公开(公告)号：US5089305A

公开(公告)日：1992-02-18

申请号：US585199

申请日：1990-09-20

申请人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

发明人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

IPC分类号： B05B15/02 ,  B05C11/08 ,  G03F7/16

CPC分类号： B05B15/025 ,  B05C11/08 ,  G03F7/162

摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

公开(公告)号：US5002008A

公开(公告)日：1991-03-26

申请号：US357279

申请日：1989-05-26

申请人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

发明人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

IPC分类号： B05B15/02 ,  B05C11/08 ,  G03F7/16

CPC分类号： B05B15/025 ,  B05C11/08 ,  G03F7/162

摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

摘要翻译： 公开了一种将抗蚀剂或显影液施加到半导体晶片的涂布装置。 该涂布装置包括从抗蚀剂源供给各种抗蚀剂的多个喷嘴，每个喷嘴适于将不同的溶液滴到晶片上，其中喷嘴保持待机的容器，同时将液体保持在预定状态 喷嘴的排出口部分附近，当喷嘴不需要操作时，以及喷嘴操作机构，用于选择在容器中保持待机的喷嘴之一，并将所选择的喷嘴输送到晶片的位置， 由此通过仅由喷嘴操作机构传送的喷嘴将抗蚀剂施加到晶片。

公开(公告)号：US5061144A

公开(公告)日：1991-10-29

申请号：US442535

申请日：1989-11-28

申请人： Masami Akimoto ,  Yoshio Kimura ,  Osamu Hirakawa ,  Noriyuki Anai ,  Masanori Tateyama ,  Yasuhiro Sakamoto

发明人： Masami Akimoto ,  Yoshio Kimura ,  Osamu Hirakawa ,  Noriyuki Anai ,  Masanori Tateyama ,  Yasuhiro Sakamoto

IPC分类号： G03F7/26 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/68707 ,  G03F7/26 ,  H01L21/67778 ,  Y10S414/135 ,  Y10S414/137

摘要： A resist process apparatus of the invention serves to load/unload a semiconductor wafer in/from the respective process mechanisms. The apparatus includes a wafer holding member for holding a semiconductor wafer, and X, Y, Z and .theta. driving mechanisms for conveying the wafer holding member to a resist coating mechanism and the like. The wafer holding member includes a support frame which is larger than diameter of a semiconductor wafer, and a plurality of support members, arranged on the support frame, for supporting the semiconductor wafer in partial contact with the peripheral portion of the semiconductor wafer. Since the contact area between the support members and a semiconductor wafer is small, changes in temperature of the semiconductor, when it is held, are small.

摘要翻译： 本发明的抗蚀剂处理装置用于在各个加工机构中加载/卸载半导体晶片。 该装置包括用于保持半导体晶片的晶片保持构件和用于将晶片保持构件输送到抗蚀剂涂覆机构等的X，Y，Z和θ驱动机构。 晶片保持构件包括比半导体晶片的直径大的支撑框架和布置在支撑框架上的多个支撑构件，用于支撑半导体晶片与半导体晶片的周边部分部分接触。 由于支撑构件和半导体晶片之间的接触面积小，因此在保持时半导体的温度变化小。

公开(公告)号：US5028955A

公开(公告)日：1991-07-02

申请号：US480005

申请日：1990-02-14

申请人： Yasushi Hayashida ,  Noriyuki Anai ,  Osamu Hirakawa ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Keisuke Shigaki ,  Masashi Moriyama

发明人： Yasushi Hayashida ,  Noriyuki Anai ,  Osamu Hirakawa ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Keisuke Shigaki ,  Masashi Moriyama

IPC分类号： G03F7/20

CPC分类号： G03F7/70725 ,  G03F7/2051

摘要： An exposure apparatus of this invention is used in an exposure process of semiconductor and LCD devices. The exposure apparatus includes a stage on which a semiconductor wafer is placed, a rotating mechanism for rotating the stage, a radiation unit arranged to oppose a support surface of the stage, a slider mechanism for reciprocating the radiation unit along a straight line passing through the center of the support surface of the stage, an exposure range input unit for inputting a desired exposure range of the wafer, an exposure range memory unit for storing the input exposure range, a CCD image sensor for detecting a reference position of the wafer, a relative position detector for detecting a relative position between the detected reference position and the radiation unit, a controller for controlling the sliding mechanism in correspondence with the relative position and the exposure range, and a light amount control mechanism for controlling an amount of light radiated from the irradiation mechanism to the wafer in correspondence with the relative position and the exposure range.

摘要翻译： 本发明的曝光装置用于半导体和LCD装置的曝光处理。 曝光装置包括其上放置有半导体晶片的台，用于旋转台的旋转机构，布置成与舞台的支撑表面相对的辐射单元，用于使辐射单元沿着穿过 舞台的支撑表面的中心，用于输入晶片的期望曝光范围的曝光范围输入单元，用于存储输入曝光范围的曝光范围存储单元，用于检测晶片的参考位置的CCD图像传感器， 相对位置检测器，用于检测检测到的基准位置和辐射单元之间的相对位置，控制器，用于根据相对位置和曝光范围来控制滑动机构;以及光量控制机构，用于控制从 对应于相对位置和曝光范围的到晶片的照射机构。

公开(公告)号：US06261007B1

公开(公告)日：2001-07-17

申请号：US09362860

申请日：1999-07-29

申请人： Hideyuki Takamori ,  Kiyohisa Tateyama ,  Kengo Mizosaki ,  Noriyuki Anai ,  Mitsuhiro Sakai ,  Shinobu Tanaka ,  Yoichi Honda ,  Yuji Shimomura

发明人： Hideyuki Takamori ,  Kiyohisa Tateyama ,  Kengo Mizosaki ,  Noriyuki Anai ,  Mitsuhiro Sakai ,  Shinobu Tanaka ,  Yoichi Honda ,  Yuji Shimomura

IPC分类号： G03D500

CPC分类号： H01L21/6715 ,  G03F7/168 ,  H01L21/67034

摘要： Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.

摘要翻译： 刚刚将抗蚀剂溶液涂覆在基材上之后，其基本处于非加热状态。 实际上，惯性气体等从喷头吹送到基板。 因此，涂布在基板上的抗蚀剂溶液被干燥。 因此，可以防止导致抗蚀剂膜的膜厚度不均匀的转印标记和电路图案的线宽波动。

公开(公告)号：US5782990A

公开(公告)日：1998-07-21

申请号：US789537

申请日：1997-01-27

申请人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.

摘要翻译： 用于清洗物体的清洗方法包括以下步骤：将洗涤液体供应到洗涤容器中，并将物品浸入容纳在洗涤容器中的洗涤液体中。 该方法还包括以下步骤：从洗涤容器排出至少一次液体，并且当液体从洗涤容器中排出时，当物体部分暴露在空气中时，开始将洗涤液施加到物体上。 在将物体暴露于空气中期间继续洗涤液体的应用，以防止物体的表面被干燥和染色。

公开(公告)号：US5671764A

公开(公告)日：1997-09-30

申请号：US560708

申请日：1995-11-20

申请人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677 ,  B08B15/00

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

摘要翻译： 本文公开了一种洗涤装置，包括洗涤室，打开/关闭机构和喷嘴。 该室具有开口，设计用于清洗从外部通过开口运送的物体。 打开/关闭机构设计成打开和关闭洗涤室的开口。 喷嘴用于清洗打开/关闭机构。 该装置还包括一个填充有洗涤液体的洗涤容器，用于清洗物体，还有一个喷嘴，用于当清洗液体从洗涤液中排出时物体被部分暴露时，将洗涤液施加到位于洗涤容器中的物体上 船只。

公开(公告)号：US06444409B1

公开(公告)日：2002-09-03

申请号：US09875022

申请日：2001-06-07

申请人： Shinichiro Araki ,  Shinko Matsumoto ,  Noriyuki Anai

发明人： Shinichiro Araki ,  Shinko Matsumoto ,  Noriyuki Anai

IPC分类号： G03F716

摘要： A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.

公开(公告)号：US06270576B1

公开(公告)日：2001-08-07

申请号：US09365782

申请日：1999-08-03

申请人： Shinichiro Araki ,  Shinko Matsumoto ,  Noriyuki Anai

发明人： Shinichiro Araki ,  Shinko Matsumoto ,  Noriyuki Anai

IPC分类号： G02B520

CPC分类号： H01L21/6715 ,  B05C11/08 ,  G02B5/201 ,  G03F7/0007 ,  G03F7/162 ,  G03F7/3021 ,  Y10S430/136

摘要： A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.

摘要翻译： 一种涂覆和显影装置，用于用多种着色剂涂覆基材并在曝光后将其显影，包括：用于洗涤基材的洗涤单元; 涂覆单元，具有多个抗蚀剂排出喷嘴，用于分别在洗涤的基板上排出多个着色抗蚀剂; 以及显影单元，用于在曝光之后显影涂有彩色抗蚀剂的基材。 因此，可以实现装置的尺寸的减小和空间的节省，并且还可以降低制造成本。

公开(公告)号：US5887604A

公开(公告)日：1999-03-30

申请号：US743836

申请日：1996-11-05

申请人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

摘要翻译： 本文公开了一种洗涤装置，包括洗涤室，打开/关闭机构和喷嘴。 该室具有开口，设计用于清洗从外部通过开口运送的物体。 打开/关闭机构设计成打开和关闭洗涤室的开口。 喷嘴用于清洗打开/关闭机构。 该装置还包括一个填充有洗涤液体的洗涤容器，用于清洗物体，还有一个喷嘴，用于当洗涤液从洗涤液中排出时，当物体被部分暴露时，将洗涤液施加到位于洗涤容器中的物体上 船只。