公开(公告)号：US20080258164A1

公开(公告)日：2008-10-23

申请号：US12094143

申请日：2005-12-28

申请人： Mikio Masui ,  Youji Urano

发明人： Mikio Masui ,  Youji Urano

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/64 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2933/005

摘要： Light emitting device 1 includes an LED chip 10, a mounting substrate 20 carrying the LED chip, a dome-shaped color conversion member 70, and encapsulation member 50. Color conversion member 70 is molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip 10. Encapsulation member 50 is made of an encapsulation resin material to encapsulate LED chip 10 and bonding wires 14 within a space confined between mounting board 20 and color conversion member 70. Encapsulation member 50 is of a convex-shape to have its light output surface 50b kept in an intimate contact with an internal surface of color conversion member 70. Since the intimate contact between the convex-lens shaped encapsulation member 50 and the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.

摘要翻译： 发光装置1包括LED芯片10，承载LED芯片的安装基板20，圆顶状颜色转换部件70和封装部件50。 颜色转换构件70由透明树脂材料和由LED芯片发出的光激发以发射与LED芯片的发光颜色不同的颜色的荧光材料，并且被结合到安装基板 以围绕LED芯片10。 封装构件50由封装树脂材料制成，以将LED芯片10和接合线14封装在限制在安装板20和颜色转换构件70之间的空间内。 封装构件50具有使其光输出表面50b保持与颜色转换构件70的内表面紧密接触的凸形。 由于在不使用传统的框架的情况下制造凸透镜形密封构件50和颜色转换构件之间的紧密接触，所以发光装置可以抑制密封构件中的空隙的产生，从而提高可靠性。 此外，光输出效率也得到提高。

公开(公告)号：US07767475B2

公开(公告)日：2010-08-03

申请号：US12094143

申请日：2005-12-28

申请人： Mikio Masui ,  Youji Urano

发明人： Mikio Masui ,  Youji Urano

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/64 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2933/005

摘要： Light emitting device 1 includes an LED chip 10, a mounting substrate 20 carrying the LED chip, a dome-shaped color conversion member 70, and encapsulation member 50. Color conversion member 70 is molded from a transparent resin material and a fluorescent material which is excited by a light emitted from the LED chip to emit a light of a color different from a luminescent color of the LED chip, and is bonded to the mounting substrate to surround LED chip 10. Encapsulation member 50 is made of an encapsulation resin material to encapsulate LED chip 10 and bonding wires 14 within a space confined between mounting board 20 and color conversion member 70. Encapsulation member 50 is of a convex-shape to have its light output surface 50b kept in an intimate contact with an internal surface of color conversion member 70. Since the intimate contact between the convex-lens shaped encapsulation member 50 and the color conversion member is made without the use of a conventional frame, the light emitting device can restrain the generation of voids in the encapsulation member, and therefore give improved reliability. Moreover, the light output efficiency is also improved.

摘要翻译： 发光装置1包括LED芯片10，承载LED芯片的安装基板20，圆顶状颜色转换部件70和密封部件50.颜色转换部件70由透明树脂材料和荧光材料成型， 被从LED芯片发射的光激发，发出与LED芯片的发光颜色不同的颜色的光，并且被结合到安装基板上以围绕LED芯片10.封装构件50由封装树脂材料制成 将LED芯片10和接合线14封装在限制在安装板20和颜色转换构件70之间的空间内。封装构件50是凸形的，使其光输出表面50b保持与颜色转换的内表面紧密接触 由于在不使用常规的框架的情况下制造凸透镜形密封构件50和颜色转换构件之间的紧密接触，所以光e 可以抑制密封构件中空隙的产生，从而提高可靠性。 此外，光输出效率也得到提高。

公开(公告)号：US20090095967A1

公开(公告)日：2009-04-16

申请号：US12094136

申请日：2005-12-28

申请人： Mikio Masui ,  Youji Urano

发明人： Mikio Masui ,  Youji Urano

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/52 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

摘要： The lighting device (1) includes an LED chip (10), a mounting substrate (20) mounting thereto the LED chip, an encapsulation member (50) made of an encapsulating resin material for encapsulation of the LED chip, and a lens (60) made of a transparent resin material. The lens (60) is provided in its bottom with a recess (40) and is secured to the mounting substrate (20) with the encapsulation member (50) disposed within the recess (40). The encapsulation member (50) is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

摘要翻译： 照明装置（1）包括LED芯片（10），安装于其上的安装基板（20），由用于封装LED芯片的封装树脂材料制成的封装构件（50）和透镜（60 ）由透明树脂材料制成。 透镜（60）在其底部设置有凹部（40），并且其中密封构件（50）设置在凹部（40）内并固定到安装基板（20）。 密封构件（50）被限制在透明树脂材料的透镜的凹部内，这使封装构件和周围环境之间的线膨胀系数的差异最小化，以限制在低温下密封构件中空隙的发生 。

公开(公告)号：US08278678B2

公开(公告)日：2012-10-02

申请号：US12094136

申请日：2005-12-28

申请人： Mikio Masui ,  Youji Urano

发明人： Mikio Masui ,  Youji Urano

IPC分类号： H01L23/28 ,  H01L23/373

CPC分类号： H01L33/52 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

摘要： The lighting device (1) includes an LED chip (10), a mounting substrate (20) mounting thereto the LED chip, an encapsulation member (50) made of an encapsulating resin material for encapsulation of the LED chip, and a lens (60) made of a transparent resin material. The lens (60) is provided in its bottom with a recess (40) and is secured to the mounting substrate (20) with the encapsulation member (50) disposed within the recess (40). The encapsulation member (50) is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

摘要翻译： 照明装置（1）包括LED芯片（10），安装于其上的安装基板（20），由用于封装LED芯片的封装树脂材料制成的封装构件（50）和透镜（60 ）由透明树脂材料制成。 透镜（60）在其底部设置有凹部（40），并且其中密封构件（50）设置在凹部（40）内并固定到安装基板（20）。 密封构件（50）被限制在透明树脂材料的透镜的凹部内，这使封装构件和周围环境之间的线膨胀系数的差异最小化，以限制在低温下密封构件中空隙的发生 。

公开(公告)号：US20120032203A1

公开(公告)日：2012-02-09

申请号：US13264188

申请日：2010-04-13

申请人： Youji Urano

发明人： Youji Urano

IPC分类号： H01L33/62

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V19/045 ,  F21V29/58 ,  F21V29/83 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/648 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10446 ,  H01L2924/00

摘要： The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.

摘要翻译： LED单元100包括多个LED模块1和散热板。 每个LED模块1包括LED芯片和用于将LED芯片并入其中的封装; 该封装具有电绝缘性能。 每个包装件包括位于LED芯片和散热板之间并具有导热性的子安装构件; 这些是整体形成的。 LED模块布置在散热板的第一表面上。 该结构使得LED单元有可能将LED芯片10中的热量有效地分散到散热板。

公开(公告)号：US07956372B2

公开(公告)日：2011-06-07

申请号：US12067194

申请日：2005-12-28

申请人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

发明人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

IPC分类号： H01L33/48

CPC分类号： H01L33/483 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

摘要翻译： 发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板 并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。 副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。 子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

公开(公告)号：US20100200887A1

公开(公告)日：2010-08-12

申请号：US12733399

申请日：2008-08-28

申请人： Youji Urano ,  Kenichiro Tanaka

发明人： Youji Urano ,  Kenichiro Tanaka

IPC分类号： H01L33/50

CPC分类号： H01L33/508 ,  H01L33/38 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device including a thinned color conversion layer which emits a light with a minimized color ununiformity. The light emitting element includes an LED chip, a color conversion layer. The color conversion layer is made of a light-transmissive material containing a phosphor. The phosphor is excited by a light emitted from the LED chip to emit a light of a color having a wavelength longer than that of a luminescent color of the LED chip. The LED chip is provided at its top surface with a frame-shaped electrode which extends along its edge. The color conversion layer is formed on the top surface of the LED chip at an area surrounded by the frame-shaped electrode.

摘要翻译： 一种发光装置，其包括以最小的颜色不均匀性发出光的变薄的颜色转换层。 发光元件包括LED芯片，颜色转换层。 颜色转换层由含有荧光体的透光材料制成。 荧光体被从LED芯片发出的光激发，发出比LED芯片的发光颜色波长长的颜色的光。 LED芯片在其顶表面处设置有沿其边缘延伸的框状电极。 在由框状电极包围的区域的LED芯片的顶面上形成有颜色转换层。

公开(公告)号：US20090267093A1

公开(公告)日：2009-10-29

申请号：US12067194

申请日：2005-12-28

申请人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

发明人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.

摘要翻译： 发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板 并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。 副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。 子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

公开(公告)号：US20090026485A1

公开(公告)日：2009-01-29

申请号：US11993956

申请日：2006-06-30

申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

公开(公告)号：US06960864B2

公开(公告)日：2005-11-01

申请号：US10287500

申请日：2002-11-05

申请人： Youji Urano ,  Harunori Kitahara

发明人： Youji Urano ,  Harunori Kitahara

IPC分类号： H01L41/08 ,  F04B43/00 ,  F04B43/04 ,  H01L41/09 ,  H01L41/338 ,  H01L41/45 ,  H02N1/00 ,  H02N2/00

CPC分类号： H02N1/002 ,  F04B43/0054 ,  F04B43/04 ,  H01L41/0973

摘要： An electroactive polymer actuator, which has the capability of improving response speed and operation reliability of a device utilizing an electroactive effect, comprises a laminate formed by alternately placing a plurality of ring members of an electroactive polymer material having different diameters and a plurality of ring electrodes having different diameters such that each of the ring members is positioned between inner and outer peripheral surfaces of adjacent ring electrodes, and a voltage applying unit for applying a voltage(s) between odd-numbered ring electrodes and even-numbered ring electrodes in the case of counting the ring electrodes in order from an innermost ring electrode of the laminate, to thereby cause a deformation in the laminate. This actuator is preferably used as a diaphragm drive unit of a diaphragm pump.

摘要翻译： 具有提高使用电活性效果的装置的响应速度和操作可靠性的电活性聚合物致动器包括通过交替放置具有不同直径的电活性聚合物材料的多个环构件和多个环形电极而形成的层压体 具有不同的直径，使得每个环形构件位于相邻环形电极的内周表面和外周表面之间;以及电压施加单元，用于在奇数环电极和偶数环电极之间施加电压，在该情况下 从层叠体的最内圈电极开始依次计数环形电极，从而引起层压体的变形。 该致动器优选用作隔膜泵的隔膜驱动单元。