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64 条记录 (耗时 0.035 秒)

    Alignment method in a wafer prober
    1.
    发明授权
    Alignment method in a wafer prober 失效
    晶圆探针中的对准方法

    公开(公告)号：US4934064A

    公开(公告)日：1990-06-19

    申请号：US240003

    申请日：1988-09-02

    申请人： Nobuhito Yamaguchi ,  Mitsuya Sato ,  Takao Ukaji ,  Taro Ohmori ,  Eiichi Murakami

    发明人： Nobuhito Yamaguchi ,  Mitsuya Sato ,  Takao Ukaji ,  Taro Ohmori ,  Eiichi Murakami

    IPC分类号： G01R31/02 ,  G01R1/073 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

    CPC分类号： H01L21/67259 ,  G01R1/07314 ,  H01L21/681

    摘要： A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads. By this, an error caused by the movement of the wafer holder in the Z direction does not affect against the alignment accuracy of the wafer in the X and Y directions, such that the probe needles can correctly contact the bonding pads.

    摘要翻译： 公开了一种用于将探针卡的探针接触到晶片上形成的芯片的焊盘的晶片探针，用于允许检查芯片的特性。 晶片探测器包括用于保持晶片并将其在X和Y方向上移动的晶片保持器。 通过晶片保持器，晶片可以从对准信息检测站移动，其中可以通过使用TV摄像机检测对准信息到探测卡的探针用于检查的检查站。 可以使得当电视摄像机检测到对准信息时的Z方向上的晶片的位置与探针接触焊盘时Z方向上的晶片位置基本一致。 由此，晶片保持器在Z方向的移动引起的误差不会影响晶片在X和Y方向上的对准精度，使得探针能够正确地接触焊盘。

    Wafer prober
    2.
    发明授权
    Wafer prober 失效
    晶圆探测器

    公开(公告)号：US4929893A

    公开(公告)日：1990-05-29

    申请号：US252997

    申请日：1988-10-04

    申请人： Mitsuya Sato ,  Takao Ukaji ,  Nobuhito Yamaguchi ,  Taro Ohmori ,  Eiichi Murakami

    发明人： Mitsuya Sato ,  Takao Ukaji ,  Nobuhito Yamaguchi ,  Taro Ohmori ,  Eiichi Murakami

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2886

    摘要： A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.

    摘要翻译： 公开了一种可用于检查形成在晶片上的芯片的探针卡的晶片探测器。 晶片探测器具有将每个芯片的焊盘自动对准探针卡的探针的功能。 探测器包括可在X和Y方向上与晶片卡盘一起移动的接触板。 接触片被压靠在探针的至少一个尖端上，并且通过电视摄像机从接触板的下面观察到这样接触的针尖。 由此获得的视频信号用于接合焊盘和探针之间的对准。 此外，电视摄像机在X和Y方向上与晶片卡盘一起移动，以允许通过该TV摄像机和用于对接合焊盘进行摄像的另一台TV摄像机观察同一参考标记。 利用所提出的结构，可以自动且准确地对准接合焊盘和探针。

    Ultrasonic type flow sensor
    3.
    发明授权
    Ultrasonic type flow sensor 有权
    超声波流量传感器

    公开(公告)号：US08544344B2

    公开(公告)日：2013-10-01

    申请号：US13296365

    申请日：2011-11-15

    申请人： Eiichi Murakami

    发明人： Eiichi Murakami

    IPC分类号： G01F1/66

    CPC分类号： G01F1/662 ,  G01F15/14

    摘要： First and second piezoelectric transducers 2 and 3 are fixed to a tubular main body 1 via first and second fitting bases 4 and 5. On front and rear surfaces of an end portion of each of the first and second piezoelectric transducers 2 and 3 are provided first and second electrodes 6 and 7. When the tubular main body 1 is secured to a circuit box, each of the end portions of the first and second piezoelectric transducers 2 and 3 is inserted between first and second contact members provided on the circuit box such that the first and second electrodes 6 and 7 are electrically connected to the first and second contact members, respectively to connect the first and second piezoelectric transducers 2 and 3 to the circuit box by one touch operation.

    摘要翻译： 第一和第二压电换能器2和3经由第一和第二配件基座4和5固定到管状主体1.在第一和第二压电换能器2和3中的每一个的端部的前表面和后表面被设置为第一 和第二电极6和7.当管状主体1固定到电路箱时，第一和第二压电换能器2和3的每个端部插入设置在电路箱上的第一和第二接触构件之间，使得 第一和第二电极6和7分别电连接到第一和第二接触构件，以通过一次触摸操作将第一和第二压电换能器2和3连接到电路箱。

    Wafer transport method
    5.
    发明授权
    Wafer transport method 失效
    晶圆输送方式

    公开(公告)号：US5562800A

    公开(公告)日：1996-10-08

    申请号：US308442

    申请日：1994-09-19

    申请人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    发明人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/677

    CPC分类号： H01L21/67748 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S438/935

    摘要： A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.

    摘要翻译： 晶片输送方法包括准备具有输送室和处理室的半导体工艺设备的步骤。 接口装置将输送室连接到处理室。 传送装置通过接口装置将半导体晶片从传送室传送到处理室。 安装基板的输送装置被插入到包括供给装置和排气装置的通信走廊中。 通过根据由输送装置和通信走廊之间的间隙形成的电导部分的位置依次控制供给切断装置，排气关闭装置和通信切断装置，在进行供给和排出的同时运送基板。 因此，在保持输送室和处理室的不同大气条件的同时，以高通量输送基板而不污染基板，从而制造具有高性能的半导体器件。

    Exposure apparatus
    10.
    发明授权
    Exposure apparatus 有权
    曝光装置

    公开(公告)号：US07046330B2

    公开(公告)日：2006-05-16

    申请号：US11229829

    申请日：2005-09-20

    申请人： Eiichi Murakami

    发明人： Eiichi Murakami

    IPC分类号： G03B27/52 ,  G03B27/42

    CPC分类号： G03F9/7096 ,  G03F7/70883 ,  G03F9/7026 ,  Y10S438/947

    摘要： An exposure apparatus for printing, by exposure, a pattern of an original onto a substrate includes a housing tightly filled with a predetermined ambience and for accommodating therein at least a portion of an exposure light optical axis, and a detection system having an optical system, wherein a portion of a light path of the detection system is disposed in a first space enclosed by the housing, and wherein at least another portion of the detection system including an electrical element thereof is disposed in a second space outside the housing.

    摘要翻译： 用于通过曝光将原稿图案打印到基板上的曝光装置包括紧密地填充有预定环境并用于在其中容纳曝光光轴的至少一部分的外壳以及具有光学系统的检测系统， 其中所述检测系统的光路的一部分设置在由所述壳体包围的第一空间中，并且其中包括其电气元件的所述检测系统的至少另一部分设置在所述壳体外部的第二空间中。