Method for dynamic sensor configuration and runtime execution
    1.
    发明授权
    Method for dynamic sensor configuration and runtime execution 失效
    动态传感器配置和运行时执行方法

    公开(公告)号:US07636608B2

    公开(公告)日:2009-12-22

    申请号:US11025227

    申请日:2004-12-30

    Abstract: Graphical User Interfaces (GUIs) are presented for configuring and setting-up dynamic sensors for monitoring tool and process performance in a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules (chambers), and a number of sensors. The graphical display is organized so that all significant parameters are clearly and logically displayed so that the user is able to perform the desired configuration and setup tasks with as little input as possible. The GUI is web-based and is viewable by a user using a web browser.

    Abstract translation: 提供图形用户界面(GUI),用于配置和设置动态传感器,用于在半导体处理系统中监控工具和过程性能。 半导体处理系统包括多个处理工具,多个处理模块(室)和多个传感器。 图形显示被组织,使得所有重要参数都被清楚和逻辑地显示,使得用户能够尽可能少地输入所需的配置和设置任务。 GUI是基于Web的,并且可以由使用web浏览器的用户查看。

    Method and apparatus for monitoring tool performance
    2.
    发明授权
    Method and apparatus for monitoring tool performance 有权
    用于监控工具性能的方法和装置

    公开(公告)号:US07113838B2

    公开(公告)日:2006-09-26

    申请号:US10987194

    申请日:2004-11-15

    Abstract: A method and system for monitoring tool performance for processing tools in a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules, a number of sensors, and an alarm management system. A tool health control strategy is executed in which tool health data for the processing tool is collected. A tool health analysis strategy is executed in which the tool health data is analyzed. An intervention manager can pause the processing tool when an alarm has occurred. The intervention manager refrains from pausing the processing tool when an alarm has not occurred.

    Abstract translation: 一种用于监测半导体处理系统中的加工工具的工具性能的方法和系统。 半导体处理系统包括多个处理工具,多个处理模块,多个传感器和报警管理系统。 执行工具健康控制策略,其中收集用于处理工具的工具健康数据。 执行工具健康分析策略,在其中分析工具健康数据。 发生报警时,干预管理器可以暂停处理工具。 当没有发生警报时,干预管理员不要暂停处理工具。

    Method and apparatus for monitoring tool performance
    3.
    发明申请
    Method and apparatus for monitoring tool performance 有权
    用于监控工具性能的方法和装置

    公开(公告)号:US20050171627A1

    公开(公告)日:2005-08-04

    申请号:US10987194

    申请日:2004-11-15

    Abstract: A method and system for monitoring tool performance for processing tools in a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules, a number of sensors, and an alarm management system. A tool health control strategy is executed in which tool health data for the processing tool is collected. A tool health analysis strategy is executed in which the tool health data is analyzed. An intervention manager can pause the processing tool when an alarm has occurred. The intervention manager refrains from pausing the processing tool when an alarm has not occurred.

    Abstract translation: 一种用于监测半导体处理系统中的加工工具的工具性能的方法和系统。 半导体处理系统包括多个处理工具,多个处理模块,多个传感器和报警管理系统。 执行工具健康控制策略,其中收集用于处理工具的工具健康数据。 执行工具健康分析策略,在其中分析工具健康数据。 发生报警时,干预管理器可以暂停处理工具。 当没有发生警报时,干预管理员不要暂停处理工具。

    Method for cleaning plasma treatment device and plasma treatment system
    4.
    发明授权
    Method for cleaning plasma treatment device and plasma treatment system 有权
    等离子体处理装置和等离子体处理系统的清洗方法

    公开(公告)号:US06443165B1

    公开(公告)日:2002-09-03

    申请号:US09101554

    申请日:1998-09-21

    CPC classification number: C23C16/4405

    Abstract: A method for use in a plasma treatment system that shortens the time required for the cleaning of a fluorine containing carbon film adheared in a vacuum vessel and protects the surface of a transfer table when the cleaning is carried out. After a CF film is deposited by, e.g., a plasma treatment system, the cleaning of the CF film adhered in a vacuum vessel 2 is carried out. In the cleaning, a plasma of O2 gas is produced, and the C—C and C—F bonds on the surface of the CF film are physically and chemically cut by the active species of O produced by the plasma. The O2 gas penetrates into the CF film at places where the C—C and C—F bonds have been cut, to react with C of the CF film to form CO2 which scatters. On the other hand, F scatters as F2. Thus, the CF film is removed.

    Abstract translation: 一种用于等离子体处理系统的方法,其缩短了在真空容器中固化的含氟碳膜的清洁所需的时间,并且在进行清洁时保护转印台的表面。 在通过例如等离子体处理系统沉积CF膜之后,执行粘附在真空容器2中的CF膜的清洁。 在清洁中,产生了O 2气体的等离子体,并且CF膜表面上的C-C和C-F键被由等离子体产生的O的活性物质和化学切割。 在切割C-C和C-F键的地方,O 2气体渗透到CF膜中,与CF膜的C反应形成散射的CO 2。 另一方面,F分散为F2。 因此,去除CF膜。

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