摘要:
A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling.
摘要:
A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要:
A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要:
A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
摘要:
A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
摘要:
An electronic circuit includes: a first power line capable of supplying power; a second power line capable of supplying power independently from the first power line; a main circuit connected to the second power line; a detector that detects the supply of power from the first power line or the second power line; and a controller connected to the first power line and the second power line, wherein the controller controls a voltage or a current supplied from the first power line and supplies the voltage or the current to the main circuit when the detector detects supply of power from the first power line.
摘要:
There is provided an aging diagnostic device including: a reference ring oscillator (101) that constitutes a ring oscillator using an odd-numbered plurality of logic gates constituted using a CMOS circuit; a test ring oscillator (102) that constitutes a ring oscillator using an odd-numbered plurality of logic gates having the same configuration as that of the logic gate; a load unit (104) that inputs a load signal to the test ring oscillator (102); a control unit (105) that simultaneously inputs a control signal instructing a start of oscillation of the reference ring oscillator (101) and the test ring oscillator (102) to the reference ring oscillator (101) and the test ring oscillator (102); and a comparison unit (103) that compares differences in the amount of movement of pulses within the reference ring oscillator (101) and the test ring oscillator (102), respectively, in the same time.
摘要:
There is provided an aging diagnostic device including: a reference ring oscillator (101) that constitutes a ring oscillator using an odd-numbered plurality of logic gates constituted using a CMOS circuit; a test ring oscillator (102) that constitutes a ring oscillator using an odd-numbered plurality of logic gates having the same configuration as that of the logic gate; a load unit (104) that inputs a load signal to the test ring oscillator (102); a control unit (105) that simultaneously inputs a control signal instructing a start of oscillation of the reference ring oscillator (101) and the test ring oscillator (102) to the reference ring oscillator (101) and the test ring oscillator (102); and a comparison unit (103) that compares differences in the amount of movement of pulses within the reference ring oscillator (101) and the test ring oscillator (102), respectively, in the same time.
摘要:
[PROBLEMS] To provide, for example, a pulse input type power amplifying apparatus that can be operated at low voltage and low power, effectively suppressing generation of harmonic component.[MEANS FOR SOLVING THE PROBLEMS] The amplifying apparatus includes at least two amplification circuits, one and other amplification circuits, composed of multiple amplifiers whose output sides are connected to each other, driven at the same frequency. The multiple amplifiers forming the one amplification circuit are configured with a first inverting amplifier M12 inputting and amplifying a reference pulse, and a second inverting amplifier M11 to which an inverted pulse formed by shifting and inverting the phase of the reference pulse is inputted. The other amplification circuit is configured with the first inverting amplifier M14 and the second inverting amplifier M13 to each of which other wide pulse with a width greater than that of the reference pulse is commonly inputted.
摘要:
An interpolated signal generating circuit (101) generates interpolated signals (SIG1-SIGN) of two consecutive discrete signals (SIG). N measuring circuits (501) measure interpolated signals. Since the interpolated signals are measurement targets, N-times oversampling measurement can also be performed for the discrete signals. With the oversampling measurement, the frequency spectra of the signal components of the discrete signals are maintained, and only the frequency spectrum of a noise component due to a quantization error increases to a high-frequency band, thereby reducing a noise component per unit frequency. Therefore, removing a high-frequency component from a measurement result from each measuring circuit using a low-pass filter (502) makes it possible to improve the signal-to-noise ratio of the measurement result as compared with a case in which no oversampling is performed.