Mitiaki Matsushita ,  Masatoshi Kaneda ,  Yuji Matsuyama

发明人： Issei Ueda ,  Masami Akimoto ,  Kazuhiko Ito ,  Mitiaki Matsushita ,  Masatoshi Kaneda ,  Yuji Matsuyama

IPC分类号： B65G49/07 ,  G03F7/20 ,  H01L21/677

CPC分类号： G03F7/70691 ,  H01L21/67772 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/14

摘要： A substrate transfer system comprising a cassette table for mounting a cassette which has an opening portion for loading and unloading a substrate and a cover detachably provided to the opening portion, process portion for processing the substrate housed in a cassette on the cassette table, a transfer arm mechanism for taking out the substrate from the cassette table, transferring it to process units G1 to G5, and returning a processed substrate to the cassette on the cassette table, partition members provided between the transfer arm mechanism and the cassette table, for separating an atmosphere on the side of the transfer arm mechanism from that on the side of the cassette table, a passage formed in the partition member so as to face the opening portion of the cassette on the cassette table, for passing the substrate taken out from the cassette on the cassette table by the transfer arm mechanism and returning the substrate to the cassette on the cassette table, cassette moving mechanisms for moving the opening portion of the cassette on the cassette table closer to the passage or to be farther from the passage, and a cover removing mechanism for detaching the cover from the opening portion or attaching the cover to the opening portion of the cassette.

公开(公告)号：US07992318B2

公开(公告)日：2011-08-09

申请号：US12007975

申请日：2008-01-17

申请人： Tatsuya Kawaji ,  Yuichi Sakai ,  Masatoshi Kaneda

发明人： Tatsuya Kawaji ,  Yuichi Sakai ,  Masatoshi Kaneda

IPC分类号： F26B11/02

CPC分类号： H01L21/67109 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.

摘要翻译： 公开的用于加热其上涂覆有薄膜的基板的加热装置包括具有用于向处理室供应第一气体的气体供给开口的处理室和用于从处理室排出第一气体的排气开口; 加热板，其设置在所述处理室中并且包括用于加热所述基板的加热元件; 多个突起，布置在所述加热板上以支撑所述基板; 多个吸入孔，形成在加热板中，以便通过吸引衬底吸引加热板; 以及气体入口，其适于将第二气体供应到由所述多个突起支撑的所述加热板和所述基板之间的间隙。

公开(公告)号：US20080171131A1

公开(公告)日：2008-07-17

申请号：US12007892

申请日：2008-01-16

申请人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

发明人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

IPC分类号： B05C13/00 ,  C23C16/52 ,  B05C11/00 ,  B05D3/02

CPC分类号： G03F7/70708 ,  B05C11/00 ,  C23C14/541 ,  C23C16/00 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67288 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

摘要翻译： 公开的基板处理装置包括被配置为加热和/或冷却基板的热交换板; 设置在热交换板上的多个突起，以使基板放置在多个突起上，在基板和热交换板之间留有间隙; 吸入部，被配置为通过吸入所述热交换板中形成的多个孔而将所述基板吸引到所述多个突起上; 以及设置在所述热交换板上并且比所述多个突起低的分隔构件，其中所述分隔构件被构造成将所述间隙分成包括所述孔中的至少一个的两个或更多个区域，使得所述两个或 更多的区域被分隔构件二维关闭。

公开(公告)号：US20050258165A1

公开(公告)日：2005-11-24

申请号：US11134451

申请日：2005-05-23

申请人： Toshichika Takei ,  Masatoshi Kaneda

发明人： Toshichika Takei ,  Masatoshi Kaneda

IPC分类号： G03F1/68 ,  G03F1/82 ,  G05D23/22 ,  H01L21/00 ,  H01L21/027 ,  H01L21/68 ,  H01L21/683 ,  H05B3/00 ,  H05B3/02 ,  H05B3/10 ,  H05B3/74

CPC分类号： H01L21/67248 ,  G05D23/1935 ,  G05D23/22 ,  H01L21/67109

摘要： A heat treating apparatus is provided to apply a heat treatment on a substrate. Prior to the heat treatment, an exclusive transfer mechanism transfers the substrate from a cooling plate onto a heating plate for heating the substrate. Before mounting the substrate on the heating plate, the control mode for heater modules for heating the heating plate on power supply module is switched from a PID control by a regulating part in a controller of the apparatus to a MV control by a fixed-pattern output part in the controller. Next, at a predetermined timing since the substrate has been mounted on the heating plate, the MV control is switched to the PID control. Consequently, it becomes possible to quickly restore a reduce temperature of the heating plate prior to the mounting of substrate on the heating plate and also possible to quickly stabilize a so-raised temperature of the heating plate, accomplishing a heating process with high accuracy and shirt time. Accordingly, when it is required to perform a designated heat treatment on condition that a substrate is mounted on the heating plate whose temperature is stabilized to a processing temperature as a target, the heat treatment with high accuracy can be accomplished in a short time.

摘要翻译： 提供热处理装置以在基板上进行热处理。 在热处理之前，专用转印机构将基板从冷却板转移到用于加热基板的加热板上。 在将基板安装在加热板上之前，用于加热电源模块上的加热板的加热器模块的控制模式从设备的控制器中的调节部分的PID控制切换到通过固定模式输出的MV控制 部分在控制器。 接下来，由于将基板安装在加热板上的预定定时，MV控制切换到PID控制。 因此，可以在将基板安装在加热板上之前快速恢复加热板的降低温度，并且还可以快速地稳定加热板的升高的温度，以高精度完成加热处理和衬衫 时间。 因此，当要求将基板安装在温度稳定在加热温度的加热板作为目标的条件下进行指定的热处理时，可以在短时间内实现高精度的热处理。

公开(公告)号：US08776393B2

公开(公告)日：2014-07-15

申请号：US12923690

申请日：2010-10-05

申请人： Kouichi Mizunaga ,  Yasuhiro Kuga ,  Masatoshi Kaneda

发明人： Kouichi Mizunaga ,  Yasuhiro Kuga ,  Masatoshi Kaneda

IPC分类号： F26B7/00 ,  H05K7/20

CPC分类号： H01L21/67103 ,  H01L21/68735

摘要： A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.

摘要翻译： 基板冷却装置被构造为包括：安装台，其包括用于在其上安装基板的安装表面; 设置在所述安装表面上用于支撑所述基板的后表面的突起; 冷却剂流动路径，冷却剂流过所述冷却剂流动路径，设置在所述安装台中以冷却所述安装表面; 多个气体排出口，其沿圆周方向设置在所述安装面的周缘部，用于排出用于冷却所述基板的冷却气体; 气体吸入口，设置在所述安装面的中央部，用于吸入所述冷却气体; 以及设置在所述安装表面中的用于沿所述基板的圆周方向扩散所述冷却气体的槽。 如上所述构成的基板冷却装置能够以高均匀性来冷却安装在安装面上的基板。

公开(公告)号：US08748780B2

公开(公告)日：2014-06-10

申请号：US12007892

申请日：2008-01-16

申请人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

发明人： Shouken Moro ,  Yasuhiro Takaki ,  Masatoshi Kaneda

IPC分类号： B05C13/00 ,  C23C16/52 ,  B05C11/00 ,  B05D3/02 ,  H01L21/687 ,  G03F7/20 ,  C23C16/00 ,  H01L21/683

CPC分类号： G03F7/70708 ,  B05C11/00 ,  C23C14/541 ,  C23C16/00 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67288 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

摘要翻译： 公开的基板处理装置包括被配置为加热和/或冷却基板的热交换板; 设置在热交换板上的多个突起，以使基板放置在多个突起上，在基板和热交换板之间留有间隙; 吸入部，被配置为通过吸入所述热交换板中形成的多个孔而将所述基板吸引到所述多个突起上; 以及设置在所述热交换板上并且比所述多个突起低的分隔构件，其中所述分隔构件被构造成将所述间隙分成包括所述孔中的至少一个的两个或更多个区域，使得所述两个或 更多的区域被分隔构件二维关闭。

公开(公告)号：US20110302699A1

公开(公告)日：2011-12-15

申请号：US13157830

申请日：2011-06-10

申请人： Masatoshi Kaneda ,  Akinobu Iwaki ,  Atsushi Shiraishi

发明人： Masatoshi Kaneda ,  Akinobu Iwaki ,  Atsushi Shiraishi

IPC分类号： A43B17/00

CPC分类号： D04B1/26 ,  A41B11/008 ,  A41B2400/80 ,  D04B1/108

摘要： To provide a functional area partially within the toe area on the sole side of the sock. Providing a needle-lowering area 1a which is knit by needle-lowering knitting and a needle-raising area 2 which is knit by needle-raising knitting at a specified position within the toe area 4 on the sole side of sock S, these being aligned in the course direction, and providing a first functional area 1 in which the needle-lowering area 1a and/or the needle-raising area 2 is knit with a functional yarn which differs from the yarn used in knitting the other areas 11 within the toe area 4 on the sole side. A first functional member 1 can be provided within a specified portion of the toe area 4 on the sole side. If the first functional member 1 is knit with a functional yarn having high frictional resistance, it becomes possible to increase the gripping force only of that specified portion.

摘要翻译： 在袜子的唯一侧上部分地在脚趾区域内提供功能区域。 在袜子S的鞋底侧的脚趾区域4内的规定位置设置针织针织针下降区域1a和针织区域2，针织区域2通过针织编织而编织， 并且提供第一功能区域1，其中针头降低区域1a和/或针刺区域2与用于编织脚趾内的其他区域11所使用的纱线不同的功能纱线编织 区域4在唯一的一面。 第一功能构件1可以在脚趾侧的脚趾区域4的指定部分内设置。 如果第一功能构件1用具有高摩擦阻力的功能纱线编织，则可以仅增加该特定部分的夹持力。

公开(公告)号：US08277884B2

公开(公告)日：2012-10-02

申请号：US12569988

申请日：2009-09-30

申请人： Shinji Kobayashi ,  Tetsushi Miyamoto ,  Masahito Hamada ,  Masatoshi Kaneda

发明人： Shinji Kobayashi ,  Tetsushi Miyamoto ,  Masahito Hamada ,  Masatoshi Kaneda

IPC分类号： B05D3/12 ,  B05D1/40

CPC分类号： H01L21/68721 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715 ,  H01L21/68735 ,  H01L21/6875

摘要： There is provided a coating and processing apparatus including a spin chuck horizontally holding a quadrangular substrate and rotating the substrate in a horizontal plane, a coating solution nozzle for supplying a coating solution to a front surface of the substrate horizontally held by the spin chuck, and a solvent supply mechanism provided in the spin chuck for supplying a solvent to a back surface of the substrate, in which the solvent supplied to the back surface of the substrate is allowed to reach the back surface and side surface of each of corners of the substrate by centrifugal force, thereby removing the coating solution attached.

摘要翻译： 提供一种涂布处理装置，其包括水平保持四边形基板并旋转基板在水平面中的旋转卡盘，用于将涂布溶液供给到由旋转卡盘水平保持的基板的前表面的涂布溶液喷嘴，以及 溶剂供给机构，设置在旋转卡盘中，用于向基板的背面供给溶剂，其中供给到基板的背面的溶剂被允许到达基板的每个角部的背面和侧面 通过离心力，从而除去附着的涂布溶液。