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公开(公告)号:US20090250431A1
公开(公告)日:2009-10-08
申请号:US12404681
申请日:2009-03-16
申请人: Minako INUKAI , Yoshihiro OGAWA , Hiroshi TOMITA , Hiroyasu IIMORI , Yuji YAMADA , Yoshihiro UOZUMI , Linan JI , Kaori UMEZAWA , Hisadhi OKUCHI
发明人: Minako INUKAI , Yoshihiro OGAWA , Hiroshi TOMITA , Hiroyasu IIMORI , Yuji YAMADA , Yoshihiro UOZUMI , Linan JI , Kaori UMEZAWA , Hisadhi OKUCHI
CPC分类号: H01L21/02082 , H01L21/02057
摘要: A substrate processing method that processes a substrate on which a plurality of patterns adjacent to each other are formed, has: supplying a first processing liquid to a principal surface of the substrate that is dry and has the patterns formed thereon to make the first processing liquid adhere to the principal surface of the substrate; and supplying a second processing liquid having a higher surface tension than the first processing liquid to the principal surface of the substrate in the state where the first processing liquid adheres to the principal surface of the substrate to process the principal surface of the substrate with the second processing liquid.
摘要翻译: 在其上形成有彼此相邻的多个图案的基板的处理的基板处理方法具有:将第一处理液体供给到干燥后的基板的主面,并且形成有图案的第一处理液 粘附在基材的主表面上; 以及在所述第一处理液体粘附到所述基板的主表面的状态下,将具有比所述第一处理液体更高的表面张力的第二处理液供给到所述基板的主表面,以处理所述基板的所述主表面, 处理液体。
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公开(公告)号:US20130008868A1
公开(公告)日:2013-01-10
申请号:US13541167
申请日:2012-07-03
申请人: Yoshihiro UOZUMI , Shinsuke Kimura , Yoshihiro Ogawa , Hiroyasu Iimori , Tatsuhiko Koide , Hideaki Hirabayashi , Yuji Nagashima
发明人: Yoshihiro UOZUMI , Shinsuke Kimura , Yoshihiro Ogawa , Hiroyasu Iimori , Tatsuhiko Koide , Hideaki Hirabayashi , Yuji Nagashima
CPC分类号: H01L21/67075 , G03F7/162 , G03F7/405 , H01L21/67017 , H01L21/67028 , H01L21/67051 , H01L21/67098 , H01L21/6715 , H01L21/67739 , H01L21/68
摘要: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.
摘要翻译: 根据一个实施例,公开了一种基板处理方法。 该方法可以包括用第一液体处理底物。 衬底具有形成在衬底的主表面上的结构体。 该方法可以包括通过使第二液体与由第一液体润湿的基底接触而形成支撑结构体的支撑构件,并且通过执行至少一个将第二液体的至少一部分变为固体, 第二液体反应,减少包含在第二液体中的溶剂的量,并使溶解在第二液体中的物质的至少一部分被分离。 该方法可以包括通过将支撑构件的至少一部分从固相改变为气相而不通过液相来移除支撑构件。
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公开(公告)号:US20130196512A1
公开(公告)日:2013-08-01
申请号:US13595076
申请日:2012-08-27
IPC分类号: H01L21/306 , B08B3/00
CPC分类号: H01L21/0206 , H01L21/32139 , H01L21/67028 , H01L27/11521 , H01L29/40114
摘要: According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can rinse a substrate with water, a plurality of protruding patterns being formed on the substrate. The method can dry the substrate by removing water from a recess between the protruding patterns by irradiating microwaves.
摘要翻译: 根据一个实施例,公开了一种用于制造半导体器件的方法。 该方法可以用水冲洗基材,在基材上形成多个突起图案。 通过照射微波,该方法可以通过从突出图案之间的凹槽中除去水来干燥基底。
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