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    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
    1.
    发明授权
    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
    用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统

    公开(公告)号：US06897956B2

    公开(公告)日：2005-05-24

    申请号：US10235656

    申请日：2002-09-06

    申请人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    发明人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    IPC分类号： G01B11/00 ,  G01B11/27 ,  H01L21/027 ,  H01L21/66 ,  H05K1/02 ,  H05K3/46

    CPC分类号： G01B11/272 ,  H05K1/0269 ,  H05K3/4638

    摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment accuracy between the overlaid alignment marks at least for a direction perpendicular to the running direction based on the image signal converted by the linear image sensor.

    摘要翻译： 一种用于测量在布置在待测量基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置，包括：沿x方向和y方向运行的XY台， 安装基板; 照明光学系统，用于在XY台在作为排列芯片的方向的方向x上行进的状态下照亮每个对准标记部分; 一种检测光学系统，具有用于收集从重叠的对准标记获得的运行状态的反射光的物镜，用于将反射光聚焦在从物镜获得的运行状态的聚焦光学系统，用于扫描反射的扫描光学系统 聚焦光学系统以与行进方向相反的方向聚焦的运行状态的光图像和接收基本处于静止状态的反射光图像的线性图像传感器被扫描光学系统沿相反方向扫描并将其转换成 图像信号; 以及对准精度计算装置，用于根据由线性图像传感器转换的图像信号，至少对垂直于行进方向的方向测量重叠的对准标记之间的对准精度。

    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
    2.
    发明授权
    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
    用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统

    公开(公告)号：US07271908B2

    公开(公告)日：2007-09-18

    申请号：US11131378

    申请日：2005-05-18

    申请人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    发明人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    IPC分类号： G01B11/00

    CPC分类号： G01B11/272 ,  H05K1/0269 ,  H05K3/4638

    摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.

    摘要翻译： 用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统 用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成 图像信号。 对准精度计算器测量重叠对准标记之间的对准精度。

    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
    3.
    发明申请
    Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效
    用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统

    公开(公告)号：US20050206898A1

    公开(公告)日：2005-09-22

    申请号：US11131378

    申请日：2005-05-18

    申请人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    发明人： Minori Noguchi ,  Masahiko Nakada ,  Takahiko Suzuki ,  Taketo Ueno ,  Toshihiko Nakata ,  Shunji Maeda

    IPC分类号： G01B11/00 ,  G01B11/27 ,  H01L21/027 ,  H01L21/66 ,  H05K1/02 ,  H05K3/46

    CPC分类号： G01B11/272 ,  H05K1/0269 ,  H05K3/4638

    摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.

    摘要翻译： 用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统 用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成 图像信号。 对准精度计算器测量重叠对准标记之间的对准精度。

    Method and apparatus for processing a minute portion of a specimen
    7.
    发明授权
    Method and apparatus for processing a minute portion of a specimen 失效
    用于处理样本的微小部分的方法和装置

    公开(公告)号：US5333495A

    公开(公告)日：1994-08-02

    申请号：US12758

    申请日：1993-03-11

    申请人： Hiroshi Yamaguchi ,  Minori Noguchi ,  Makiko Kohno ,  Toshihiko Nakata

    发明人： Hiroshi Yamaguchi ,  Minori Noguchi ,  Makiko Kohno ,  Toshihiko Nakata

    IPC分类号： G01Q10/00 ,  G01Q30/02 ,  G01Q30/16 ,  G01Q60/12 ,  G01Q60/18 ,  G01Q60/22 ,  G01Q60/56 ,  G01Q70/10 ,  H01J37/28 ,  G01B5/28 ,  G01N21/31 ,  G01N23/00 ,  C21K1/00

    CPC分类号： G01Q30/02 ,  B82Y20/00 ,  B82Y35/00 ,  G01Q60/22 ,  H01J37/28 ,  Y10S977/859 ,  Y10S977/861 ,  Y10S977/862 ,  Y10S977/879

    摘要： A method for detecting a photoacoustic signal includes the steps of modulating the intensity of light obtained from a light source at a predetermined modulation frequency, exciting a specimen by directing the intensity-modulated light onto the specimen, thereby generating a photoacoustic effect in the specimen, detecting the photoacoustic effect generated in the specimen and producing a detection signal indicative of the detected photoacoustic effect, and extracting information about the surface and interior of the specimen from the detection signal, wherein the intensity-modulated light is emitted from an aperture of a near-field optical scanning microscope used in directing the intensity-modulated light onto the specimen while a distance between the aperture of the near-field optical scanning microscope and the surface of the specimen is maintained constant irrespective of the photoacoustic effect generated in the specimen.

    摘要翻译： 一种用于检测光声信号的方法包括以预定调制频率调制从光源获得的光的强度的步骤，通过将强度调制的光引导到样本上来激发样本，从而在样本中产生光声效应， 检测在样本中产生的光声效应，产生表示检测到的光声效应的检测信号，以及从检测信号中提取关于样本表面和内部的信息，其中强度调制光从近似的孔径发射 用于将强度调制光引导到样本上的现场光学扫描显微镜，而近场光学扫描显微镜的孔径与样本表面之间的距离保持恒定，而与样品中产生的光声效应无关。

    Defect detector and defect detecting method
    10.
    发明申请
    Defect detector and defect detecting method 有权
    缺陷检测器和缺陷检测方法

    公开(公告)号：US20060124874A1

    公开(公告)日：2006-06-15

    申请号：US10536715

    申请日：2003-11-27

    申请人： Sachio Uto ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Takahiro Jingu ,  Toshihiko Nakata ,  Masahiro Watanabe

    发明人： Sachio Uto ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Takahiro Jingu ,  Toshihiko Nakata ,  Masahiro Watanabe

    IPC分类号： G01N21/00 ,  G01N21/88

    CPC分类号： G01N21/00 ,  G01N21/9501 ,  G06T7/0004 ,  G06T2207/30148

    摘要： A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.

    摘要翻译： 一种缺陷检查装置，具有：在其上安装检查对象基板的同时沿预定方向行进的扫描台; 照明光学系统，用于以与其倾斜的预定角度将照明光束照射在检查对象基板的表面上; 检测光学系统，包括：用于接收从检查对象基板向上发射的上方反射/散射光的上方光检测器，从而将其转换为高定向图像信号;以及侧向光检测器， 将检测对象基板发射的侧向反射/散射光倾斜到倾斜方向，以与照明光束平坦地相交，从而转换为侧向图像信号; 以及信号处理系统 - 用于基于上限图像信号和侧向图像信号来检测缺陷。