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1.发明授权公开(公告)号：US07979250B2
公开(公告)日：2011-07-12
申请号：US11950747
申请日：2007-12-05
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G06F17/50 , G06G7/56 , G06G7/50 , H02B1/00 , G01K13/00 , G01K1/08 , G01K7/16 , G01K11/30 , G01K1/16 , G01N9/36
CPC分类号： G06F17/509 , G06F1/20 , G06F17/5004 , G06F2217/78 , G06F2217/80
摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.
摘要翻译： 提供了一种便于在数据中心内安装一个或多个电子机架的方法。 该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个 电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。
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2.发明授权Fluid distribution apparatus and method facilitating cooling of electronics rack(s) and simulating heated airflow exhaust of electronics rack(s) 失效流体分配装置和方法促进电子机架的冷却和模拟电子机架的加热气流排气公开(公告)号：US08439561B2
公开(公告)日：2013-05-14
申请号：US12887551
申请日：2010-09-22
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
CPC分类号： G06F17/5009 , G06F1/20 , G06F2200/201 , H05K7/20609 , H05K7/20745
摘要： Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.
摘要翻译： 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。
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3.发明授权Apparatus and method for simulating heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks 有权用于模拟电子子系统，电子机架或电子机架行的热气流排气的装置和方法公开(公告)号：US07832925B2
公开(公告)日：2010-11-16
申请号：US11950758
申请日：2007-12-05
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
CPC分类号： G06F17/5009 , G06F1/20 , G06F2200/201 , H05K7/20609 , H05K7/20745
摘要： Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.
摘要翻译： 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。
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4.发明授权Apparatus and method for simulating one or more operational characteristics of an electronics rack 失效用于模拟电子机架的一个或多个操作特性的装置和方法公开(公告)号：US08457938B2
公开(公告)日：2013-06-04
申请号：US11950735
申请日：2007-12-05
CPC分类号： G06F17/5009 , G06F2217/16 , G06F2217/80
摘要： Apparatus and method are provided for facilitating simulation of one or more operating characteristics of an electronics rack. The apparatus includes a rack frame, one or more air-moving devices associated with the rack frame, and an adjustable heat source associated with the rack frame. The one or more air-moving devices establish airflow through the rack frame from an air inlet side to an air outlet side thereof, wherein the established airflow through the rack frame is related to airflow through the electronics rack to be simulated. The adjustable heat source heats air passing through the rack frame, with heated air exhausting from the air outlet side of the rack frame simulating heated air exhausting from the electronics rack.
摘要翻译： 提供了用于促进模拟电子机架的一个或多个操作特性的装置和方法。 该装置包括机架框架，与机架框架相关联的一个或多个气动装置以及与机架框架相关联的可调热源。 一个或多个空气移动装置通过齿条框架从空气入口侧到其空气出口侧建立气流，其中通过齿条框架的已建立的气流与要被模拟的电子机架的气流相关。 可调节的热源加热通过齿条框架的空气，加热的空气从架架的空气出口侧排出，模拟从电子机架排出的热空气。
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公开(公告)号：US08593815B2
公开(公告)日：2013-11-26
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
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公开(公告)号：US07651260B2
公开(公告)日：2010-01-26
申请号：US12048620
申请日：2008-03-14
IPC分类号： G01N25/72
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译： 所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。 该装置包括热耦合到热管的冷却装置。 该热管具有用于选择性地在其上施加热量的暴露表面。 选择性地将局部热源施加到暴露表面的至少一个区域。 热源优选地能够相对于暴露的表面和热强度都在位置上变化。 优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。 当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。 然后使用温度分布来热定形冷却装置。
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公开(公告)号：US20080285232A1
公开(公告)日：2008-11-20
申请号：US11750322
申请日：2007-05-17
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard Van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard Van Kessel
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译： 提供了数据中心冷却技术。 在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸 并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸 计算机设备机架的长度小于计算机设备机架的长度。
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公开(公告)号：US20080281551A1
公开(公告)日：2008-11-13
申请号：US12110698
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K13/00
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
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公开(公告)号：US20110279967A1
公开(公告)日：2011-11-17
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译： 提供了数据中心冷却技术。 在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口; 以及一个或多个：安装到围绕至少一部分空气入口的计算机设备机架的进气管道，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸和较小的长度 比计算机设备机架的长度以及安装到围绕至少一部分排气出口的计算机设备机架的排气管道，排气管道具有接近计算机设备机架的横向尺寸的横向尺寸和 长度小于计算机设备机架的长度。
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公开(公告)号：US08038343B2
公开(公告)日：2011-10-18
申请号：US12048635
申请日：2008-03-14
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
摘要翻译： 公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。 被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。 加热器在测试芯片的电路侧进行图案化。 加热器与测试芯片的操作电路分开。 将局部热源施加到热耦合到热管的测试芯片上的至少一个区域，以局部加热测试芯片的第二表面上的多于一个区域，以测试多于一个热点。 第二个表面是测试芯片的电路侧。 加热器对测试芯片提供偏置热量，与操作测试芯片无关，同时局部热源被选择性地直接应用于测试芯片。 温度检测器用于测量测试芯片第二表面上的温度分布。 温度分布用于在操作期间热定形所述冷却装置。
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