公开(公告)号：US06199747B1

公开(公告)日：2001-03-13

申请号：US09385932

申请日：1999-08-30

申请人： Michael A. Cohn ,  Joseph P. DeGeorge ,  Rao V. Vallabhaneni

发明人： Michael A. Cohn ,  Joseph P. DeGeorge ,  Rao V. Vallabhaneni

IPC分类号： B23K3112

CPC分类号： B23K35/32 ,  B23K20/023 ,  B23K20/16 ,  B23K35/025

摘要： A method of and novel composition for transient liquid phase bonding of refractory metal structures is described herein. Preferably, the composition comprises a first component substantially similar to the composition of the refractory metal structure, and a second component having a lower melting temperature than the first component comprising a metallic constituent selected from the group consisting of iron, nickel and cobalt. The second component acts as a melting point depressant to temporarily lower the melting point of the first component so that the join can be accomplished without melting the structure itself. Upon applying the composition to the surfaces of refractory metal structures in need of joining, the assembly is heated to a eutectic point defined as the lowest melting point of the composition. A localized liquid region is formed at the interface of the two structures which solidifies when the second component diffuses into the structures such that the region becomes increasingly refractory thereby solidifying into a substantially refractory joint.

摘要翻译： 本文描述了难熔金属结构的瞬态液相粘合的方法和新组合物。 优选地，组合物包含与难熔金属结构的组成基本相似的第一组分，以及具有比包含选自铁，镍和钴的金属成分的第一组分更低的熔融温度的第二组分。 第二组分起着降低熔点的作用，暂时降低第一组分的熔点，从而可以在不熔化结构本身的情况下实现接合。 当将组合物施加到需要接合的难熔金属结构的表面时，将组件加热到被定义为组合物的最低熔点的共晶点。 当两个结构的界面处形成局部液体区域，当第二组分扩散到结构中时，这些结构固化，使得该区域变得越来越难以固化，从而固化成基本上耐火的接头。

公开(公告)号：US6117367A

公开(公告)日：2000-09-12

申请号：US21045

申请日：1998-02-09

申请人： Raschid J. Bezama ,  Michael A. Cohn ,  Benjamin V. Fasano ,  Gregory M. Johnson ,  Robert A. Rita ,  Rao V. Vallabhaneni ,  Nancy A. Wier-Cavalieri

发明人： Raschid J. Bezama ,  Michael A. Cohn ,  Benjamin V. Fasano ,  Gregory M. Johnson ,  Robert A. Rita ,  Rao V. Vallabhaneni ,  Nancy A. Wier-Cavalieri

IPC分类号： H05K3/46 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H01B1/02 ,  H01C1/02

CPC分类号： H01L23/49883 ,  H01B1/16 ,  H01B1/22 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092

摘要： Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

摘要翻译： 用于制造半导体器件中使用的多层陶瓷（MLC）基板的金属浆料。 糊剂可减少底物缺陷，例如通过凸起和弯度。 糊料由具有高导电性的金属组成，玻璃料包括玻璃，有机粘合剂和溶剂，任选地含有表面活性剂。

公开(公告)号：US5874162A

公开(公告)日：1999-02-23

申请号：US729083

申请日：1996-10-10

申请人： Kurt E. Bastian ,  James J. Burte ,  Michael A. Cohn ,  Christopher N. Collins ,  Joseph P. DeGeorge ,  Italo A. DiNunzio ,  Robert C. Greenlese ,  Alan Piciacchio ,  Teresa L Pinto ,  Robert J. Sullivan ,  Ryan W. Wuthrich

发明人： Kurt E. Bastian ,  James J. Burte ,  Michael A. Cohn ,  Christopher N. Collins ,  Joseph P. DeGeorge ,  Italo A. DiNunzio ,  Robert C. Greenlese ,  Alan Piciacchio ,  Teresa L Pinto ,  Robert J. Sullivan ,  Ryan W. Wuthrich

IPC分类号： C04B35/111 ,  H05K1/03 ,  H05K3/00 ,  B32B3/00

CPC分类号： C04B35/111 ,  H05K1/0306 ,  H05K3/0011 ,  Y10T428/24926

摘要： Camber of ceramic substrates is prevented by placing a conformable load tile over substrates during sintering. The conformable load tile has an initial curvature that facilitates escape of substrate binder gases during a burn out cycle. Subsequently, the conformable load tile conforms to the substrates under the higher heat of sintering temperature to maintain flatness of the substrates. To prevent sticking of the conformable load tile to the substrates, the conformable load tile is provided with a nonstick surface.

摘要翻译： 在烧结过程中，通过在衬底上放置适形负载瓷砖来防止陶瓷衬底的弯曲。 适形负载瓦具有初始曲率，其有助于在烧坏循环期间衬底粘合剂气体逸出。 随后，在较高的烧结温度下，适形载荷瓦与基底相一致，以保持基底的平整度。 为了防止将适形载荷瓦片粘附到基底上，适应载荷瓦片具有不粘表面。

公开(公告)号：US5866470A

公开(公告)日：1999-02-02

申请号：US727109

申请日：1996-10-08

申请人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： H01G4/30 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01G4/30 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S156/925 ,  Y10T156/1163 ,  Y10T156/1911

摘要： A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.

摘要翻译： 制造多个微电子陶瓷基板的方法使用与界面层层叠的生片层叠层之间的界面层，然后烧制以制造陶瓷基板。 界面层用于保护基底，并在烧制之前将它们保持在一起，然后在烧制循环中的所需点处热分解以分离各个基底。 本发明还包括通过该方法制造的陶瓷基板。

公开(公告)号：US06177184B1

公开(公告)日：2001-01-23

申请号：US09133749

申请日：1998-08-13

申请人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： B23B700

CPC分类号： H01L21/6836 ,  B29C33/68 ,  B29C37/0067 ,  H01L21/4807 ,  H01L23/49894 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31855 ,  Y10T428/31942 ,  H01L2924/00

摘要： An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

摘要翻译： 用于在焙烧期间分离第一和第二微电子陶瓷衬底的界面层包括可降解的粘合剂，优选聚合物，其在高于室温且低于微电子陶瓷衬底的烧制温度的温度下降解;以及分离材料，例如氮化硼 或石墨。 制造界面层的方法包括将粘合剂，用于粘合剂的一种或多种溶剂，增塑剂和分离材料混合足够长的时间以形成均匀的质量，然后将该材料浇铸成薄片以形成界面 层。

公开(公告)号：US5948193A

公开(公告)日：1999-09-07

申请号：US886032

申请日：1997-06-30

申请人： Michael A. Cohn ,  Jon A. Casey ,  Christopher N. Collins ,  Robert A. Rita ,  Robert J. Sullivan ,  Adrienne M. Tirch ,  Leslie J. Wiands ,  Ryan W. Wuthrich

发明人： Michael A. Cohn ,  Jon A. Casey ,  Christopher N. Collins ,  Robert A. Rita ,  Robert J. Sullivan ,  Adrienne M. Tirch ,  Leslie J. Wiands ,  Ryan W. Wuthrich

IPC分类号： C04B35/622 ,  B28B1/30 ,  B32B18/00 ,  H01G4/30 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  B32B31/26

CPC分类号： B32B18/00 ,  H01L21/4857 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/12 ,  C04B2237/343 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4629

摘要： Greensheets having enhanced flexibility and strength are prepared from a greensheet casting composition comprising alumina or other ceramic having a mean particle size of less than about 1 micron and being substantially unimodal, a binder resin, a solvent system and a plasticizer. The greensheets may be formed having a thickness of about 50 microns using conventional greensheet fabricating devices. The greensheets are particularly suitable as dielectric layers for internal layer capacitors in a multilayer ceramic substrate. A preferred co-sintering heating profile to avoid blistering of the MLC package is also provided to form the capacitor containing MLC.

摘要翻译： 具有增强的柔韧性和强度的格式纸由包含氧化铝或平均粒径小于约1微米并且基本上单峰的其它陶瓷，粘合剂树脂，溶剂体系和增塑剂的毛坯铸塑组合物制备。 可以使用常规的毛坯制造装置形成厚度为约50微米的毛坯。 毛坯特别适合作为多层陶瓷基板中的内层电容器的介电层。 还提供了优选的共烧结加热曲线，以避免MLC封装的起泡，以形成包含MLC的电容器。

公开(公告)号：US5800761A

公开(公告)日：1998-09-01

申请号：US727097

申请日：1996-10-08

申请人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： B29C33/68 ,  B29C37/00 ,  H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B29D7/01

CPC分类号： H01L21/6836 ,  B29C33/68 ,  B29C37/0067 ,  H01L21/4807 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31855 ,  Y10T428/31942

摘要： An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

摘要翻译： 用于在焙烧期间分离第一和第二微电子陶瓷衬底的界面层包括可降解的粘合剂，优选聚合物，其在高于室温且低于微电子陶瓷衬底的烧制温度的温度下降解;以及分离材料，例如氮化硼 或石墨。 制造界面层的方法包括将粘合剂，用于粘合剂的一种或多种溶剂，增塑剂和分离材料混合足够长的时间以形成均匀的质量，然后将该材料浇铸成薄片以形成界面 层。