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公开(公告)号：US12074082B2
公开(公告)日：2024-08-27
申请号：US17604774
申请日：2019-06-06
Applicant: Mitsubishi Electric Corporation
Inventor： Tomohisa Yamane , Hisayuki Taki , Noriyuki Besshi , Yuya Muramatsu , Masaru Fuku
IPC: H01L23/34 , H01L23/31 , H01L23/367 , H02M7/00
CPC classification number: H01L23/3675 , H01L23/31 , H02M7/003 , H01L2924/181
Abstract: A reliable semiconductor module and a reliable power conversion device using the semiconductor module are obtained. A semiconductor module includes a heat dissipation member, a semiconductor device, and a thermally conductive insulating resin sheet. The thermally conductive insulating resin sheet connects the heat dissipation member and the semiconductor device. The semiconductor device includes a semiconductor element and a metal wiring member. The metal wiring member is electrically connected to the semiconductor element. The metal wiring member includes a terminal portion protruding outside the semiconductor device. In a surface portion of the semiconductor device, a concave portion is formed outward of a partial region to which the thermally conductive insulating resin sheet is connected. The concave portion is located in a region closer to the heat dissipation member than the terminal portion.
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公开(公告)号：US12094798B2
公开(公告)日：2024-09-17
申请号：US17618886
申请日：2019-08-26
Applicant: Mitsubishi Electric Corporation
Inventor： Hiroshi Kobayashi , Tomohisa Yamane , Shinnosuke Soda
CPC classification number: H01L23/36 , H01L21/02304 , H01L23/10 , H01L23/3107 , H01L23/3142 , H01L23/367 , H01L23/46 , H01L24/26 , H01L25/07 , H01L2924/181
Abstract: Provided is a semiconductor device that prevents resin from leaking out from a resin insulating member at a periphery of the resin insulating member and thereby achieves an increase in reliability. The semiconductor device includes a module unit, a resin insulating member bonded to the module unit, a cooling unit coupled to the module unit with the resin insulating member interposed therebetween, and a flow blocking member disposed between the module unit and the cooling unit to surround the resin insulating member, the flow blocking member being more easily compressively deformable than the resin insulating member.
