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公开(公告)号:US20210363369A1
公开(公告)日:2021-11-25
申请号:US17315362
申请日:2021-05-10
申请人: Mio AKIMA , Masaki KUDO , Tomohiro HIRADE , Nozomi TERAI
发明人: Mio AKIMA , Masaki KUDO , Tomohiro HIRADE , Nozomi TERAI
IPC分类号: C09D11/38 , C09D11/107 , C09D11/102
摘要: Provided is an ink including water, an organic solvent, resin particles, and a thickener. The thickener comprises polymer particles having a carboxylic acid structure. A proportion of the thickener in the ink is 0.05% by mass or more. Change in viscosity of the ink between before and after storage of the ink at 70° C. for 1 week is 20% or less. The change in viscosity is expressed by Formula (1): Change in viscosity (%)=[(a−b)/b]×100 . . . Formula (1), where a represents a viscosity (mPa·s) at 25° C. of the ink when the ink is prepared, and b represents a viscosity (mPa·s) at 25° C. of the ink after the ink is stored at 70° C. for 1 week.
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公开(公告)号:US20220396708A1
公开(公告)日:2022-12-15
申请号:US17828036
申请日:2022-05-31
申请人: Nozomi TERAI , Yuusuke KOIZUKA , Naoto SHIMURA , Tatsuya TAKARADA
发明人: Nozomi TERAI , Yuusuke KOIZUKA , Naoto SHIMURA , Tatsuya TAKARADA
IPC分类号: C09D11/32 , B41J2/21 , C09D11/033 , C09D11/104
摘要: A set of a processing fluid and an ink is provided where the ink contains a coloring material, an organic solvent, and a resin Ri and the processing fluid contains a polyvalent metal salt, a resin Rt, and a silicone-based surfactant. A maximum tensile stress of an ink film obtained by drying the ink is 2 N/mm2 or greater.
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公开(公告)号:US20220324241A1
公开(公告)日:2022-10-13
申请号:US17706589
申请日:2022-03-29
申请人: Naoto SHIMURA , Yuya HIROKAWA , Yuusuke KOIZUKA , Takayuki SHIMIZU , Itsuro SASAKI , Shunsuke HORIE , Nozomi TERAI , Kenta HAGIWARA
发明人: Naoto SHIMURA , Yuya HIROKAWA , Yuusuke KOIZUKA , Takayuki SHIMIZU , Itsuro SASAKI , Shunsuke HORIE , Nozomi TERAI , Kenta HAGIWARA
摘要: A printing method includes discharging ink to a substrate, heating a non-ink-discharged side of the substrate at T1, and heating an ink-discharged side of the substrate at T2, wherein the ink contains an organic solvent A (boiling point lower than 250 degrees C.), an organic solvent B (boiling point of 250 degrees C.), and a resin, where 0 degrees C. C≤T2−T1≤90 degrees C. is satisfied, the proportion (organic solvent A/ink) is 30 percent by mass or less, the proportion (organic solvent B/ink) is 1 to 3 percent by mass, the proportion (resin/ink) is 5 to 15 percent by mass, the ink has a viscosity of 8.0 to 11.0 mPa-s at 25 degrees C. and 5.5 to 11.0 mPa-s at 36 degrees C., and a 2.5 μL ink droplet discharged to the substrate shrinks to 0.1 μL within 10.0 seconds at 25 degrees C.
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