公开(公告)号：US20050218517A1

公开(公告)日：2005-10-06

申请号：US10855708

申请日：2004-05-28

申请人： Miguel Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

发明人： Miguel Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： B23K35/02 ,  B23K35/36 ,  B32B7/12 ,  C09J4/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/433 ,  H01L23/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/32

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂敷的衬底接触，然后将芯片和预涂封装体围绕第一接触点枢转，排出其间的任何气体直到 芯片上的焊料凸块与基板完全接触。 还提供了一种倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US20060194920A1

公开(公告)日：2006-08-31

申请号：US10550408

申请日：2004-03-30

申请人： Miguel Capote ,  Alan Grieve

发明人： Miguel Capote ,  Alan Grieve

IPC分类号： C08K3/10 ,  C08F20/02

CPC分类号： C09J9/00 ,  C08F220/26 ,  C08F222/1006 ,  C08K3/08 ,  C08K5/0025 ,  C08L63/00 ,  C09J4/00 ,  C09J11/04 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y02P70/613 ,  C08F220/10 ,  H01L2924/00

摘要： Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and a thermally curable adhesive flux composition that comprises (i) a polymerizable fluxing agent; (ii) an inerting agent to react with the fluxing agent at elevated temperature, rendering it inert. The fluxing agent preferably comprises a compound with formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the inventive compositions also include (a) a diluent that is capable of polymerizing with the fluxing agent's polymerizable carbon-carbon double bonds; (b) free radical initiators; (c) a curable resin; and (d) crosslinking agents and accelerators. The compositions can be applied directly onto the surfaces of devices to be joined mechanically and/or electrically and are ideally suited for semiconductor die attachment. During heating, the fluxing agent promotes wetting of the high melting point powder by the molten low melting point powder, causing liquid phase sintering of the powders. The fluxing agent also promotes wetting of the metallizations on the die and substrate by the molten low melting point alloy, providing improved thermal conductivity. Simultaneously, the fluxing agent itself crosslinks to further mechanically bond the adherent surfaces. The absence of fugitive solvents creates a void-free bond.

摘要翻译： 包含相对高熔点金属或金属合金的粉末，相对低熔点的金属或金属合金粉末的粉末以及可热固化的粘合剂助焊剂组合物的导热，可烧结，粘合剂组合物，不含挥发性溶剂，其包含 （i）可聚合助熔剂; （ii）惰性剂在升高的温度下与助熔剂反应，使其惰性。 助熔剂优选包含具有式RCOOH的化合物，其中R包含具有一个或多个可聚合碳 - 碳双键的部分。 任选地，本发明的组合物还包括（a）能够与助熔剂的可聚合碳 - 碳双键聚合的稀释剂; （b）自由基引发剂; （c）可固化树脂; 和（d）交联剂和促进剂。 组合物可以直接施加到机械和/或电连接的装置的表面上，并且理想地适用于半导体芯片附接。 在加热过程中，助熔剂通过熔融的低熔点粉末促进高熔点粉末的润湿，引起粉末的液相烧结。 助熔剂还通过熔融的低熔点合金促进模具和衬底上的金属化的润湿，提供改进的导热性。 同时，助熔剂本身交联以进一步机械地结合附着表面。 没有挥发性溶剂会产生无空隙的键。