公开(公告)号：US06488158B1

公开(公告)日：2002-12-03

申请号：US09659826

申请日：2000-09-11

申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。

公开(公告)号：US07256065B1

公开(公告)日：2007-08-14

申请号：US10859673

申请日：2004-06-03

申请人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

发明人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

IPC分类号： H01L21/00

CPC分类号： H01L23/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00

摘要： A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.

摘要翻译： 一种用于将盖连接到具有与其连接的半导体芯片的支撑基板和夹具固定装置的方法。 每个半导体部件具有安装到半导体部件的半导体芯片和通过盖子连接材料连接到支撑基板的盖子。 使用包括部分固化步骤然后是无钳位固化步骤的两步工艺或通过在不包括预固化步骤的情况下将夹具附着材料固化在夹具夹具中来固化盖附接材料。 半导体部件制造基于成本和正在制造的半导体部件的数量来决定固化方法。 如果半导体制造商选择用夹具固定固化，则夹具夹具包括其上放置半导体部件的基板插件和包括其上设置有压缩材料的压缩板的压缩机构。