公开(公告)号：US06650409B1

公开(公告)日：2003-11-18

申请号：US08617270

申请日：1996-03-14

申请人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

发明人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

IPC分类号： G01N2189

CPC分类号： H01L21/67288 ,  G01N21/9501 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/681

摘要： A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

摘要翻译： 半导体器件制造方法和半导体器件制造系统采用具有灰尘粒子检测装置的处理装置。 尘埃粒子检测装置至少在工件加工之前或之后测量附着在工件上的灰尘颗粒的附着状态，管理灰尘颗粒对于每批工件或每个工件的加工产生的增加粘附的条件 基于在处理工件之前或之后测量的粉尘颗粒的粘附测量条件，并根据管理的粘附条件确定处理设备要清洁的时间或清洁处理设备的循环 灰尘颗粒。

公开(公告)号：US5274434A

公开(公告)日：1993-12-28

申请号：US778363

申请日：1991-10-17

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Yuzo Taniguchi

IPC分类号： G01N21/94 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68 ,  G01N21/89 ,  G02B27/46 ,  G06F15/46

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01R31/308 ,  H01J37/00 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/67288 ,  H01L22/20 ,  G01N2021/8822 ,  G01N21/95623 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L22/12

摘要： In a mass production line of a semiconductor manufacturing process, foreign particle inspection method and apparatus for preventing occurrence of large quantities of defects and for keeping a necessary yield. The inspection apparatus is made up in a small-sized apparatus and disposed at inlet/outlet of processing apparatuses of the production line or to a transfer system between the processing apparatuses. The inspection apparatus includes at least one monitor for real-time sampling foreign particles possible deposited on wafer which is being carried by the transfer system, thereby enabling simplification in construction of the production line and reduction of manufacturing cost. The inspection apparatus may comprise a refractive index changeable type lens array, a spatial filter and a pattern data elimination circuit, and makes possible to conduct foreign particle inspection on repetitively-patterned portions of the wafers during transfer. With the spatial filter for eliminating repetitive data of the repetition patterns the small-sized compact inspection apparatus is capable of real-time inspecting the foreign particles on the wafers at a high speed.

摘要翻译： 在半导体制造方法的大规模生产线中，用于防止发生大量缺陷并保持必要成品率的外来颗粒检查方法和装置。 检查装置由小型装置构成，配置在生产线的处理装置的出入口处或处理装置之间的转印系统。 该检查装置包括至少一个监视器，用于实时采样可能沉积在由转印系统携带的晶片上的异物，从而能够简化生产线的构造和降低制造成本。 检查装置可以包括折射率可变型透镜阵列，空间滤光器和图案数据消除电路，并且可以在转印期间对晶片的重复构图部分进行异物检查。 利用用于消除重复图案的重复数据的空间滤波器，小型紧凑型检查装置能够以高速实时检查晶片上的异物。

公开(公告)号：US06339653B1

公开(公告)日：2002-01-15

申请号：US09523380

申请日：2000-03-10

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且，在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US5841893A

公开(公告)日：1998-11-24

申请号：US908550

申请日：1992-06-30

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： H01L21/66 ,  G01N21/88 ,  G01N21/956 ,  G06K9/00

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06628817B2

公开(公告)日：2003-09-30

申请号：US09752674

申请日：2001-01-03

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06330352B1

公开(公告)日：2001-12-11

申请号：US09525527

申请日：2000-03-15

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

公开(公告)号：US06185322B2

公开(公告)日：2001-02-06

申请号：US08958095

申请日：1997-10-27

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且，在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US06529619B2

公开(公告)日：2003-03-04

申请号：US09893889

申请日：2001-06-29

申请人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

发明人： Seiji Ishikawa ,  Masao Sakata ,  Jun Nakazato ,  Sadao Shimoyashiro ,  Hiroto Nagatomo ,  Yuzo Taniguchi ,  Osamu Satou ,  Tsutomu Okabe ,  Yuzaburo Sakamoto ,  Kimio Muramatsu ,  Kazuhiko Matsuoka ,  Taizo Hashimoto ,  Yuichi Ohyama ,  Yutaka Ebara ,  Isao Miyazaki ,  Shuichi Hanashima

IPC分类号： G06K900

CPC分类号： G01N21/88 ,  G01N21/956 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

摘要翻译： 本发明分别提供用于探测器和自动粒子检测机的数据分析台。 并且在数据分析站中，以产品为基础描述芯片的配置的坐标与描述缺陷的位置的坐标相同。 此外，该站提供确定每个缺陷属于哪个芯片的功能。 这些数据分析站通过通信线连接。 本发明能够基于芯片分析数据，从而能够掌握每个芯片上的缺陷引起的芯片与芯片的产品特性之间的关系。

公开(公告)号：US06346772B1

公开(公告)日：2002-02-12

申请号：US09903495

申请日：2001-07-13

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Makoto Fukushima ,  Tomohiko Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Makoto Fukushima ,  Tomohiko Murase

IPC分类号： H01J1749

CPC分类号： H05K3/062 ,  H01J9/02 ,  H01J11/12 ,  H01J11/22 ,  H01J11/24 ,  H01J2211/225 ,  H05K3/04 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2203/025 ,  H05K2203/107

摘要： A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.

摘要翻译： 一种气体放电显示装置，包括具有多个第一电极的前侧基板和具有多个第二电极的背面基板，其中至少所述第一电极或第二电极通过使用由无机材料制成的抗蚀剂的湿蚀刻形成 能够抑制电极中的配线断裂的能力优异。

公开(公告)号：US06621217B2

公开(公告)日：2003-09-16

申请号：US10068939

申请日：2002-02-11

申请人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Makoto Fukushima ,  Tomohiko Murase

发明人： Masashi Nishiki ,  Ryohei Satoh ,  Yuzo Taniguchi ,  Shigeaki Suzuki ,  Michifumi Kawai ,  Masahito Ijuin ,  Akira Yabushita ,  Makoto Fukushima ,  Tomohiko Murase

IPC分类号： H01J1749

CPC分类号： H05K3/062 ,  H01J9/02 ,  H01J11/12 ,  H01J11/22 ,  H01J11/24 ,  H01J2211/225 ,  H05K3/04 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2203/025 ,  H05K2203/107

摘要： A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.