公开(公告)号：US07029542B2

公开(公告)日：2006-04-18

申请号：US10614351

申请日：2003-07-08

申请人： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

发明人： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

IPC分类号： C22C13/00 ,  B23K35/26

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K2101/42

摘要： A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.

摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。

公开(公告)号：US20050036902A1

公开(公告)日：2005-02-17

申请号：US10614351

申请日：2003-07-08

申请人： Masazumi Amagai ,  Masako Watanabe ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

发明人： Masazumi Amagai ,  Masako Watanabe ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

IPC分类号： B23K35/02 ,  B23K35/26 ,  C22C13/00

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K2101/42

摘要： A lead-free solder alloy comprises 1.0-5.0 wt % Ag, 0.01-0.5 wt % Ni, one or both of (a) 0.001-0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001-0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.

摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。

公开(公告)号：US07282175B2

公开(公告)日：2007-10-16

申请号：US10824647

申请日：2004-04-15

申请人： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Takeshi Tashima ,  Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada

发明人： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Takeshi Tashima ,  Daisuke Souma ,  Takahiro Roppongi ,  Hiroshi Okada

IPC分类号： C22C13/02

CPC分类号： B23K35/262 ,  B23K2101/36

摘要： A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.

摘要翻译： 无铅焊料包括0.05-5质量％的Ag，0.01-0.5质量％的Cu，至少一种P，Ge，Ga，Al和Si，总量为0.001-0.05质量％，余量为 的Sn。 可以添加用于提高耐热循环性的过渡元素中的一种或多种，​​诸如Bi，In或Zn的熔点降低元素，以及用于改善抗冲击性的元素如Sb。

公开(公告)号：US20070243098A1

公开(公告)日：2007-10-18

申请号：US11578827

申请日：2004-07-29

申请人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

发明人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

IPC分类号： C22C13/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00

摘要： [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.

摘要翻译： [问题]移动电子设备在使用或运输过程中经常掉落，电子部件的焊接接头在掉线时有时会因为冲击而脱落。 此外，它们经历热循环，其中内部线圈，电阻器等产生热量和焊接接头在电子设备操作期间温度升高，并在不使用期间冷却。 使用常规的Sn-Ag基底无铅焊料，耐冲击性和耐冲击等微小部分的热循环不足。 本发明提供一种无铅焊料合金，其具有优异的耐冲击性和耐热循环性。 解决问题的手段本发明是一种无铅焊料合金，其包含0.1质量％以下的Ag，0.01质量％以下的Cu，0.01〜0.1质量％的Cu，0.005〜0.1质量％的Zn和余量的Sn， 可以添加Ga，Ge或P，并且可以进一步添加Ni或Co。

公开(公告)号：US20120220080A1

公开(公告)日：2012-08-30

申请号：US13466449

申请日：2012-05-08

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L21/78

CPC分类号： A61B17/1757 ,  A61B17/1671 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/2908 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A semiconductor device, which comprises a workpiece with an outline and a plurality of contact pads and further an external part with a plurality of terminal pads. This part is spaced from the workpiece and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element interconnects each of the contact pads with its respective terminal pad. Thermoplastic material fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline substantially in line with the outline of the workpiece, and fills the space substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件，其包括具有轮廓的工件和多个接触焊盘，并且还包括具有多个端子焊盘的外部部件。 该部分与工件间隔开，并且端子焊盘分别与工件接触焊盘对准。 回流元件将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，该材料具有与工件的轮廓基本一致的轮廓，并且基本上没有空隙填充空间。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。

公开(公告)号：US20100025837A1

公开(公告)日：2010-02-04

申请号：US12446827

申请日：2007-10-22

申请人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

发明人： Tomonori Shinoda ,  Hironori Shizuhata ,  Hirofumi Shinoda ,  Yuji Kawamata ,  Takeshi Tashima ,  Masato Shimamura ,  Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L25/065 ,  H01L23/522 ,  H01L21/70

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: an upper semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on a lower surface in the upper semiconductor package and a principal part of the upper semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively upper part, a lower semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on an upper surface in the lower semiconductor package and a principal part of the lower semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively lower part, a spacer sheet which comprises a space part corresponding to the principal part of the upper semiconductor package and/or the principal part of the lower semiconductor package disposed between the adjacent upper and lower substrates and through holes disposed in a periphery of the above space part and allowing the electrodes oppositely disposed between the substrates to be communicated with each other and which is adhered onto the above substrates and inserted therebetween, connection terminals which are provided in an inside of the through holes in the spacer sheet and which are used for conducting the substrates and connection terminals for external connection which are formed on a lower surface of a substrate for wiring and connecting in a semiconductor package located in a lowermost part and to a production process for the same. The present invention provides a wiring and connecting method by a spacer sheet which ensures an installation space between an upper semiconductor package and a lower semiconductor package in a POP type semiconductor package and prevents short circuit between adjacent connection terminals and which can certainly wire and connect both semiconductor packages, and a complex type semiconductor device of a POP type having a high packaging density prepared is provided by the above method.

公开(公告)号：US08598029B2

公开(公告)日：2013-12-03

申请号：US13466449

申请日：2012-05-08

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L21/44

CPC分类号： A61B17/1757 ,  A61B17/1671 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/2908 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A semiconductor device, which comprises a workpiece with an outline and a plurality of contact pads and further an external part with a plurality of terminal pads. This part is spaced from the workpiece and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element interconnects each of the contact pads with its respective terminal pad. Thermoplastic material fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline substantially in line with the outline of the workpiece, and fills the space substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件，其包括具有轮廓的工件和多个接触焊盘，并且还包括具有多个端子焊盘的外部部件。 该部分与工件间隔开，并且端子焊盘分别与工件接触焊盘对准。 回流元件将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，该材料具有与工件的轮廓基本一致的轮廓，并且基本上没有空隙填充空间。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。

公开(公告)号：US20080157353A1

公开(公告)日：2008-07-03

申请号：US11618417

申请日：2006-12-29

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/11334 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/83194 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0379 ,  H05K2201/10424 ,  H05K2203/0191 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic device package interconnect for electrically connecting a plurality of substrates is provided. The microelectronic device package interconnect comprises an insulative layer positioned on a substrate, wherein the insulative layer has an opening extending through the insulative layer to the substrate. The microelectronic device package interconnect further comprises solder positioned in the opening.

摘要翻译： 提供了用于电连接多个基板的微电子器件封装互连。 微电子器件封装互连件包括位于衬底上的绝缘层，其中绝缘层具有延伸穿过绝缘层到衬底的开口。 微电子器件封装互连件还包括位于开口中的焊料。

公开(公告)号：US20070170599A1

公开(公告)日：2007-07-26

申请号：US11337985

申请日：2006-01-24

申请人： Masazumi Amagai ,  Masako Watanabe

发明人： Masazumi Amagai ,  Masako Watanabe

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/11334 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0191 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A polymeric adhesive film (102, 104) and a foil (103, 105) of different, preferably inert, material are attached to the base sheet on both the first and second surface sides; they thus provide a thickness (120) to the tape. A plurality of holes is formed through the thickness of the tape; the holes are preferably tapered with an angle between about 70° and 80° with the second tape surface. A reflow metal element (301), with a preferred diameter (302) about equal to the tape thickness, is held in each of the holes.

摘要翻译： 用作半导体组件中的载体的胶带，其具有一个或多个具有第一（101a）和第二（101b）表面的聚合物，优选热塑性材料的基片101。 不同的，优选惰性的材料的聚合物粘合膜（102,104）和箔（103,105）在第一和第二表面侧上附着到基片上; 因此它们为带提供厚度（120）。 通过带的厚度形成多个孔; 这些孔优选地与第二带表面以约70°和80°之间的角度渐缩。 具有大约等于带厚度的优选直径（302）的回流金属元件（301）被保持在每个孔中。

公开(公告)号：US20060214314A1

公开(公告)日：2006-09-28

申请号：US11090104

申请日：2005-03-24

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/29

CPC分类号： H05K3/3478 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件（1700），其包括具有轮廓（1711）的工件（1201）和多个接触焊盘（1205）以及具有多个端子焊盘（1702）的外部部分（1701）。 该部件与工件间隔开，端子焊盘分别对准工件接触焊盘。 回流元件（1203）将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料（1204）填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，材料具有基本上与工件的轮廓一致的轮廓（1711），并且基本上没有空隙填充空间（1707）。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。