公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。

公开(公告)号：US5565034A

公开(公告)日：1996-10-15

申请号：US331083

申请日：1994-10-28

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

摘要翻译： 根据本发明的基板处理装置包括接口部分，其具有第一传送部件，用于从涂覆处理部分传送物体，用于根据单个片材处理将物体施加到物体上，并将物体保持部件移动 用于可拆卸地供给多个物体保持部件并同时移动多个物体保持部件的部件，以及具有用于将放置在物体保持部件上的物体转印到热处理部的热转印部件的热处理部， 根据分批处理对经过涂覆处理的多个物体进行处理。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5518542A

公开(公告)日：1996-05-21

申请号：US336213

申请日：1994-11-04

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B05C1/00

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5964954A

公开(公告)日：1999-10-12

申请号：US890996

申请日：1997-07-10

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B08B7/00 ,  B08B7/04

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从载体台取出的物体的传送机构，至少一个清洁机构， 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5686143A

公开(公告)日：1997-11-11

申请号：US597536

申请日：1996-02-02

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B05D3/00

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5665200A

公开(公告)日：1997-09-09

申请号：US524528

申请日：1995-09-07

申请人： Akihiro Fujimoto ,  Takashi Takekuma ,  Kiyomi Sonobe

发明人： Akihiro Fujimoto ,  Takashi Takekuma ,  Kiyomi Sonobe

IPC分类号： G03F7/20 ,  H01L21/00

CPC分类号： H01L21/6715 ,  G03F7/70691

摘要： The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.

摘要翻译： 本发明提供了一种基板处理方法，其特征在于，包括在具有第一处理单元和第二处理单元的处理室的第一处理单元中对被处理物体涂布处理液的涂布工序，从所述第一处理单元 在所述第二处理单元中，冲洗残留在所述第二处理单元中的所述物体的周边部分上的不必要的处理液以除去不需要的处理液的所述冲洗步骤，以及将所清洗的物体输送到曝光装置以进行曝光的曝光步骤 曝光处理，其中从待处理对象的冲洗步骤结束到下一个待处理对象的冲洗步骤结束的时间比一个物体的曝光步骤所需的时间短 。

公开(公告)号：US5580607A

公开(公告)日：1996-12-03

申请号：US186879

申请日：1994-01-26

申请人： Takashi Takekuma ,  Masaaki Murakami ,  Masatoshi Deguchi ,  Akihiro Fujimoto

发明人： Takashi Takekuma ,  Masaaki Murakami ,  Masatoshi Deguchi ,  Akihiro Fujimoto

IPC分类号： B05C11/08 ,  B05D1/00 ,  H01L21/00 ,  B05D3/12

CPC分类号： H01L21/67173 ,  B05C11/08 ,  B05D1/005 ,  H01L21/67109 ,  H01L21/6715

摘要： A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.

摘要翻译： 一种涂覆装置，包括：一个卡盘，一个半导体晶片被粘在其上;一个用于向半导体晶片提供抗蚀剂液体的抗蚀剂供应系统;一个用于旋转半导体晶片的马达，从而将抗蚀剂液体扩散到半导体晶片上; ，其上放置有半导体晶片，用于在半导体晶片上产生温度分布。

公开(公告)号：US06284043B1

公开(公告)日：2001-09-04

申请号：US09109104

申请日：1998-07-02

申请人： Takashi Takekuma

发明人： Takashi Takekuma

IPC分类号： B05C502

CPC分类号： H01L21/67126 ,  B05B1/20 ,  B05C5/002 ,  B05C11/025 ,  B05C11/08

摘要： In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

摘要翻译： 在固溶处理装置中，将处理液朝向由旋转卡盘保持的基板排出的喷嘴包括用于将处理液排出到基板的表面上的排出口。 从喷嘴排出的处理液碰撞的碰撞体配置在喷嘴的排出口与基板之间。 由于碰撞体设置在排出口和基板之间，所以即使处理液的排出压力高，排出的处理液一旦与碰撞体碰撞，使得到达基板的排出速度降低， 使基板松弛，进入排出的处理液的空气量减少。 因此，不会发生微气泡。

公开(公告)号：US06258167B1

公开(公告)日：2001-07-10

申请号：US09334272

申请日：1999-06-16

申请人： Yukihiro Kawano ,  Takashi Takekuma

发明人： Yukihiro Kawano ,  Takashi Takekuma

IPC分类号： B05C502

CPC分类号： H01L21/6715 ,  B05B15/50 ,  B05C5/001 ,  B05C5/004 ,  B05C5/005 ,  B05C5/0254 ,  B05C11/08 ,  B05C11/1039

摘要： An apparatus for forming a film of a process liquid, comprising a mounting table for supporting the substrate to be processed substantially horizontally, a process liquid supply device for supplying a process liquid for processing the substrate, a linear nozzle having a header space which has a length substantially corresponding to a diameter of the substrate and a liquid discharge portion, the header space mutually communicating with the liquid discharge portion, a liquid inlet port which communicates with the process liquid supply device and whose opening is formed above the header space, a moving device for relatively moving the linear nozzle and the mounting table while the liquid discharge portion faces the substrate on the mounting table, and a control device for controlling a viscosity of the photoresist solution within the header space or controlling a temperature of the developing liquid in the header space.

摘要翻译： 一种用于形成工艺液体膜的设备，包括：用于基本上水平地支撑待加工的基板的安装台，用于供应处理基板的处理液的处理液供给装置，具有头部空间的线性喷嘴， 长度基本上对应于基板的直径和液体排出部分，与液体排出部分相互连通的集管空间，与处理液体供应装置连通并且其开口形成在集管空间上方的液体入口端口，移动 用于在液体排出部分面向安装台上的基板时相对移动线性喷嘴和安装台的装置，以及用于控制在集管空间内的光致抗蚀剂溶液的粘度或控制显影液体的温度的控制装置 标题空间。