公开(公告)号：US06660956B1

公开(公告)日：2003-12-09

申请号：US10049163

申请日：2002-02-07

申请人： Michael Armin Boller ,  Yam Mo Wong ,  Baskaran Annamalai ,  Honghai Zhu

发明人： Michael Armin Boller ,  Yam Mo Wong ,  Baskaran Annamalai ,  Honghai Zhu

IPC分类号： B23K1116

CPC分类号： H01L24/78 ,  H01L21/67138 ,  H01L21/67253 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20757 ,  H01L2924/00015

摘要： A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

摘要翻译： 一种在焊线机中监测球形成工艺的方法。 监视引线接合器上的电极与安装在其上形成球的引线接合器的线的末端之间的辉光放电参数。 将监视的参数与参考值进行比较，以确定形成的球是否令人满意。

公开(公告)号：US06672503B2

公开(公告)日：2004-01-06

申请号：US09960042

申请日：2001-09-21

申请人： Siu Wing Or ,  Honghai Zhu ,  Yam Mo Wong ,  Honyu Ng

发明人： Siu Wing Or ,  Honghai Zhu ,  Yam Mo Wong ,  Honyu Ng

IPC分类号： B23K3102

CPC分类号： H01L24/78 ,  B23K20/10 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.

摘要翻译： 在半导体管芯和安装有管芯的基板之间接合引线的方法包括提供超声波换能器（1）。 换能器（1）包括超声波能量产生装置（2），超声波振动放大装置（3），其在一端（10）耦合到超声能量产生装置（2），接合工具（5） 超声波振动放大装置（3）的端部（12）和位于超声波振动放大装置（3）的端部（10,12）之间的安装结构（4）。 该方法还包括通过以第一超声波频率操作超声波换能器（1）来执行第一引线接合，并且以超声波频率超声波振荡器（1）进行第二引线接合，第二超声波频率不同于 第一超声波频率。