公开(公告)号：US06332724B1

公开(公告)日：2001-12-25

申请号：US09653162

申请日：2000-09-01

申请人： Mitsuteru Yano ,  Norio Semba ,  Kouzou Kanagawa ,  Issei Ueda ,  Masami Akimoto ,  Kazuhiko Ohi

发明人： Mitsuteru Yano ,  Norio Semba ,  Kouzou Kanagawa ,  Issei Ueda ,  Masami Akimoto ,  Kazuhiko Ohi

IPC分类号： H01L21027

CPC分类号： H01L21/67248 ,  G03F7/16 ,  G03F7/30 ,  H01L21/67109 ,  Y10S134/902

摘要： Outside air taken in from the outside is cooled to a predetermined temperature by a cooler, and the air cooled by the cooler flows through a low temperature side flow path in a heat exchanger, whereas outside air flows through a high temperature side flow path in the heat exchanger, which allows heat to be exchanged between the cooled air and the outside air. The air, flowing through the low temperature side flow path in the heat exchanger and warmed up by the outside air flowing through the high temperature side flow path, is warmed and humidified by a warmer and a humidifier, and the air with predetermined temperature and humidity is supplied to a coating processing unit. Moreover, the outside air, flowing through the high temperature side flow path in the heat exchanger and cooled by the air flowing through the low temperature side flow path, is warmed by a warmer, and the air with a predetermined temperature is supplied to a developing processing unit. Thus, an apparatus for regulating the temperature and humidity of air to be supplied to the coating processing unit and the developing processing unit can be downsized, and running costs for electric power consumption and the like can be reduced.

摘要翻译： 从外部吸入的外部空气通过冷却器被冷却到预定温度，并且由冷却器冷却的空气在热交换器中流过低温侧流路，而外部空气流过高温侧流路 热交换器，其允许在冷却的空气和外部空气之间进行热交换。 在热交换器中流过低温侧流路的空气被流经高温侧流路的外部空气加热，通过加温器和加湿器进行加热和加湿，并且具有预定温度和湿度的空气 被供给到涂布处理单元。 此外，在热交换器中流过高温侧流路并通过流经低温侧流路的空气进行冷却的外部空气被加热器加热，并且将具有预定温度的空气供给到显影 处理单元。 因此，可以将用于调节供给到涂布处理单元和显影处理单元的空气的温度和湿度的装置小型化，并且可以减少耗电量等的运行成本。

公开(公告)号：US06736556B2

公开(公告)日：2004-05-18

申请号：US10310859

申请日：2002-12-06

申请人： Kouzou Kanagawa

发明人： Kouzou Kanagawa

IPC分类号： G03D500

CPC分类号： H01L21/67017 ,  G03F7/162 ,  G03F7/3021

摘要： A resist coating unit includes a coater cup surrounding a wafer W held by a spin chuck and an air supply mechanism for blowing an air into the coater cup. The air supply mechanism includes a hollow frame having a first open portion formed in the vertical wall, an air blowing device for blowing an air into the hollow frame, and a filter chamber unit into which the air within the frame is introduced. The filter chamber unit includes a first air introducing chamber having a heater arranged therein, a second air introducing chamber, an air stream control mechanism, and a filter unit. The air flowing within the frame flows into the first air introducing chamber through the first open portion so as to be uniformly heated by the heater and, then, is introduced into the second air introducing chamber. Then, the air uniformly heated by the heater is blown into the coater cup through the air stream control mechanism and the filter unit.

摘要翻译： 抗蚀剂涂布单元包括围绕由旋转卡盘保持的晶片W的涂布机杯和用于将空气吹入涂布杯中的空气供应机构。 空气供给机构包括具有形成在垂直壁中的第一开口部分的空心框架，用于将空气吹入中空框架的空气吹送装置以及引入框架内的空气的过滤室单元。 过滤室单元包括具有布置在其中的加热器的第一空气引入室，第二空气引入室，空气流控制机构和过滤器单元。 在框架内流动的空气通过第一开口部分流入第一空气引入室，以便被加热器均匀地加热，然后被引入第二空气引入室。 然后，由加热器均匀加热的空气通过空气流控制机构和过滤器单元吹入涂布杯。

公开(公告)号：US20070074745A1

公开(公告)日：2007-04-05

申请号：US11529504

申请日：2006-09-29

申请人： Yoshio Kimura ,  Kouzou Kanagawa

发明人： Yoshio Kimura ,  Kouzou Kanagawa

IPC分类号： B08B6/00 ,  B08B7/00 ,  H01L21/00

CPC分类号： H01L21/67225

摘要： Disclosed is an exhaust system for discharging a fluid which is supplied into a hermetically closed container 54 for containing a semiconductor wafer W, a substrate to be supplied in the container 54 and subjected to a process. The exhaust system comprises an outer exhaust pipe 71 which is connected to the hermetically closed container via an exhaust connecting pipe 68 and has closed top and bottom ends, a downstream guide passage 201 which is provided in the outer exhaust pipe 71 and adapted to downwardly guide an exhaust fluid flowing through the outer exhaust pipe 71, and an upstream guide passage 202 which is adapted to upwardly guide the exhaust fluid having flowed through the downstream guide passage 201 as well as to cause foreign matter or the like in the exhaust fluid to be settled by gravity. The exhaust fluid having flowed through the upstream guide passage 202 is discharged from a discharging passage 203 to the outside.

摘要翻译： 公开了一种用于排出供给到用于容纳半导体晶片W的密封容器54中的流体的排气系统，将被供给到容器54中并进行处理的基板。 排气系统包括外排气管71，其通过排气连接管68连接到密封容器，并且具有封闭的顶端和底端，下游引导通道201设置在外排气管71中并适于向下引导 流经外排气管71的废气流体，以及上游引导通道202，其适于向上引导已流过下游引导通道201的排出流体，并使排气流体中的异物等引起 通过重力沉降。 已经流过上游引导通道202的排出流体从排放通道203排出到外部。