Exposure apparatus and method
    10.
    发明授权
    Exposure apparatus and method 失效
    曝光装置和方法

    公开(公告)号:US07598020B2

    公开(公告)日:2009-10-06

    申请号:US11117492

    申请日:2005-04-29

    IPC分类号: H01L21/00

    摘要: A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device through an object lens, developing the resist exposed by the light pattern to form a wafer pattern with the resist, and etching the substrate on which the wafer pattern with the resist is formed. In the step of exposing, the light pattern projected on the substrate is formed by excimer laser light which is emitted from an annular shaped light source and which is passed through a mask having a phase shifter.

    摘要翻译: 一种半导体器件的制造方法,包括以下步骤:通过物镜将半导体器件的基板上的光图案投射到半导体器件的基板上,使其抗蚀剂曝光,使由光图形曝光的抗蚀剂显影形成 具有抗蚀剂的晶片图案,并且蚀刻其上形成有抗蚀剂的晶片图案的基板。 在曝光的步骤中,投射在基板上的光图案由从环形光源发射并通过具有移相器的掩模的准分子激光形成。