公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。

公开(公告)号：US5565034A

公开(公告)日：1996-10-15

申请号：US331083

申请日：1994-10-28

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

摘要翻译： 根据本发明的基板处理装置包括接口部分，其具有第一传送部件，用于从涂覆处理部分传送物体，用于根据单个片材处理将物体施加到物体上，并将物体保持部件移动 用于可拆卸地供给多个物体保持部件并同时移动多个物体保持部件的部件，以及具有用于将放置在物体保持部件上的物体转印到热处理部的热转印部件的热处理部， 根据分批处理对经过涂覆处理的多个物体进行处理。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5518542A

公开(公告)日：1996-05-21

申请号：US336213

申请日：1994-11-04

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B05C1/00

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5686143A

公开(公告)日：1997-11-11

申请号：US597536

申请日：1996-02-02

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B05D3/00

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5964954A

公开(公告)日：1999-10-12

申请号：US890996

申请日：1997-07-10

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B08B7/00 ,  B08B7/04

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从载体台取出的物体的传送机构，至少一个清洁机构， 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5733375A

公开(公告)日：1998-03-31

申请号：US580620

申请日：1995-12-29

申请人： Takahide Fukuda ,  Shinichiro Izumi ,  Yoshio Kimura ,  Yuuji Matsuyama ,  Satoshi Morita ,  Kunie Tsunematsu

发明人： Takahide Fukuda ,  Shinichiro Izumi ,  Yoshio Kimura ,  Yuuji Matsuyama ,  Satoshi Morita ,  Kunie Tsunematsu

IPC分类号： C23C16/448 ,  C23C16/00 ,  B01F3/04

CPC分类号： C23C16/4482

摘要： An apparatus for supplying a treating material to a treating device has a tank containing a liquid treating material and a heat exchanger formed by a spiral pipe and provided in the tank. A nitrogen gas (N.sub.2 gas) is introduced into the tank and evaporates the liquid treating material. Water is supplied from a fluid inlet pipe connected to the lower portion of the exchanger to a fluid outlet pipe connected to the upper portion of the exchanger through the spiral pipe of the exchanger. In the heat exchange, heat exchange between the water and the liquid treating material is performed very efficiently. No use of electric power provides high safety. The temperature of the liquid treating material which is changed into a gas state by a bubbling process is controlled efficiently and the density of the vaporized treating material in the tank is made stable.

摘要翻译： 一种用于将处理材料供给到处理装置的装置具有容纳液体处理材料的容器和由螺旋管形成的热交换器并设置在罐中。 将氮气（N 2气）引入罐中并蒸发液体处理材料。 水从连接到交换器下部的流体入口管供给到通过交换器的螺旋管连接到交换器的上部的流体出口管。 在热交换中，水和液体处理材料之间的热交换非常有效地进行。 不使用电力提供高安全性。 有效地控制通过鼓泡处理而变为气态的液体处理材料的温度，使罐内的汽化处理材料的密度稳定。