利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.03 秒)

    Substrate structure for an integrated circuit package and method for manufacturing the same
    1.
    发明授权
    Substrate structure for an integrated circuit package and method for manufacturing the same 失效
    集成电路封装的基板结构及其制造方法

    公开(公告)号：US06489572B2

    公开(公告)日：2002-12-03

    申请号：US09768981

    申请日：2001-01-23

    申请人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

    发明人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

    IPC分类号： H05K103

    CPC分类号： H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T156/109 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.

    摘要翻译： 一种用于集成电路封装的衬底结构。 基板电连接到电路板和集成电路。 基板包括多个金属片和胶。 金属板彼此相对布置。 每个金属片包括第一表面和第二表面。 胶被用于密封多个金属片以形成基底。 金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。 因此，金属片的信号输出端子可以平滑地电连接到电路板。 此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。 还公开了一种用于制造衬底的方法。

    Stacked structure of an image sensor and method for manufacturing the same
    4.
    发明授权
    Stacked structure of an image sensor and method for manufacturing the same 有权
    图像传感器的堆叠结构及其制造方法

    公开(公告)号：US06521881B2

    公开(公告)日：2003-02-18

    申请号：US09836160

    申请日：2001-04-16

    申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    IPC分类号： H01L2700

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

    摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

    Packaging structure of image sensor and method for packaging the same
    5.
    发明授权
    Packaging structure of image sensor and method for packaging the same 失效
    图像传感器的包装结构及其包装方法

    公开(公告)号：US06737720B2

    公开(公告)日：2004-05-18

    申请号：US09768845

    申请日：2001-01-23

    申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    IPC分类号： H01L310203

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

    摘要翻译： 图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。 基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。

    Package structure of an image sensor and packaging
    6.
    发明授权
    Package structure of an image sensor and packaging 有权
    图像传感器和包装的封装结构

    公开(公告)号：US06646316B2

    公开(公告)日：2003-11-11

    申请号：US09770049

    申请日：2001-01-24

    申请人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

    发明人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

    IPC分类号： H01L310203

    CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.

    摘要翻译： 图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

    Structure of stacked integrated circuits
    7.
    发明授权
    Structure of stacked integrated circuits 失效
    堆叠集成电路的结构

    公开(公告)号：US06441496B1

    公开(公告)日：2002-08-27

    申请号：US09768987

    申请日：2001-01-23

    申请人： Wen Chuan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Chia Jung Chang

    发明人： Wen Chuan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Chia Jung Chang

    IPC分类号： H01L23495

    CPC分类号： H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements. The upper integrated circuit is stacked above the second surface of the lower integrated circuit with the adhesive layer inserted between the upper and lower integrated circuit. The lower integrated circuit is adhered to the upper integrated circuit by the adhesive agent. A predetermined gap is formed between the lower and upper integrated circuit by the filling elements. According to this structure, the wirings located under the lower integrated circuit are free from being pressed and damaged by the upper integrated circuit when stacking a plurality of integrated circuits. Thus, the stacking processes can be facilitated and the manufacturing costs can also be lowered.

    摘要翻译： 堆叠集成电路的结构包括基板，下部集成电路，多个布线，粘合层和上部集成电路。 衬底具有形成有信号输入端的第一表面和形成有信号输出端的第二表面。 下集成电路具有第一表面和第二表面。 第一表面粘附到基板的第一表面，而第二表面形成有多个接合焊盘。 布线具有第一端和第二端。 第一端电连接到下集成电路的接合焊盘，而第二端电连接到衬底的信号输入端。 粘合剂层涂覆在下部集成电路的第二表面上并且包括粘合剂和填充元件。 上集成电路堆叠在下集成电路的第二表面上方，粘合层插入在上下集成电路之间。 下集成电路通过粘合剂粘附到上集成电路。 通过填充元件在下集成电路和上集成电路之间形成预定的间隙。 根据该结构，当堆叠多个集成电路时，位于下部集成电路下方的配线不受上部集成电路的压制和损坏。 因此，可以促进堆叠处理，并且还可以降低制造成本。