Abstract:
An integrated circuit includes at least one first gate electrode of at least one active transistor. At least one first dummy gate electrode is disposed adjacent to a first side edge of the at least one first gate electrode. At least one second dummy gate electrode is disposed adjacent to a second side edge of the at least one first gate electrode. The second side edge is opposite to the first side edge. At least one guard ring is disposed around the at least one first gate electrode, the at least one first dummy gate electrode, and the at least one second dummy gate electrode. An ion implantation layer of the at least one guard ring substantially touches at least one of the at least one first dummy gate electrode and the at least one second dummy gate electrode.
Abstract:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer.
Abstract:
A multiple-phase clock generator includes at least one stage of dividers. A clock signal is supplied as a first stage clock input to dividers in a first stage of dividers. An N-th stage includes 2N dividers, where N is a positive integer number. Each divider in the first stage is configured to divide a first clock frequency of the first stage clock input by 2 to provide a first stage output. Each divider in the N-th stage is configured to divide an N-th clock frequency of an N-th stage clock input by 2 to provide an N-th stage output. The N-th stage outputs from the dividers in the N-th stage provide 2N-phase clock signals that are equally distributed with a same phase difference between adjacent phase clock signals.
Abstract:
A transimpedance amplifier includes a first inverter having a first input node and a first output node. The first input node is configured to be coupled to an input signal. A second inverter has a second input node and a second output node. The second input node is configured to receive a reference voltage terminal. The first inverter and the second inverter are configured to provide a differential output voltage signal between the first output node and the second output node.
Abstract:
A circuit includes a summation circuit for receiving an input data signal and a feedback signal including a previous data bit. The summation circuit is configured to output a conditioned input data signal to a clock and data recovery circuit. A first flip-flop is coupled to an output of the summation circuit and is configured to receive a first set of bits of the conditioned input data signal and a first clock signal having a frequency that is less than a frequency at which the input data signal is received by the first summation circuit. A second flip-flop is coupled to the output of the summation circuit and is configured to receive a second set of bits of the conditioned input data signal and a second clock signal having a frequency that is less than the frequency at which the input data signal is received by the first summation circuit.
Abstract:
A method of designing an integrated circuit includes providing a cell library including a first and second cell structures. The cell structures each include a dummy gate electrode disposed on a boundary. An edge gate electrode is disposed adjacent to the dummy gate electrode. An oxide definition (OD) region has an edge disposed between the edge gate electrode and the dummy gate electrode. The method includes determining if the cell structures are to be abutted with each other. If so, the method includes abutting the cell structures. If not so, the method includes increasing areas of portions of the OD regions between the edge gate electrodes and the dummy gate electrodes.
Abstract:
Some embodiments regard a method comprising: generating a current according to a movement of the MEMS device; the movement is controlled by a control signal; generating a peak voltage according to the current; and adjusting the control signal when the peak voltage is out of a predetermined range.
Abstract:
A circuit including a first circuit configured to receive an input signal and first, third and fifth phase clocks of a clock, and generate a first early signal indicating the clock is earlier than the input signal and a first late signal indicating the clock is later than the input signal. The circuit further includes a second circuit configured to receive an input signal and second, a fourth and sixth phase clocks of the clock, and generate a second early signal indicating the clock is earlier than the input signal and a second late signal indicating the clock is later than the input signal. The circuit further includes a third circuit configured to generate a first increase signal. The circuit further includes a fourth circuit configured to generate a first decrease signal.
Abstract:
A method of forming an integrated circuit structure on a chip includes extracting an active layer from a design of the integrated circuit structure, forming a guard band conforming to the shape of the active layer, the guard band surrounds the active layer, and the guard band is spaced from the active layer at a first spacing in the X-axis direction and at a second spacing in the Y-axis direction, removing any part of the guard band that violates design rules, removing convex corners of the guard band, and adding dummy diffusion patterns into the remaining space of the chip outside the guard band. The first and second spacing can be specified as the same spacings in a Spice model characterization of the integrated circuit structure. The dummy diffusion patterns with different granularities can be added so that the diffusion density is substantially uniform over the chip.
Abstract:
Some embodiments regard a circuit comprising: a first circuit configured to lock a frequency of an output clock to a frequency of a reference clock; a second circuit configured to align an input signal to a phase clock of the output clock; a third circuit configured to use a first set of phase clocks of the output clock and a second set of phase clocks of the output clock to improve alignment of the input signal to the phase clock of the output clock; and a lock detection circuit configured to turn on the first circuit when the frequency of the output clock is not locked to the frequency of the reference clock; and to turn off the first circuit and to turn on the second circuit and the third circuit when the frequency of the output clock is locked to the frequency of the reference clock.