Cooling fan and shroud with modified profiles
    7.
    发明授权
    Cooling fan and shroud with modified profiles 失效
    冷却风扇和护罩与修改的型材

    公开(公告)号:US07377751B2

    公开(公告)日:2008-05-27

    申请号:US11184195

    申请日:2005-07-19

    IPC分类号: F04D19/00

    摘要: A cooling system includes a cooling fan with an outlet and an inlet and a shroud surrounding at least a portion of the cooling fan. The cooling fan includes a plurality of fan blades, and each fan blade includes an inlet portion and an outlet portion that define an outer periphery of the fan blade. The outlet portion has a profile defined by a radial distance, perpendicular from a central axis of the fan, increasing in a direction towards the outlet. The average angle, relative to a central axis of the fan, of either a profile of the outlet portion or a profile of a portion of the shroud surrounding the outlet portion is between about ±15° of an average angle to the central axis at which a flow of fluid exits the outer periphery of the fan blades or between about 20° and about 70°.

    摘要翻译: 冷却系统包括具有出口的冷却风扇和围绕冷却风扇的至少一部分的入口和护罩。 冷却风扇包括多个风扇叶片,并且每个风扇叶片包括限定风扇叶片外周的入口部分和出口部分。 出口部分具有由与风扇的中心轴垂直的径向距离限定的轮廓,在朝向出口的方向上增加。 相对于风扇的中心轴线,出口部分的轮廓或围绕出口部分的护罩的轮廓的轮廓的平均角度在与中心轴线的平均角度的约±15°之间,在该平均角度处 流体流动离开风扇叶片的外周边缘或者在大约20°和大约70°之间。

    Interposable heat sink for adjacent memory modules
    8.
    发明授权
    Interposable heat sink for adjacent memory modules 有权
    相邻内存模块的可插入散热片

    公开(公告)号:US07339793B2

    公开(公告)日:2008-03-04

    申请号:US11748020

    申请日:2007-05-14

    IPC分类号: H05K7/20

    摘要: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

    摘要翻译: 用于常规存储器模块(例如DIMM)的散热装置,其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离,使得当放置在相邻的存储器模块之间时,弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物,用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时,单个散热器件便于从两个相邻的存储器模块散热。

    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
    9.
    发明授权
    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array 有权
    使用非平面离子发射器阵列穿过散热器的电流动力气流

    公开(公告)号:US08807204B2

    公开(公告)日:2014-08-19

    申请号:US12872107

    申请日:2010-08-31

    摘要: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

    摘要翻译: 用于冷却发热装置的系统包括形成电动力(EHD)空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中,使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势,以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

    PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER
    10.
    发明申请
    PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER 审中-公开
    散热风机的性能和噪音控制

    公开(公告)号:US20130153199A1

    公开(公告)日:2013-06-20

    申请号:US13325198

    申请日:2011-12-14

    IPC分类号: F28F27/00

    摘要: A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode.

    摘要翻译: 一种用于冷却发热装置的系统和方法。 该系统包括用于接触发热装置的散热器基座和从散热器基座延伸的多个散热鳍片,其中翅片提供沿顶部,第一侧面和第二侧开放的气流通道。 离子空气移动装置沿着散热器的至少一侧设置,用于使空气通过气流通道,并且风扇靠近翅片的顶部安装,以使空气通过气流通道。 控制器仅使用离子装置,仅风扇或离子装置和风扇来选择性地控制通过散热器的气流。 用户或系统组件可以指示控制器进入演奏模式,能量效率模式或声学模式。