MAKING TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID
    4.
    发明申请
    MAKING TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID 有权
    制造具有多层网格的透明电容器

    公开(公告)号:US20130134996A1

    公开(公告)日:2013-05-30

    申请号:US13305831

    申请日:2011-11-29

    IPC分类号: G01R27/26 H01G13/00 H01J9/00

    摘要: A method of making a transparent capacitor apparatus includes: providing a first transparent substrate including a first patterned conductive layer having a first pattern; providing a second transparent substrate including a second patterned conductive layer having a second pattern different from the first pattern; locating the first transparent substrate over the second transparent substrate so that the first patterned conductive layer is effectively parallel to the second patterned conductive layer. Overlapping portions of both the first conductive layer and the second conductive layer are patterned time into spatially matching conductive areas and non-conductive areas by locally applying heat to melt conductive materials in the non-conductive areas so that the surface tension of the conductive materials causes the conductive materials to coalesce into structures with a reduced conductive layer area.

    摘要翻译: 制造透明电容器装置的方法包括:提供包括具有第一图案的第一图案化导电层的第一透明基板; 提供包括具有不同于所述第一图案的第二图案的第二图案化导电层的第二透明基板; 将第一透明基板定位在第二透明基板上,使得第一图案化导电层有效地平行于第二图案化导电层。 第一导电层和第二导电层的重叠部分通过局部施加热量以熔化非导电区域中的导电材料而被图案化成空间匹配的导电区域和非导电区域,使得导电材料的表面张力导致 导电材料聚结成具有降低的导电层面积的结构。

    Transparent capacitor with multi-layer grid structure
    5.
    发明授权
    Transparent capacitor with multi-layer grid structure 有权
    具有多层网格结构的透明电容

    公开(公告)号:US09235298B2

    公开(公告)日:2016-01-12

    申请号:US13305815

    申请日:2011-11-29

    摘要: A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.

    摘要翻译: 透明电容器装置包括:第一透明基板,包括第一图案化导电层,其具有位于第一透明基板上方的第一导电材料; 位于所述第一图案化导电层上方的电介质层; 第二图案化导电层,包括位于所述介电层上的第二导电材料,其中所述第二图案不同于所述第一图案; 以及位于第二图案化导电层上方的第二透明衬底。 第一图案化导电层的第一导电材料的部分重叠第二图案化导电层的第二导电材料的部分。 第一和第二导电材料的重叠部分形成具有空间匹配导电和非导电区域的匹配图案化电导体,第一和第二图案化导电层的非导电区域具有封装的聚结的导电材料结构。

    Making imprinted micro-wire rib structure
    6.
    发明授权
    Making imprinted micro-wire rib structure 有权
    制作印刷微线肋结构

    公开(公告)号:US09161456B1

    公开(公告)日:2015-10-13

    申请号:US14476059

    申请日:2014-09-03

    IPC分类号: H01L21/4763 H05K3/12 H05K3/00

    摘要: A method of making a micro-wire rib structure includes providing a substrate and locating a curable layer on or over the substrate. The curable layer is imprinted and cured to form a cured layer including a cured-layer surface and a micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A curable conductive material is located in the micro-channel and cured to provide a cured electrical conductor forming a micro-wire in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

    摘要翻译: 制造微线肋结构的方法包括提供衬底并将可固化层定位在衬底上或衬底上。 可固化层被印迹固化以形成固化层,该固化层包括固化层表面和具有微通道深度的微通道,微通道底部,第一和第二微通道侧,以及一个或多个肋,其具有 相对的肋侧面和肋顶部限定肋高度小于微通道深度。 每个肋条位于第一和第二微通道侧之间,并且从微通道底部向固化层表面延伸。 可固化导电材料位于微通道中并固化以提供在微通道中形成微线的固化电导体。 微线从第一微通道侧,微通道底部,肋侧和肋顶部连续延伸到第二微通道侧,从第一微通道侧形成来自第一微通道侧的连续电导体 通道侧到第二微通道侧。

    Hybrid single-side touch screen
    7.
    发明授权
    Hybrid single-side touch screen 有权
    混合单面触摸屏

    公开(公告)号:US09058084B2

    公开(公告)日:2015-06-16

    申请号:US13862586

    申请日:2013-04-15

    IPC分类号: G06F3/041 G06F3/044

    摘要: A single-side touch-screen device includes a substrate having a cured layer with a patterned arrangement of micro-channels embossed therein and a cured electrically conductive micro-wire formed in each micro-channel. A patterned dielectric insulator is located over one or more middle portions of at least some of the micro-wires forming insulated micro-wire portions and exposed micro-wire portions. A plurality of patterned transparent conductors are conformally coated in an array over at least a part of the patterned dielectric insulator, at least a part of the insulated micro-wire portions, and at least a part of the exposed micro-wire portions, the at least a part of the exposed micro-wire portions electrically connected to at least a portion of the patterned transparent conductors. The transparent conductors and the micro-wires form an array of electrically connected horizontal electrodes and an array of electrically connected vertical electrodes electrically isolated from the horizontal electrodes.

    摘要翻译: 单面触摸屏装置包括具有固化层的基板,其具有压印在其中的微通道的图案化布置,以及形成在每个微通道中的固化的导电微线。 图案化的电介质绝缘体位于形成绝缘微线部分和暴露的微线部分的至少一些微线的一个或多个中间部分上。 多个图案化的透明导体以阵列方式共形地涂覆在图案化电介质绝缘体的至少一部分上,绝缘的微线部分的至少一部分和暴露的微线部分的至少一部分, 暴露的微线部分的至少一部分电连接到图案化的透明导体的至少一部分。 透明导体和微线形成电连接的水平电极的阵列和与水平电极电隔离的电连接的垂直电极的阵列。

    TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE
    8.
    发明申请
    TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE 有权
    具有多层网格结构的透明电容器

    公开(公告)号:US20130135548A1

    公开(公告)日:2013-05-30

    申请号:US13305815

    申请日:2011-11-29

    摘要: A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.

    摘要翻译: 透明电容器装置包括:第一透明基板,包括第一图案化导电层,其具有位于第一透明基板上方的第一导电材料; 位于所述第一图案化导电层上方的电介质层; 第二图案化导电层,包括位于所述介电层上的第二导电材料,其中所述第二图案不同于所述第一图案; 以及位于第二图案化导电层上方的第二透明衬底。 第一图案化导电层的第一导电材料的部分重叠第二图案化导电层的第二导电材料的部分。 第一和第二导电材料的重叠部分形成具有空间匹配导电和非导电区域的匹配图案化电导体,第一和第二图案化导电层的非导电区域具有封装的聚结的导电材料结构。

    IMPRINTED MULTI-LAYER BIOCIDAL PARTICLE STRUCTURE
    9.
    发明申请
    IMPRINTED MULTI-LAYER BIOCIDAL PARTICLE STRUCTURE 有权
    改进的多层生物颗粒结构

    公开(公告)号:US20160212988A1

    公开(公告)日:2016-07-28

    申请号:US14607100

    申请日:2015-01-28

    IPC分类号: A01N25/34

    摘要: A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the first cured layer.

    摘要翻译: 多层杀生物结构包括载体。 结构化双层位于支撑上或上方。 所述双层包括位于所述载体上或上方的第一固化层,以及在所述第一固化层的与所述载体相对的一侧上的第一固化层上或上的第二层。 结构化双层具有比第二层的厚度大至少一个深度。 多个杀生物颗粒仅位于第一固化层中。

    IMPRINTED MICRO-WIRE RIB STRUCTURE
    10.
    发明申请
    IMPRINTED MICRO-WIRE RIB STRUCTURE 有权
    凸版微结构RIB结构

    公开(公告)号:US20160066420A1

    公开(公告)日:2016-03-03

    申请号:US14476005

    申请日:2014-09-03

    IPC分类号: H05K1/09 H05K1/11

    摘要: A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

    摘要翻译: 微线肋结构包括基板和形成在基板上或上的固化层,固化层具有固化层表面。 微通道压印在固化层中,微通道具有微通道深度,微通道底部,第一和第二微通道侧,以及一个或多个肋,其具有相对的肋侧面和限定 肋高度小于微通道深度。 每个肋条位于第一和第二微通道侧之间,并从微通道底部向固化层表面延伸。 在微通道中形成形成微线的固化电导体。 微线从第一微通道侧连续延伸,在微通道底部,肋侧面和肋顶部到第二微通道侧,从第一微通道侧形成来自第一微通道侧的连续电导体, 通道侧到第二微通道侧。