Ultra thin seed layer for CPP or TMR structure
    10.
    发明授权
    Ultra thin seed layer for CPP or TMR structure 有权
    用于CPP或TMR结构的超薄种子层

    公开(公告)号:US07646568B2

    公开(公告)日:2010-01-12

    申请号:US11317598

    申请日:2005-12-23

    IPC分类号: G11B5/127

    摘要: Improved magnetic devices have been fabricated by replacing the conventional seed layer (typically Ta) with a bilayer of Ru on Ta. Although both Ru and Ta layers are ultra thin (between 5 and 20 Angstroms), good exchange bias between the seed and the AFM layer (IrMn about 70 Angstroms thick) is retained. This arrangement facilitates minimum shield-to-shield spacing and gives excellent performance in CPP, CCP-CPP, or TMR configurations.

    摘要翻译: 已经通过用Ta上的Ru的双层代替常规种子层(通常为Ta)来制造改进的磁性器件。 虽然Ru和Ta层都是超薄的(5到20埃之间),但保留种子和AFM层之间良好的交换偏差(约为70埃的IrMn)。 这种安排有助于最小的屏蔽间隔,并在CPP,CCP-CPP或TMR配置中提供出色的性能。