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公开(公告)号：US08014121B2
公开(公告)日：2011-09-06
申请号：US12303394
申请日：2007-06-01
申请人： Mengu Cho , Yuya Sanmaru , Satoshi Hosoda , Minoru Iwata , Tatsuhito Fujita , Yasumasa Hisada
发明人： Mengu Cho , Yuya Sanmaru , Satoshi Hosoda , Minoru Iwata , Tatsuhito Fujita , Yasumasa Hisada
IPC分类号： H02H1/00
摘要： The present invention prevents occurrence of electrical discharge on an electrically conductive structure in an environment in which high-energy electrons impinge onto the structure or on an electronic element mounted to a surface of the structure, which electrical discharge would otherwise occur when the potential of the structure or the electronic element increases in the negative direction due to a negative charge flowing thereinto. An insulating tape bonded to the surface of the electrically conductive structure is partially cut-removed; an electrically conductive adhesive is applied to an exposed portion of the surface of the electrically conductive structure; and an insulating film is bonded to the electrically conductive adhesive, such that the electrically conductive adhesive is exposed to the outside. When encountering higher-energy electrons, the insulating film is charged, so that a strong electric field is applied to the electrically conductive adhesive, and electrons are emitted from the electrically conductive adhesive through field electron emission, to thereby prevent the potential of the electrically conductive structure from increasing in the negative direction.
摘要翻译： 本发明防止在高能电子撞击到结构上或安装在结构表面上的电子元件的环境中导电结构上的放电发生，否则当电位为 结构或电子元件由于负电荷流入其而在负方向上增加。 结合到导电结构的表面的绝缘带被部分地切除; 将导电粘合剂施加到导电结构的表面的暴露部分; 并且绝缘膜粘合到导电粘合剂上，使得导电粘合剂暴露于外部。 当遇到高能电子时，绝缘膜被充电，使得强电场被施加到导电粘合剂上，并且电子通过场电子发射从导电粘合剂发射，从而防止导电的电位 结构从负方向增加。
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公开(公告)号：US20090207546A1
公开(公告)日：2009-08-20
申请号：US12303394
申请日：2007-06-01
申请人： Mengu Cho , Yuya Sanmaru , Satoshi Hosoda , Minoru Iwata , Tatsuhito Fujita , Yasumasa Hisada
发明人： Mengu Cho , Yuya Sanmaru , Satoshi Hosoda , Minoru Iwata , Tatsuhito Fujita , Yasumasa Hisada
IPC分类号： H05F3/00
摘要： The present invention prevents occurrence of electrical discharge on an electrically conductive structure in an environment in which high-energy electrons impinge onto the structure or on an electronic element mounted to a surface of the structure, which electrical discharge would otherwise occur when the potential of the structure or the electronic element increases in the negative direction due to a negative charge flowing thereinto. An insulating tape bonded to the surface of the electrically conductive structure is partially cut-removed; an electrically conductive adhesive is applied to an exposed portion of the surface of the electrically conductive structure; and an insulating film is bonded to the electrically conductive adhesive, such that the electrically conductive adhesive is exposed to the outside. When encountering higher-energy electrons, the insulating film is charged, so that a strong electric field is applied to the electrically conductive adhesive, and electrons are emitted from the electrically conductive adhesive through field electron emission, to thereby prevent the potential of the electrically conductive structure from increasing in the negative direction.
摘要翻译： 本发明防止在高能电子撞击到结构上或安装在结构表面上的电子元件的环境中导电结构上的放电发生，否则当电位为 结构或电子元件由于负电荷流入其而在负方向上增加。 结合到导电结构的表面的绝缘带被部分地切除; 将导电粘合剂施加到导电结构的表面的暴露部分; 并且绝缘膜粘合到导电粘合剂上，使得导电粘合剂暴露于外部。 当遇到高能电子时，绝缘膜被充电，使得强电场被施加到导电粘合剂上，并且电子通过场电子发射从导电粘合剂发射，从而防止导电的电位 结构从负方向增加。
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