公开(公告)号：US08273598B2

公开(公告)日：2012-09-25

申请号：US13020051

申请日：2011-02-03

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

IPC分类号： H01L21/00

CPC分类号： H01L45/06 ,  H01L45/144 ,  H01L45/1608 ,  H01L45/1683

摘要： A method of forming bit line aligned to a phase change material that includes forming a pedestal of a sacrificial material on a portion of a lower electrode and forming at least one dielectric material adjacent to the sacrificial material, wherein the at least one dielectric material has an upper surface substantially coplanar with an upper surface of the pedestal of the sacrificial material. The pedestal of the sacrificial material is removed selective to the at least one dielectric material and the lower electrode to provide an opening to an exposed surface of the lower electrode. A phase change material is formed on the exposed surface of the lower electrode, and the opening is filled with a conductive fill material. A self-aligned etch back process is also provided.

摘要翻译： 一种形成与相变材料对准的位线的方法，包括在下电极的一部分上形成牺牲材料的基座并且形成与所述牺牲材料相邻的至少一个电介质材料，其中所述至少一种电介质材料具有 上表面与牺牲材料的基座的上表面基本共面。 牺牲材料的基座被选择性地移除到至少一个电介质材料和下电极以提供到下电极的暴露表面的开口。 在下电极的暴露表面上形成相变材料，并且用导电填充材料填充开口。 还提供了自对准的回蚀工艺。

公开(公告)号：US08445313B2

公开(公告)日：2013-05-21

申请号：US13546684

申请日：2012-07-11

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

IPC分类号： H01L21/00

CPC分类号： H01L45/06 ,  H01L45/144 ,  H01L45/1608 ,  H01L45/1683

摘要： A method of forming bit line aligned to a phase change material that includes forming a pedestal of a sacrificial material on a portion of a lower electrode and forming at least one dielectric material adjacent to the sacrificial material, wherein the at least one dielectric material has an upper surface substantially coplanar with an upper surface of the pedestal of the sacrificial material. The pedestal of the sacrificial material is removed selective to the at least one dielectric material and the lower electrode to provide an opening to an exposed surface of the lower electrode. A phase change material is formed on the exposed surface of the lower electrode, and the opening is filled with a conductive fill material. A self-aligned etch back process is also provided.

摘要翻译： 一种形成与相变材料对准的位线的方法，包括在下电极的一部分上形成牺牲材料的基座并且形成与所述牺牲材料相邻的至少一个电介质材料，其中所述至少一种电介质材料具有 上表面与牺牲材料的基座的上表面基本共面。 牺牲材料的基座被选择性地移除到至少一个电介质材料和下电极以提供到下电极的暴露表面的开口。 在下电极的暴露表面上形成相变材料，并且用导电填充材料填充开口。 还提供了自对准的回蚀工艺。

公开(公告)号：US20120202333A1

公开(公告)日：2012-08-09

申请号：US13020051

申请日：2011-02-03

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

IPC分类号： H01L21/02

CPC分类号： H01L45/06 ,  H01L45/144 ,  H01L45/1608 ,  H01L45/1683

摘要： A method of forming bit line aligned to a phase change material that includes forming a pedestal of a sacrificial material on a portion of a lower electrode and fowling at least one dielectric material adjacent to the sacrificial material, wherein the at least one dielectric material has an upper surface substantially coplanar with an upper surface of the pedestal of the sacrificial material. The pedestal of the sacrificial material is removed selective to the at least one dielectric material and the lower electrode to provide an opening to an exposed surface of the lower electrode. A phase change material is formed on the exposed surface of the lower electrode, and the opening is filled with a conductive fill material. A self-aligned etch back process is also provided.

摘要翻译： 一种形成与相变材料对准的位线的方法，其包括在下电极的一部分上形成牺牲材料的基座并且与邻近所述牺牲材料的至少一个电介质材料相连，其中所述至少一种电介质材料具有 上表面与牺牲材料的基座的上表面基本共面。 牺牲材料的基座被选择性地移除到至少一个电介质材料和下电极以提供到下电极的暴露表面的开口。 在下电极的暴露表面上形成相变材料，并且用导电填充材料填充开口。 还提供了自对准的回蚀工艺。

公开(公告)号：US20120276688A1

公开(公告)日：2012-11-01

申请号：US13546684

申请日：2012-07-11

申请人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

发明人： Matthew J. Breitwisch ,  Chieh-Fang Chen ,  Shih-Hung Chen ,  Eric A. Joseph ,  Chung Hon Lam ,  Michael F. Lofaro ,  Hsiang-Lan Lung ,  Alejandro G. Schrott ,  Min Yang

IPC分类号： H01L21/06

CPC分类号： H01L45/06 ,  H01L45/144 ,  H01L45/1608 ,  H01L45/1683

摘要： A method of forming bit line aligned to a phase change material that includes forming a pedestal of a sacrificial material on a portion of a lower electrode and forming at least one dielectric material adjacent to the sacrificial material, wherein the at least one dielectric material has an upper surface substantially coplanar with an upper surface of the pedestal of the sacrificial material. The pedestal of the sacrificial material is removed selective to the at least one dielectric material and the lower electrode to provide an opening to an exposed surface of the lower electrode. A phase change material is formed on the exposed surface of the lower electrode, and the opening is filled with a conductive fill material. A self-aligned etch back process is also provided.

摘要翻译： 一种形成与相变材料对准的位线的方法，包括在下电极的一部分上形成牺牲材料的基座并且形成与所述牺牲材料相邻的至少一个电介质材料，其中所述至少一种电介质材料具有 上表面与牺牲材料的基座的上表面基本共面。 牺牲材料的基座被选择性地移除到至少一个电介质材料和下电极以提供到下电极的暴露表面的开口。 在下电极的暴露表面上形成相变材料，并且用导电填充材料填充开口。 还提供了自对准的回蚀工艺。

公开(公告)号：US20080165569A1

公开(公告)日：2008-07-10

申请号：US11619625

申请日：2007-01-04

申请人： Chieh-Fang Chen ,  Shih-Hung Chen ,  Yi-Chou Chen ,  Thomas Happ ,  Chia Hua Ho ,  Ming-Hsiang Hsueh ,  Chung Hon Lam ,  Hsiang-Lan Lung ,  Jan Boris Philipp ,  Simone Raoux

发明人： Chieh-Fang Chen ,  Shih-Hung Chen ,  Yi-Chou Chen ,  Thomas Happ ,  Chia Hua Ho ,  Ming-Hsiang Hsueh ,  Chung Hon Lam ,  Hsiang-Lan Lung ,  Jan Boris Philipp ,  Simone Raoux

IPC分类号： G11C11/00 ,  H01L21/06 ,  H01L21/00

CPC分类号： G11C11/5678 ,  G11C13/0004 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1625

摘要： A memory cell comprises a first electrode, a second electrode and a composite material. The composite material electrically couples the first electrode to the second electrode. Moreover, the composite material comprises a phase change material and a resistor material. At least a portion of the phase change material is operative to switch between a substantially crystalline phase and a substantially amorphous phase in response to an application of a switching signal to at least one of the first and second electrodes. In addition, the resistor material has a resistivity lower than that of the phase change material when the phase change material is in the substantially amorphous phase.

摘要翻译： 存储单元包括第一电极，第二电极和复合材料。 复合材料将第一电极电耦合到第二电极。 此外，复合材料包括相变材料和电阻材料。 响应于向第一和第二电极中的至少一个施加开关信号，相变材料的至少一部分可操作以在基本上结晶相和基本非晶相之间切换。 此外，当相变材料处于基本非晶相时，电阻材料的电阻率低于相变材料的电阻率。

公开(公告)号：US07786460B2

公开(公告)日：2010-08-31

申请号：US11621390

申请日：2007-01-09

申请人： Hsiang Lan Lung ,  Shih-Hung Chen

发明人： Hsiang Lan Lung ,  Shih-Hung Chen

IPC分类号： H01L21/06 ,  H01L47/00

CPC分类号： G11C13/0004 ,  G11C2213/79 ,  H01L27/2436 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/144 ,  H01L45/148 ,  H01L45/1675 ,  H01L45/1691

摘要： A phase change memory device comprises a photolithographically formed phase change memory cell having first and second electrodes and a phase change element positioned between and electrically coupling the opposed contact elements of the electrodes to one another. The phase change element has a width, a length and a thickness. The length, the thickness and the width are less than a minimum photolithographic feature size of the process used to form the phase change memory cell. The size of the photoresist masks used in forming the memory cell may be reduced so that the length and the width of the phase change element are each less than the minimum photolithographic feature size.

摘要翻译： 相变存储器件包括具有第一和第二电极的光刻形成的相变存储器单元和位于彼此之间并将电极的相对接触元件彼此电耦合的相变元件。 相变元件具有宽度，长度和厚度。 长度，厚度和宽度小于用于形成相变存储器单元的工艺的最小光刻特征尺寸。 可以减小用于形成存储单元的光致抗蚀剂掩模的尺寸，使得相变元件的长度和宽度都小于最小光刻特征尺寸。

公开(公告)号：US20100117048A1

公开(公告)日：2010-05-13

申请号：US12267453

申请日：2008-11-07

申请人： Hsiang-Lan Lung ,  Erh-Kun Lai ,  Yen-Hao Shih ,  Yi-Chou Chen ,  Shih-Hung Chen

发明人： Hsiang-Lan Lung ,  Erh-Kun Lai ,  Yen-Hao Shih ,  Yi-Chou Chen ,  Shih-Hung Chen

IPC分类号： H01L45/00 ,  H01L29/04 ,  H01L21/329

CPC分类号： H01L29/8616 ,  G11C13/0004 ,  G11C2213/72 ,  H01L27/1021 ,  H01L27/2409 ,  H01L27/2463 ,  H01L27/2472 ,  H01L29/04 ,  H01L29/165 ,  H01L29/861 ,  H01L45/04 ,  H01L45/06 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/142 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1675 ,  H01L45/1683

摘要： A memory device includes a driver comprising a pn-junction in the form of a multilayer stack including a first doped semiconductor region having a first conductivity type, and a second doped semiconductor region having a second conductivity type opposite the first conductivity type, the first and second doped semiconductors defining a pn-junction therebetween, in which the first doped semiconductor region is formed in a single-crystalline semiconductor, and the second doped semiconductor region includes a polycrystalline semiconductor. Also, a method for making a memory device includes forming a first doped semiconductor region of a first conductivity type in a single-crystal semiconductor, such as on a semiconductor wafer; and forming a second doped polycrystalline semiconductor region of a second conductivity type opposite the first conductivity type, defining a pn-junction between the first and second regions.

摘要翻译： 存储器件包括驱动器，其包括多层堆叠形式的pn结，其包括具有第一导电类型的第一掺杂半导体区域和具有与第一导电类型相反的第二导电类型的第二掺杂半导体区域，第一和 第二掺杂半导体，其中限定其间的pn结，其中所述第一掺杂半导体区形成在单晶半导体中，并且所述第二掺杂半导体区包括多晶半导体。 此外，制造存储器件的方法包括在半导体晶片上形成单晶半导体中的第一导电类型的第一掺杂半导体区域; 以及形成与所述第一导电类型相反的第二导电类型的第二掺杂多晶半导体区域，限定所述第一和第二区域之间的pn结。

公开(公告)号：US07414258B2

公开(公告)日：2008-08-19

申请号：US11424123

申请日：2006-06-14

申请人： Hsiang Lan Lung ,  Shih-Hung Chen

发明人： Hsiang Lan Lung ,  Shih-Hung Chen

IPC分类号： H01L29/18

CPC分类号： H01L27/2436 ,  G11C13/0004 ,  G11C13/0007 ,  G11C13/0014 ,  G11C13/0016 ,  G11C2213/31 ,  G11C2213/79 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/14 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/148 ,  H01L45/1675

摘要： A memory device comprising a first pan-shaped electrode having a side wall with a top side, a second pan-shaped electrode having a side wall with a top side and an insulating wall between the first side wall and the second side wall. The insulating wall has a thickness between the first and second side walls near the respective top sides. A bridge of memory material crosses the insulating wall, and defines an inter-electrode path between the first and second electrodes across the insulating wall. An array of such memory cells is provided. The bridges of memory material have sub-lithographic dimensions.

摘要翻译： 一种存储装置，包括具有顶侧的侧壁的第一盘形电极，具有顶侧的侧壁和在第一侧壁和第二侧壁之间的绝缘壁的第二盘形电极。 绝缘壁在相应顶面附近的第一和第二侧壁之间具有厚度。 记忆材料桥跨越绝缘壁，并且在绝缘壁之间限定第一和第二电极之间的电极间路径。 提供这样的存储单元阵列。 记忆材料的桥梁具有亚光刻尺寸。

公开(公告)号：US08084760B2

公开(公告)日：2011-12-27

申请号：US12426809

申请日：2009-04-20

申请人： Hsiang-Lan Lung ,  Shih-Hung Chen ,  Stephen M. Rossnagel

发明人： Hsiang-Lan Lung ,  Shih-Hung Chen ,  Stephen M. Rossnagel

IPC分类号： H01L29/02

CPC分类号： H01L45/142 ,  G11C13/0004 ,  H01L27/2436 ,  H01L45/04 ,  H01L45/06 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/1273 ,  H01L45/144 ,  H01L45/146 ,  H01L45/16 ,  H01L45/1625 ,  H01L45/1641 ,  H01L45/1675

摘要： An electrode structure and a method for manufacturing an integrated circuit electrode includes forming a bottom electrode comprising a pipe-shaped member, filled with a conductive material such as n-doped silicon, and having a ring-shaped top surface. A disc-shaped insulating member is formed on the top of the pipe-shaped member by oxidizing the conductive fill. A layer of programmable resistance material, such as a phase change material, is deposited in contact with the top surface of the pipe-shaped member. A top electrode in contact with the layer of programmable resistance material.

摘要翻译： 电极结构和集成电路电极的制造方法包括形成包含管状部件的底部电极，该管状部件填充有诸如n掺杂硅的导电材料，并具有环形顶表面。 通过氧化导电填料，在管状构件的顶部上形成圆盘形的绝缘构件。 将一层可编程电阻材料（例如相变材料）沉积成与管状构件的顶表面接触。 与可编程电阻材料层接触的顶部电极。

公开(公告)号：US20100144128A1

公开(公告)日：2010-06-10

申请号：US12703478

申请日：2010-02-10

申请人： Hsiang-Lan Lung ,  Rich Liu ,  Shih-Hung Chen ,  Yi-Chou Chen

发明人： Hsiang-Lan Lung ,  Rich Liu ,  Shih-Hung Chen ,  Yi-Chou Chen

IPC分类号： H01L21/36 ,  H01L21/00

CPC分类号： G11C8/10 ,  G11C8/08 ,  G11C13/0004 ,  G11C13/0028 ,  G11C2213/53 ,  G11C2213/79 ,  H01L27/2436 ,  H01L27/2463 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/143 ,  H01L45/144 ,  H01L45/148 ,  H01L45/1625 ,  H01L45/165 ,  H01L45/1675

摘要： A phase change memory cell includes first and second electrodes electrically coupled by a phase change element. At least a section of the phase change element comprises a higher reset transition temperature portion and a lower reset transition temperature portion. The lower reset transition temperature portion comprises a phase change region which can be transitioned, by the passage of electrical current therethrough, from generally crystalline to generally amorphous states at a lower temperature than the higher reset transition temperature portion. The phase change element may comprise an outer, generally tubular, higher reset transition temperature portion surrounding an inner, lower reset transition temperature portion.

摘要翻译： 相变存储单元包括由相变元件电耦合的第一和第二电极。 相变元件的至少一部分包括较高的复位转变温度部分和较低的复位转变温度部分。 下复位转变温度部分包括可以通过电流通过从相对于较高复位转变温度部分的较低温度的大致结晶到大致非晶状态的相变区域。 相变元件可以包括围绕内部，下部复位转变温度部分的外部，大体上管状的较高复位转变温度部分。