公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。

公开(公告)号：US5565034A

公开(公告)日：1996-10-15

申请号：US331083

申请日：1994-10-28

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

摘要翻译： 根据本发明的基板处理装置包括接口部分，其具有第一传送部件，用于从涂覆处理部分传送物体，用于根据单个片材处理将物体施加到物体上，并将物体保持部件移动 用于可拆卸地供给多个物体保持部件并同时移动多个物体保持部件的部件，以及具有用于将放置在物体保持部件上的物体转印到热处理部的热转印部件的热处理部， 根据分批处理对经过涂覆处理的多个物体进行处理。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5928390A

公开(公告)日：1999-07-27

申请号：US787862

申请日：1997-01-23

申请人： Hidetami Yaegashi ,  Takayuki Toshima ,  Masami Akimoto ,  Eiji Yamaguchi ,  Junichi Kitano ,  Takayuki Katano ,  Hiroshi Shinya ,  Naruaki Iida

发明人： Hidetami Yaegashi ,  Takayuki Toshima ,  Masami Akimoto ,  Eiji Yamaguchi ,  Junichi Kitano ,  Takayuki Katano ,  Hiroshi Shinya ,  Naruaki Iida

IPC分类号： H01L21/00 ,  H01L21/68 ,  B23P21/00 ,  B65G49/07 ,  H01L21/027

CPC分类号： H01L21/67178 ,  H01L21/67196 ,  H01L21/67225 ,  H01L21/67742 ,  Y10T29/41

摘要： A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.

摘要翻译： 处理装置包括多个处理单元组，每个处理单元组包括用于对象进行一系列处理的多个处理单元，处理单元以多级垂直排列，在处理单元组之间定义对象传送空间，以及 用于传送物体的传送机构，传送机构具有可在物体传送空间中垂直移动的传送部件，传送部件能够将物体传送到每个处理单元。 处理装置还包括用于在物体传送空间中形成向下的空气流的机构，用于控制向下的空气流量的机构，以及用于控制物体传送空间中的压力的​​机构。 因此，物体传送空间的状态的变化减小。

公开(公告)号：USRE37470E1

公开(公告)日：2001-12-18

申请号：US09388589

申请日：1999-09-02

申请人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： G03D500

CPC分类号： H01L21/6715 ,  H01L21/67781 ,  H01L21/68707

摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.

摘要翻译： 晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构， 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中， 多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在 臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。

公开(公告)号：US5664254A

公开(公告)日：1997-09-02

申请号：US594937

申请日：1996-01-31

申请人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Jun Ohkura ,  Naruaki Iida ,  Hiroyuki Kudou ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687 ,  G03D5/00 ,  G03D3/08

CPC分类号： H01L21/6715 ,  H01L21/67781 ,  H01L21/68707

摘要： A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle .theta. to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection result from the optical sensor, wherein the controller advances or retreats each holding arm while operating at least one of the main handler and the arm section, and causes the optical sensor to detect the holding state of the wafer by each holding arm before the holding arm reaches a corresponding one of the process units.

摘要翻译： 晶片处理装置包括在Y轴方向上延伸的公共路径，其中一个晶片或多个晶片被输送，多个处理单元堆叠在公共路径的两侧以构成多级结构， 主处理器沿着Y轴方向在公共路径中移动并且以角度θ围绕Z轴旋转以将晶片装载/卸载到处理单元中/从加工单元中卸载晶片，臂部分布置成在Z轴方向上移动到主处理器中， 多个保持臂，布置在所述臂部中，以构成多个阶段结构，以分别保持晶片，每个保持臂从臂部在XY平面上前进和后退;光学传感器，布置在 臂部，用于检测多个保持臂中的每一个中的晶片的保持状态;以及控制器，用于控制主处理器的操作，臂部的操作以及多个保持臂的操作 bas 具有来自光学传感器的检测结果，其中控制器在操作主处理器和臂部分中的至少一个的同时前进或后退每个保持臂，并且使得光学传感器通过每个保持臂检测晶片的保持状态 在握持臂到达相应的一个处理单元之前。

公开(公告)号：US08985929B2

公开(公告)日：2015-03-24

申请号：US13611555

申请日：2012-09-12

申请人： Suguru Enokida ,  Masahiro Nakaharada ,  Akira Miyata ,  Hidekazu Kiyama ,  Naruaki Iida

发明人： Suguru Enokida ,  Masahiro Nakaharada ,  Akira Miyata ,  Hidekazu Kiyama ,  Naruaki Iida

IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67178 ,  H01L21/67745 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/137 ,  Y10S414/139

摘要： A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.

摘要翻译： 基板处理装置包括：载体块，其包括沿左右方向间隔开的第一和第二载体放置单元; 具有层叠结构的处理块，其中多个层叠部分垂直布置，所述层叠部分各自包括用于输送基板的基板传送机构和用于处理基板的处理模块; 塔架单元，其包括多个基板放置单元，位于基板通过与基板放置单元对应的层叠部的基板输送机构转印的高度位置; 第一基板传送机构，被配置为在第一载体放置单元上的载体和塔单元的基板放置单元之间传送基板; 以及第二基板输送机构，被配置为将基板转移到第二基板放置单元上的载体和塔单元的基板放置单元之间。

公开(公告)号：US20070160454A1

公开(公告)日：2007-07-12

申请号：US11616484

申请日：2006-12-27

申请人： Naruaki Iida

发明人： Naruaki Iida

IPC分类号： B65H1/00 ,  C23F1/00 ,  C23C16/00

CPC分类号： B65G49/065 ,  B65G2249/02 ,  B65G2249/04 ,  H01L21/67784

摘要： A substrate carrying device capable of causing a substrate to float by a gas can be manufactured at a low manufacturing cost and can suppress the consumption of a gas for carrying the substrate. The substrate carrying device includes a carrying passage forming member forming a carrying passage along which a substrate is carried, exhaust grooves extending parallel to the carrying passage in the upper surface of the carrying passage forming member, a plurality of pairs each of right and left carrying gas flow grooves formed in the upper surface of the carrying passage forming member, inclined to a substrate carrying direction so as to approach the exhaust grooves from the right-hand side and the left-hand side of the exhaust grooves, respectively, and having inner ends joined to the exhaust grooves, respectively, and gas spouting pores formed near outer ends of the carrying gas flow grooves to spout a gas for causing the substrate to float and for creating substrate carrying gas flows flowing from the outer ends of the carrying gas flow grooves toward the inner ends of the carrying gas flow grooves. The gas spouted through the gas spouting pores causes the substrate to float and creates gas flows in the carrying gas flow grooves to propel the substrate in a carrying direction. The carrying passage is divided with respect to the carrying direction into passage sections, and the spouting of the gas through groups of the gas spouting pores assigned respectively to the passage sections is controlled to suppress the consumption of the gas.

摘要翻译： 能够以低的制造成本制造能够使基板由气体漂浮的基板承载装置，并且可以抑制用于承载基板的气体的消耗。 基板承载装置包括：承载通道形成构件，其形成承载基板的承载通道，在承载通道形成构件的上表面中平行于输送通道延伸的排出槽，多个左右的承载通道 形成在输送通道形成部件的上表面中的气体流动槽分别倾斜到基板输送方向，以便从排气槽的右侧和左侧接近排气槽，并且具有内部 分别连接到排气槽的端部和在承载气体流动槽的外端附近形成的气体喷出孔，以喷出用于使基板浮起的气体，以及用于产生从承载气体流的外端流动的衬底承载气体流 凹槽朝向承载气流槽的内端。 通过气体喷出的气体喷出的气体导致基板浮起并在承载气体流动槽中产生气体流动，从而沿着输送方向推进基板。 输送通道相对于输送方向被分割成通道部分，并且通过分配到通道部分的气体喷出孔的组中的气体的喷射被控制以抑制气体的消耗。

公开(公告)号：US06709545B2

公开(公告)日：2004-03-23

申请号：US10035122

申请日：2002-01-04

申请人： Naruaki Iida

发明人： Naruaki Iida

IPC分类号： C23F0100

CPC分类号： H01L21/67706 ,  H01L21/67017 ,  Y10S414/135 ,  Y10S414/139

摘要： In order to alleviate the affect of particles generated during operation of an elevation mechanism of a substrate conveyer means on the substrate that is transported in a substrate processing apparatus, a partition wall having a slit-like hole is provided in a casing that forms the outer housing of the elevation mechanism, whereby the casing is divided into a first chamber and a second chamber. A conveyer main unit holding a wafer is fixed to a rod-like support member. The support member has its end supported by a guide shaft. The guide shaft and a driving mechanism to move the support member upwards and downwards are provided in the first chamber. The support member descends and ascends along the guide shaft. A fan is disposed in the second chamber. A discharge outlet is formed at the bottom plane of the second chamber. By driving the fan, the atmosphere in the first chamber is attracted via the hole of the partition wall, whereby particles generated during the elevation of the conveyer main unit are discharged from the discharge outlet via the second chamber.

摘要翻译： 为了减轻在基板处理装置中输送的基板上的基板输送装置的升降机构的运转时产生的粒子的影响，在形成外部的壳体中设置有具有狭缝状的孔的分隔壁 升降机构的壳体，由此将壳体分成第一室和第二室。 保持晶片的输送机主体固定在棒状支撑部件上。 支撑构件的端部由导向轴支撑。 引导轴和用于使支撑构件向上和向下移动的驱动机构设置在第一室中。 支撑构件沿导向轴下降并上升。 风扇设置在第二室中。 排出口形成在第二室的底面。 通过驱动风扇，第一室中的气氛通过分隔壁的孔而被吸引，由此在输送机主单元的升高期间产生的颗粒经由第二室从排出口排出。

公开(公告)号：US6050389A

公开(公告)日：2000-04-18

申请号：US118830

申请日：1998-07-20

申请人： Naruaki Iida ,  Seiji Kozawa

发明人： Naruaki Iida ,  Seiji Kozawa

IPC分类号： B65G43/02 ,  B65G43/08 ,  B65G49/07 ,  H01L21/027 ,  H01L21/677 ,  B65G43/00

CPC分类号： H01L21/67742 ,  H01L21/67748 ,  Y10S414/137

摘要： A carrier apparatus is provided with a first carrier mechanism, a second carrier mechanism, and a sensor. The first carrier mechanism has a holding portion holding a substrate, a driving pulley, an idler pulley, and a first endless belt, the first endless belt being provided between the driving pulley and the idler pulley and the holding portion being attached to the first endless belt. The second carrier mechanism has a driving source with a rotation output shaft, a speed reducing pulley fixed on the driving pulley and more than one second endless belts, the above more than one second endless belts being provided between the rotation output shaft and the speed reducing pulley. A sensor detects the state of the second endless belt, for example, the occurrence of cutting. As a result, even if the state of a carrier belt deteriorates, the holding portion is prevented from falling.

摘要翻译： 载体装置设置有第一载体机构，第二载体机构和传感器。 第一承载机构具有保持基板，驱动带轮，惰轮和第一环形带的保持部，第一环形带设置在驱动带轮和惰轮之间，保持部附接到第一环 带。 第二承载机构具有驱动源，其具有旋转输出轴，固定在驱动滑轮上的减速轮和多于一个的第二环形带，上述多于一个的第二环形带设置在旋转输出轴与减速之间 滑轮。 传感器检测第二环形带的状态，例如发生切割。 结果，即使载体带的状态劣化，也可以防止保持部落下。