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公开(公告)号:US07026238B2
公开(公告)日:2006-04-11
申请号:US10052681
申请日:2002-01-17
申请人: Ming Xi , Paul Frederick Smith , Ling Chen , Michael X. Yang , Mei Chang , Fusen Chen , Christophe Marcadal , Jenny C. Lin
发明人: Ming Xi , Paul Frederick Smith , Ling Chen , Michael X. Yang , Mei Chang , Fusen Chen , Christophe Marcadal , Jenny C. Lin
IPC分类号: H01L21/4763
CPC分类号: H01L21/76804 , C25D5/02 , H01L21/2855 , H01L21/28556 , H01L21/28562 , H01L21/76831 , H01L21/76843 , H01L21/76844 , H01L21/76846 , H01L21/76877 , H01L23/5226 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.