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公开(公告)号：US08422414B2
公开(公告)日：2013-04-16
申请号：US13084964
申请日：2011-04-12
IPC分类号： H04B7/00
CPC分类号： G06F13/409 , G06F13/385 , G06F2213/3814 , H01L23/66 , H01L25/162 , H01L25/165 , H01L2223/6677 , H01L2924/0002 , H01L2924/00
摘要： A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.
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公开(公告)号：US07768457B2
公开(公告)日：2010-08-03
申请号：US12070281
申请日：2008-02-15
IPC分类号： H01Q1/38
CPC分类号： H01Q9/045 , H01L23/66 , H01L25/162 , H01L25/165 , H01L2223/6633 , H01L2223/6677 , H01L2924/0002 , H01P1/30 , H01P3/026 , H01Q1/2283 , H01Q1/38 , H01Q9/0407 , H01Q21/30 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00
摘要： An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
摘要翻译： 一种集成天线和芯片封装及其制造方法。 该封装包括具有第一表面和第二表面的第一基板。第二表面被配置为将芯片封装与电路板接合。 封装的第二衬底设置在第一衬底的第一表面上并且由电介质材料制成。 一个或多个天线设置在第二基板上，并且通信设备耦合到天线，其中通信设备设置在与天线基本相同的平面上的第二基板上。 盖子耦合到第一衬底并且被配置为封装天线和通信设备。 盖具有透镜，其被配置为允许来自天线的辐射通过其发射，并且肩部构造成传递从通信装置产生的热量。
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3.发明授权System and method for wireless communication in a backplane fabric architecture 有权用于背板结构体系结构中无线通信的系统和方法公开(公告)号：US09537794B2
公开(公告)日：2017-01-03
申请号：US14235971
申请日：2012-07-30
IPC分类号： H04L12/931 , H04Q1/02 , H01Q13/06 , H01Q21/20 , H04B5/00
CPC分类号： H04L49/351 , H01Q13/06 , H01Q21/20 , H01Q21/205 , H04B5/0031 , H04Q1/15
摘要： A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.
摘要翻译： 公开了一种在背板网状网络中进行无线通信的系统和方法。 从第一网络设备接收的数据消息经由第一网络接口在位于第一网络设备机柜中的第一天线系统处理。 数据消息通过高速背板网络从耦合到第一天线系统的第一毫米波天线以无线方式传输到使用发射的毫米波电磁辐射的第二设备机柜中的第二网络设备。 在第二毫米波天线上通过使用发射的毫米波电磁辐射在高速背板网络上无线地接收数据消息，其中所接收的数据消息由耦合到第二毫米波天线的第二天线系统处理。 所接收的数据消息经由第二网络接口从第二天线系统发送到第二网络设备。
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4.发明授权System and method for wireless communication in a backplane fabric architecture 有权用于背板结构体系结构中无线通信的系统和方法公开(公告)号：US08897184B2
公开(公告)日：2014-11-25
申请号：US13561993
申请日：2012-07-30
CPC分类号： H04W84/10 , G06F13/385 , G06F13/409 , G06F2213/3814 , H01L23/66 , H01L25/16 , H01L25/162 , H01L25/165 , H01L2223/6677 , H01L2924/0002 , H04W4/80 , H04W40/06 , Y02D70/142 , Y02D70/144 , Y02D70/146 , Y02D70/22 , Y02D70/322 , H01L2924/00
摘要： A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.
摘要翻译： 公开了一种在背板网状网络中进行无线通信的系统和方法。 从第一网络设备接收的数据消息经由第一网络接口在位于第一网络设备机柜中的第一天线系统处理。 数据消息通过高速背板网络从耦合到第一天线系统的第一毫米波天线以无线方式传输到使用发射的毫米波电磁辐射的第二设备机柜中的第二网络设备。 在第二毫米波天线上通过使用发射的毫米波电磁辐射在高速背板网络上无线地接收数据消息，其中所接收的数据消息由耦合到第二毫米波天线的第二天线系统处理。 所接收的数据消息经由第二网络接口从第二天线系统发送到第二网络设备。
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公开(公告)号：US20120194303A1
公开(公告)日：2012-08-02
申请号：US13383203
申请日：2010-08-19
CPC分类号： H01P1/042 , H01L2224/49175 , H01P5/107 , H01Q1/38 , H01Q9/28 , Y10T29/49018
摘要： A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.
摘要翻译： 公开了一种波导界面和制造方法。 该接口包括具有印刷电路板的支撑块。 通信设备耦合到电路板。 发射换能器定位成与通信装置相邻并耦合到通信装置。 发射换能器包括在第一部分中的一个或多个传输线和第二部分中的至少一个天线元件。 天线元件辐射毫米波频率信号。 联接到支撑块的界面板具有具有预定尺寸的矩形槽。 波导部件耦合到界面板并具有波导开口。 发射换能器的第一部分位于槽内，使得狭槽防止传输线的能量朝向电路板或波导开口发射，但允许能量从天线元件通过波导开口。
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6.发明授权System and method for wireless communication in a backplane fabric architecture 有权用于背板结构体系结构中无线通信的系统和方法公开(公告)号：US07929474B2
公开(公告)日：2011-04-19
申请号：US12214985
申请日：2008-06-23
IPC分类号： H04B7/00
CPC分类号： G06F13/409 , G06F13/385 , G06F2213/3814 , H01L23/66 , H01L25/162 , H01L25/165 , H01L2223/6677 , H01L2924/0002 , H01L2924/00
摘要： A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.
摘要翻译： 无线毫米波背板网络和方法包括在其上具有第一模块的第一电路板，其中第一电路板耦合到高速背板。 网络包括耦合到第一模块并且被布置在第一电路板上的第一通信节点。 网络包括在其上具有第二模块的第二电路板，其中第二电路板耦合到高速背板。 网络包括耦合到第二模块并且设置在第二电路板上的第二通信节点，其中第一和第二模块经由第一和第二通信节点使用毫米波电磁辐射彼此无线地进行通信。
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7.发明授权公开(公告)号：US09088058B2
公开(公告)日：2015-07-21
申请号：US13383203
申请日：2010-08-19
CPC分类号： H01P1/042 , H01L2224/49175 , H01P5/107 , H01Q1/38 , H01Q9/28 , Y10T29/49018
摘要： A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.
摘要翻译： 公开了一种波导界面和制造方法。 该接口包括具有印刷电路板的支撑块。 通信设备耦合到电路板。 发射换能器定位成与通信装置相邻并耦合到通信装置。 发射换能器包括在第一部分中的一个或多个传输线和第二部分中的至少一个天线元件。 天线元件辐射毫米波频率信号。 联接到支撑块的界面板具有具有预定尺寸的矩形槽。 波导部件耦合到界面板并具有波导开口。 发射换能器的第一部分位于槽内，使得狭槽防止传输线的能量朝向电路板或波导开口发射，但允许能量从天线元件通过波导开口。
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8.发明申请公开(公告)号：US20140233460A1
公开(公告)日：2014-08-21
申请号：US14235971
申请日：2012-07-30
IPC分类号： H04L12/931
CPC分类号： H04L49/351 , H01Q13/06 , H01Q21/20 , H01Q21/205 , H04B5/0031 , H04Q1/15
摘要： A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.
摘要翻译： 公开了一种在背板网状网络中进行无线通信的系统和方法。 从第一网络设备接收的数据消息经由第一网络接口在位于第一网络设备机柜中的第一天线系统处理。 数据消息通过高速背板网络从耦合到第一天线系统的第一毫米波天线以无线方式传输到使用发射的毫米波电磁辐射的第二设备机柜中的第二网络设备。 在第二毫米波天线上通过使用发射的毫米波电磁辐射在高速背板网络上无线地接收数据消息，其中所接收的数据消息由耦合到第二毫米波天线的第二天线系统处理。 所接收的数据消息经由第二网络接口从第二天线系统发送到第二网络设备。
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公开(公告)号：US20090207090A1
公开(公告)日：2009-08-20
申请号：US12070281
申请日：2008-02-15
CPC分类号： H01Q9/045 , H01L23/66 , H01L25/162 , H01L25/165 , H01L2223/6633 , H01L2223/6677 , H01L2924/0002 , H01P1/30 , H01P3/026 , H01Q1/2283 , H01Q1/38 , H01Q9/0407 , H01Q21/30 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00
摘要： An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
摘要翻译： 一种集成天线和芯片封装及其制造方法。 该封装包括具有第一表面和第二表面的第一基板。第二表面被配置为将芯片封装与电路板接合。 封装的第二衬底设置在第一衬底的第一表面上并且由电介质材料制成。 一个或多个天线设置在第二基板上，并且通信设备耦合到天线，其中通信设备设置在与天线基本相同的平面上的第二基板上。 盖子耦合到第一衬底并且被配置为封装天线和通信设备。 盖具有透镜，其被配置为允许来自天线的辐射通过其发射，并且肩部构造成传递从通信装置产生的热量。
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公开(公告)号：US08477070B2
公开(公告)日：2013-07-02
申请号：US12849713
申请日：2010-08-03
IPC分类号： H01Q1/38
CPC分类号： H01Q9/045 , H01L23/66 , H01L25/162 , H01L25/165 , H01L2223/6633 , H01L2223/6677 , H01L2924/0002 , H01P1/30 , H01P3/026 , H01Q1/2283 , H01Q1/38 , H01Q9/0407 , H01Q21/30 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00
摘要： An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
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