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公开(公告)号：US20190255335A1
公开(公告)日：2019-08-22
申请号：US16405032
申请日：2019-05-07
Applicant: Medtronic, Inc.
Inventor： Michael W. Barror , John K. Day , David A. Ruben , James D. Bradley
Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.
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公开(公告)号：US20170150600A1
公开(公告)日：2017-05-25
申请号：US14949277
申请日：2015-11-23
Applicant: Medtronic, Inc.
Inventor： John K. Day , David A. Ruben , Michael S. Sandlin
CPC classification number: H05K1/0306 , H01L21/6835 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2224/16225 , H05K1/09 , H05K1/115 , H05K1/144 , H05K3/10 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K3/4644 , H05K2201/09036
Abstract: A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.
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3.发明申请公开(公告)号：US20140154553A1
公开(公告)日：2014-06-05
申请号：US13692729
申请日：2012-12-03
Applicant: MEDTRONIC, INC.
Inventor： John K. Day , Michael W. Barror , Shawn W. Snyder , Alexandra Z. LaGuardia , Damon E. Lytle , Bernd J. Neudecker
IPC: H01M2/02
CPC classification number: H01M10/0436 , A61N1/378 , H01M2/0202 , H01M2/0267 , H01M2/0292 , H01M6/181 , H01M10/0427 , H01M10/0486 , H01M10/056 , H01M10/4257 , H01M2220/30 , Y10T428/24331
Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.
Abstract translation: 固态器件的电源包括：具有第一接触部分，第一接合部分和第一接触部分与第一接合部分之间的第一延伸部分的第一框架; 具有第二接触部分的第二框架，第二接合部分和第二接合部分与第二接合部分之间的第二延伸部分; 以及位于第一和第二接触部之间的第一极层，电解质层和第二极层，其中电解质层的第一部分位于第一延伸部和第一极之间，电解质层的第二部分 位于第一延伸部和第二极之间。
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公开(公告)号：US09450267B2
公开(公告)日：2016-09-20
申请号：US14622428
申请日：2015-02-13
Applicant: Medtronic, Inc. , Sapurast Research LLC
Inventor： John K. Day , Michael W. Barror , Shawn W. Snyder , Alexandra Z. LaGuardia , Damon E. Lytle , Bernd J. Neudecker
CPC classification number: H01M10/0436 , A61N1/378 , H01M2/0202 , H01M2/0267 , H01M2/0292 , H01M6/181 , H01M10/0427 , H01M10/0486 , H01M10/056 , H01M10/4257 , H01M2220/30 , Y10T428/24331
Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.
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公开(公告)号：US09318400B2
公开(公告)日：2016-04-19
申请号：US14186039
申请日：2014-02-21
Applicant: Medtronic, Inc.
Inventor： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
IPC: H01L23/12 , A61B5/00 , A61N1/375 , B81C1/00 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/372 , H01L23/58 , H01L25/065
CPC classification number: H01L23/12 , A61B5/0031 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/37211 , A61N1/3758 , B81B2201/0214 , B81B2207/012 , B81C1/0023 , H01L23/58 , H01L25/0655 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/19105 , H01L2924/00
Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
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Patent Agency Ranking
公开(公告)号：US10700312B2
公开(公告)日：2020-06-30
申请号：US15936984
申请日：2018-03-27
Applicant: Medtronic, Inc.
Inventor： Christian S. Nielsen , John K. Day , Erik J. Hovland , Jody J. Klaassen , Prabhakar Tamirisa , Collette M. Vanelzen
Abstract: Various embodiments of a battery assembly include a first housing shell, a second housing shell, an insulator and battery components. The first housing shell has a first perimeter side wall, a first housing bottom, and a first contact area on the first housing bottom. The second housing shell has a second perimeter side wall, a second housing bottom, and a second contact area on the second housing bottom. The second housing shell is disposed in the first housing shell with the second contact area opposing the first contact area. The insulator is interposed between the first housing shell and the second housing shell to effect electrical insulation between the first housing shell and the second housing shell. The battery components include an anode electrode, a cathode electrode, and a separator interposed between the cathode electrode and the anode electrode. The separator contains an electrolyte.
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公开(公告)号：US09985255B2
公开(公告)日：2018-05-29
申请号：US14639297
申请日：2015-03-05
Applicant: Medtronic, Inc.
Inventor： Christian S. Nielsen , John K. Day , Erik J. Hovland , Jody J. Klaassen , Prabhakar A. Tamirisa , Collette M. Vanelzen
CPC classification number: H01M2/0202 , A61N1/378 , H01M2/0217 , H01M2/027 , H01M2/0277 , H01M2/08 , H01M2/166 , H01M10/0436 , H01M10/052 , H01M10/425 , H01M10/4257 , H01M2220/30
Abstract: Various embodiments of a battery assembly include a first housing shell, a second housing shell, an insulator and battery components. The first housing shell has a first perimeter side wall, a first housing bottom, and a first contact area on the first housing bottom. The second housing shell has a second perimeter side wall, a second housing bottom, and a second contact area on the second housing bottom. The second housing shell is disposed in the first housing shell with the second contact area opposing the first contact area. The insulator is interposed between the first housing shell and the second housing shell to effect electrical insulation between the first housing shell and the second housing shell. The battery components include an anode electrode, a cathode electrode, and a separator interposed between the cathode electrode and the anode electrode. The separator contains an electrolyte.
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公开(公告)号：US09832867B2
公开(公告)日：2017-11-28
申请号：US14949277
申请日：2015-11-23
Applicant: Medtronic, Inc.
Inventor： John K. Day , David A. Ruben , Michael S. Sandlin
IPC: H01L21/30 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/10 , H05K3/40 , H05K3/46 , H01L23/15 , H01L23/498 , H01L21/683
CPC classification number: H05K1/0306 , H01L21/6835 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2224/16225 , H05K1/09 , H05K1/115 , H05K1/144 , H05K3/10 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K3/4644 , H05K2201/09036
Abstract: A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.
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公开(公告)号：US20170100597A1
公开(公告)日：2017-04-13
申请号：US15196643
申请日：2016-06-29
Applicant: Medtronic, Inc.
Inventor： Michael W. Barror , John K. Day , David A. Ruben , James D. Bradley
CPC classification number: A61N1/3758 , A61N1/05 , A61N1/08 , A61N1/37205 , A61N1/37223 , A61N1/3752 , A61N1/3754 , A61N1/3756 , A61N1/378 , A61N1/3787
Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.
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10.发明授权公开(公告)号：US08956712B2
公开(公告)日：2015-02-17
申请号：US13692729
申请日：2012-12-03
Applicant: Infinite Power Solutions, Inc. , Medtronic, Inc.
Inventor： Michael W. Barror , John K. Day , Shawn W. Snyder , Alexandra Z. LaGuardia , Damon E. Lytle , Bernd J. Neudecker
CPC classification number: H01M10/0436 , A61N1/378 , H01M2/0202 , H01M2/0267 , H01M2/0292 , H01M6/181 , H01M10/0427 , H01M10/0486 , H01M10/056 , H01M10/4257 , H01M2220/30 , Y10T428/24331
Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.
Abstract translation: 固态器件的电源包括：具有第一接触部分，第一接合部分和第一接触部分与第一接合部分之间的第一延伸部分的第一框架; 具有第二接触部分的第二框架，第二接合部分和第二接合部分与第二接合部分之间的第二延伸部分; 以及位于第一和第二接触部之间的第一极层，电解质层和第二极层，其中电解质层的第一部分位于第一延伸部和第一极之间，电解质层的第二部分 位于第一延伸部和第二极之间。
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