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公开(公告)号：US20070272124A1
公开(公告)日：2007-11-29
申请号：US10584398
申请日：2004-12-27
申请人： Masayuki Tsutsumi , Satoshi Maeda , Keizo Kawahara , Takefumi Yoshida , Kazutake Okamoto , Morio Morino , Shoichi Uemura , Akinobu Nagara , Noriko Takahashi , Hiroko Oyama , Shunji Kurahara , Jun Yasui
发明人： Masayuki Tsutsumi , Satoshi Maeda , Keizo Kawahara , Takefumi Yoshida , Kazutake Okamoto , Morio Morino , Shoichi Uemura , Akinobu Nagara , Noriko Takahashi , Hiroko Oyama , Shunji Kurahara , Jun Yasui
CPC分类号： C08J5/18 , C08J2379/08 , H05K1/0346
摘要： This polyimide film is superior in heat resistance, rigidity and high frequency properties, is free of inconveniences due to curling even when various functional layers are laminated by heating, and is preferable as a substrate film superior in thermal degradation stability for electronic parts. This polyimide film has a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.
摘要翻译： 该聚酰亚胺膜的耐热性，刚性和高频特性优异，即使通过加热层压各种功能层也不会发生卷曲的不便，优选作为电子部件的热劣化稳定性优异的基板膜。 该聚酰亚胺膜通过X射线衍射法测得的平面取向系数为0.79-0.89，其一个表面与另一个表面之间的表面平面取向度之差不大于2，卷曲度不为 大于5％，其通过酰亚胺化具有特定酰亚胺化速率的聚酰亚胺前体膜获得。
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公开(公告)号：US08314203B2
公开(公告)日：2012-11-20
申请号：US10584398
申请日：2004-12-27
申请人： Masayuki Tsutsumi , Satoshi Maeda , Keizo Kawahara , Takefumi Yoshida , Kazutake Okamoto , Morio Morino , Shoichi Uemura , Akinobu Nagara , Noriko Takahashi , Hiroko Oyama , Shunji Kurahara , Jun Yasui
发明人： Masayuki Tsutsumi , Satoshi Maeda , Keizo Kawahara , Takefumi Yoshida , Kazutake Okamoto , Morio Morino , Shoichi Uemura , Akinobu Nagara , Noriko Takahashi , Hiroko Oyama , Shunji Kurahara , Jun Yasui
IPC分类号： C08G69/08
CPC分类号： C08J5/18 , C08J2379/08 , H05K1/0346
摘要： This polyimide film is superior in heat resistance, rigidity and high frequency properties, is free of inconveniences due to curling even when various functional layers are laminated by heating, and is preferable as a substrate film superior in thermal degradation stability for electronic parts. This polyimide film has a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.
摘要翻译： 该聚酰亚胺膜的耐热性，刚性和高频特性优异，即使通过加热层压各种功能层也不会发生卷曲的不便，优选作为电子部件的热劣化稳定性优异的基板膜。 该聚酰亚胺膜通过X射线衍射法测得的平面取向系数为0.79-0.89，其一个表面与另一个表面之间的表面平面取向度之差不大于2，卷曲度不为 大于5％，其通过酰亚胺化具有特定酰亚胺化速率的聚酰亚胺前体膜获得。
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公开(公告)号：US20090056995A1
公开(公告)日：2009-03-05
申请号：US11912105
申请日：2005-07-01
CPC分类号： H05K3/4626 , B32B15/08 , H05K3/386 , H05K2201/0154 , H05K2201/0195 , Y10T428/24628 , Y10T428/31678
摘要： The adhesive sheet contains a substrate film and an adhesive layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. The adhesive sheet of the present invention can be used for electronic parts and the like exposed to high temperature particularly because warpage and distortion thereof caused by a high temperature treatment are suppressed, and can improve quality and yield of electronic parts and the like.
摘要翻译： 粘合片含有基材膜和至少在基材膜的一个表面上形成的粘合剂层。 基材膜由聚酰亚胺膜制成，其在300℃下热处理后的卷曲度不大于10％。 本发明的粘合片可以用于暴露于高温的电子部件等，特别是因为抑制了由高温处理引起的翘曲和变形，并且可以提高电子部件等的质量和产量。
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4.发明申请公开(公告)号：US20090056981A1
公开(公告)日：2009-03-05
申请号：US11911947
申请日：2005-07-01
CPC分类号： H05K1/0346 , H05K3/181 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2201/0326 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.
摘要翻译： 薄膜层叠聚酰亚胺膜含有基材膜和在基材膜的至少一个表面上形成的薄膜层。 基材膜由聚酰亚胺膜制成，其在300℃下热处理后的卷曲度不大于10％。 使用这种薄膜叠层聚酰亚胺薄膜作为暴露于高温的太阳能电池，电容器等电子部件的基板，防止了生产过程中的翘曲和变形的容易发展，并且可以提高电子部件的质量和产量。
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公开(公告)号：US20070293588A1
公开(公告)日：2007-12-20
申请号：US10583147
申请日：2004-12-14
IPC分类号： B01F3/12
摘要： A curable resin composition that forms a continuous phase and a dispersoid at normal temperatures, wherein the continuous phase is a liquid at normal temperatures and comprises (a) an epoxy compound having two or more epoxy groups in a molecule, and the dispersoid comprises (b) a compound present as solid particles in a continuous phase at normal temperatures and having two or more amino groups in a molecule (preferably, an aromatic amine compound having a benzoxazole structure). The present invention provides a one-component epoxy curable composition superior in the preservation stability and showing good properties of the cured product.
摘要翻译： 在常温下形成连续相和分散质的可固化树脂组合物，其中连续相在常温下为液体，并且包含（a）分子中具有两个或更多个环氧基的环氧化合物，分散体包含（b ）在常温下在连续相中作为固体颗粒存在的化合物，并且在分子中具有两个或更多个氨基（优选具有苯并恶唑结构的芳族胺化合物）。 本发明提供了保存稳定性优异且显示出良好的固化物性能的单组分环氧固化组合物。
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