摘要:
A stacked type semiconductor device comprising: a baseboard having a terminal row formed at an end in which connecting terminals is arranged linearly and having a wiring pattern connected to the connecting terminals and external terminals; semiconductor chips having a pad row in which pads is arranged linearly in parallel to the terminal row and being stacked on the baseboard; and interposer boards having a wiring layer including a plurality of wires arranged in parallel with the same length for connecting between pads of the pad row and connecting terminals of the terminal row.
摘要:
The present invention relates to a DRAM stacked packages, a DIMM, a method for testing them, and a semiconductor manufacturing method. According to the present invention, there is provided a DRAM stacked package comprising: a plurality of stacked DRAMs; external terminals to which test equipment is connected, said external terminals being used to input/output at least address, command, and data; and an interface chip provided between said plurality of stacked DRAMs and said external terminals. The plurality of DRAMs and the interface chip are implemented on a package. The interface chip comprises: a test circuit including: an algorithmic pattern generator for generating a test pattern used to test the plurality of DRAMs; applying circuits for applying said generated test pattern to the plurality of DRAMs; and a comparator for comparing each response signal received from the plurality of DRAMs with an expected value for judgment.
摘要:
The present invention relates to a DRAM stacked packages, a DIMM, a method for testing them, and a semiconductor manufacturing method. According to the present invention, there is provided a DRAM stacked package comprising: a plurality of stacked DRAMs; external terminals to which test equipment is connected, said external terminals being used to input/output at least address, command, and data; and an interface chip provided between said plurality of stacked DRAMs and said external terminals. The plurality of DRAMs and the interface chip are implemented on a package. The interface chip comprises: a test circuit including: an algorithmic pattern generator for generating a test pattern used to test the plurality of DRAMs; applying circuits for applying said generated test pattern to the plurality of DRAMs; and a comparator for comparing each response signal received from the plurality of DRAMs with an expected value for judgment.
摘要:
The present invention has a subject to provide an apparatus that optimizes scanning in accordance with circumstances or purposes, reduces distortion of images, and improves throughput, image quality, and defect detection rate by controlling deflection of a charged particle beam in a stage tracking system. To solve this subject, an apparatus according to the present invention is an inspection apparatus for detecting abnormal conditions of an inspection target by irradiating the inspection target with the charged particle beam and detecting generated secondary electrons, including both a stage that moves continuously with the inspection target placed thereon and a deflection control circuit for providing a deflector with a scanning signal that causes the charged particle beam to scan repeatedly in a direction substantially perpendicular to a stage movement axis direction while the charged particle beam being deflected in the stage movement axis direction in accordance with a change in movement speed of the stage during movement of the stage.
摘要:
In a semiconductor testing device of LSI or the like, a high-speed small-capacity memory (50) is provided in addition to low-speed large-capacity memories (11.about.14) for interleave operation, and test patterns after a branch operation are previously stored in the memory (50). When test patterns are to be read in sequence the reading is performed from the low-speed large-capacity memories (11.about.14), and when branch is produced in the reading sequence the changing is performed to the high-speed small-capacity memory (50) and the test patterns are read from the high-speed small-capacity memory (50) until the reading from the low-speed large-capacity memories (11.about.14) again becomes possible. Thereby, the test patterns of a large number can be outputted without generating a dummy cycle.
摘要:
According to one embodiment, a unit includes battery modules each including an assembled battery including battery cells and a monitoring device, a BMU to communicate with the battery modules, a first drawer holding the battery module, a second drawer holding the BMU, and a housing containing the first drawer and the second drawer. The first and second drawers include first composite connectors secured to a side of the housing, which is almost orthogonal to a direction in which to insert the drawers into the housing. The housing has second composite connectors which mate with the first composite connectors, thereby to connect communication lines between the monitoring device and the BMU and the main-circuit lines between the assembled batteries of the battery modules.
摘要:
A semiconductor inspecting apparatus includes: a buffer memory whose width is matched to the greater of parallel bus width and the width of the number of serial lanes; a preceding stage bus switching unit that fills the buffer memory with input data without making a free space; equivalent transmission capacity conversion including a following stage bus switching unit that fills read data to the width of an arbitrary number of serial lanes without making a free space; a preceding stage bus switching unit that fills a buffer memory with input data without making a free space; and equivalent transmission capacity inverse conversion including a following stage bus switching unit that fills a parallel bus of arbitrary width with data read from a buffer memory without making a free space.
摘要:
A testing circuit using ALPG is mounted in a testing board in which sockets for mounting semiconductor memories as devices to be tested in the board is mounted and a volatile memory for storing a data table for generating a random pattern is provided in the testing circuit so that a test using a test pattern having no regularity is performed using the data table in addition to a test using a test pattern having regularity generated by the ALPG.
摘要:
A system for implanting ions into a semiconductor wafer includes an ion source device, a mass spectrometer, an accelerating tube and a process chamber arranged in this order. A rotating disk is arranged in the process chamber to support a plurality of wafers thereon. A Faraday cup is arranged in the process chamber, corresponding to an ion beam shooting position. The Faraday cup serves to shut up therein secondary electrons and ions generated from the wafer at the time of ion implantation for measuring the amount of ions implanted. A suppressor electrode is provided to suppress the flow-out of the secondary electrons from the Faraday cup. The suppressor electrode comprises a cylindrical body made of carbon and an SiC film formed on the inner face of the cylindrical body. The SiC film serves as a resistance of the electrode surface for preventing rapid discharge from being caused at the electrode surface.
摘要:
An inspection device carries out beam scanning on a stable scanning cycle by enabling flexible change of various scanning sequences according to inspection conditions thereof, and at the same time, eliminates as much unevenness as possible in scanning cycle which hinders stabilization of charging. A beam scanning scheduler schedules beam scanning based on an inputted scanning condition, and a programmable sequencer carries out beam scanning control according to a beam scanning schedule generated by the beam scanning scheduler. The scanning scheduler calculates scanning line reference coordinates on a scanning-line-by-scanning-line basis, based on the scanning condition, and issues a scanning cycle trigger. The programmable sequencer controls supply timing of the scanning line reference coordinates and a scanning position on an in-line pixel-by-pixel basis, based on line scanning procedure information and the scanning cycle trigger provided from the beam scanning scheduler.