-
公开(公告)号：US07029542B2
公开(公告)日：2006-04-18
申请号：US10614351
申请日：2003-07-08
申请人： Masazumi Amagai , Masako Watanabe , Kensho Murata , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
发明人： Masazumi Amagai , Masako Watanabe , Kensho Murata , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
CPC分类号： B23K35/262 , B23K35/0244 , B23K2101/42
摘要： A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.
摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。
-
公开(公告)号：US20050036902A1
公开(公告)日：2005-02-17
申请号：US10614351
申请日：2003-07-08
申请人： Masazumi Amagai , Masako Watanabe , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
发明人： Masazumi Amagai , Masako Watanabe , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
CPC分类号： B23K35/262 , B23K35/0244 , B23K2101/42
摘要： A lead-free solder alloy comprises 1.0-5.0 wt % Ag, 0.01-0.5 wt % Ni, one or both of (a) 0.001-0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001-0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.
摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。
-
公开(公告)号：US07682468B2
公开(公告)日：2010-03-23
申请号：US11889356
申请日：2007-08-10
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。
-
公开(公告)号：US07338567B2
公开(公告)日：2008-03-04
申请号：US10666129
申请日：2003-09-22
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
-
公开(公告)号：US08216395B2
公开(公告)日：2012-07-10
申请号：US12659815
申请日：2010-03-22
IPC分类号： C22C13/00
CPC分类号： B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/22 , B23K35/262 , B23K2101/42 , C22C13/00 , Y10T428/12708
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。
-
公开(公告)号：US20100297470A1
公开(公告)日：2010-11-25
申请号：US12659815
申请日：2010-03-22
CPC分类号： B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/22 , B23K35/262 , B23K2101/42 , C22C13/00 , Y10T428/12708
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。
-
公开(公告)号：US20080061117A1
公开(公告)日：2008-03-13
申请号：US11889356
申请日：2007-08-10
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。
-
8.发明授权公开(公告)号：US07628308B2
公开(公告)日：2009-12-08
申请号：US10500802
申请日：2003-01-08
申请人： Masayuki Ojima , Haruo Suzuki , Hirofumi Nogami , Norihisa Eguchi , Osamu Munekata , Minoru Ueshima
发明人： Masayuki Ojima , Haruo Suzuki , Hirofumi Nogami , Norihisa Eguchi , Osamu Munekata , Minoru Ueshima
CPC分类号： B23K3/0646 , B23K1/08 , B23K35/262 , B23K2101/42 , H05K3/3463 , H05K3/3468
摘要： The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.
摘要翻译： 在焊接操作期间测量焊料浴中的氧化抑制元素的降低速率。 然后在焊接期间进行焊接，同时在焊接期间补充焊料浴，以便通过补充焊料合金来保持熔融焊料的表面水平，该补充焊料合金以至少以下的速率将氧化抑制元素供应到焊料槽 氧化抑制元件在焊接时被消耗。 当氧化抑制元素为P时，补充焊料合金中的P浓度优选为60〜100ppm。
-
公开(公告)号：US20060011709A1
公开(公告)日：2006-01-19
申请号：US10500802
申请日：2003-01-08
申请人： Masayuki Ojima , Haruo Suzuki , Hirofumi Nogami , Norihisa Equchi , Osamu Munekata , Minoru Ueshima
发明人： Masayuki Ojima , Haruo Suzuki , Hirofumi Nogami , Norihisa Equchi , Osamu Munekata , Minoru Ueshima
IPC分类号： B23K35/14
CPC分类号： B23K3/0646 , B23K1/08 , B23K35/262 , B23K2101/42 , H05K3/3463 , H05K3/3468
摘要： In this invention, the rate of decrease of an oxidation suppressing element in a solder bath during use is measured, and a solder alloy including the oxidation suppressing element in the same or greater proportion than the rate of decrease in the amount is suitably added in accordance with the decrease in the solder bath. As a simple method, in flow soldering of an Sn—Ag based or Sn—Ag—Cu based solder alloy, to compensate for a decrease in the P content of the solder bath which is observed during operation, a solder alloy containing 60-100 ppm by mass of P in an Sn—Ag based or Sn—Ag—Cu based solder alloy for replenishing a solder bath is supplied to maintain not only the P content but also the surface level of molder solder bath.
摘要翻译： 在本发明中，测定使用时的焊料槽中的氧化抑制元素的降低率，并且按照与该量的减少量相同或更大的比例包含氧化抑制元素的焊料合金， 随着焊锡槽的减少。 作为简单的方法，在Sn-Ag系或Sn-Ag-Cu类焊料合金的流焊中，为了补偿在操作中观察到的焊料槽的P含量的降低，含有60-100 提供用于补充焊料槽的Sn-Ag系或Sn-Ag-Cu系焊料合金中的P质量ppm，不仅保持了P含量，而且还保持了成型焊料槽的表面水平。
-
公开(公告)号：US06554180B1
公开(公告)日：2003-04-29
申请号：US09637922
申请日：2000-08-14
申请人： Rikiya Katoh , Osamu Munekata , Yoshitaka Toyoda
发明人： Rikiya Katoh , Osamu Munekata , Yoshitaka Toyoda
IPC分类号： B23K35363
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/42 , H05K3/3442 , H05K3/3463 , H05K3/3484 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts.
摘要翻译： 适用于焊接芯片部件的无铅焊膏包括含有0.2-1.0质量％的Ag和焊剂的双峰Sn基焊料合金的粉末。 焊料合金在熔化开始时在差示扫描量热仪曲线中具有第一吸热峰值，而当合金的主要部分随后熔化时，第二峰值。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.024 秒)