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公开(公告)号：US10362672B2
公开(公告)日：2019-07-23
申请号：US15290149
申请日：2016-10-11
发明人： Yoshihito Otsubo , Daisuke Tsuruga
摘要： A resin multilayer substrate includes a laminate including a plurality of resin layers and an interlayer connecting conductor which extends through at least one of the plurality of resin layers and is directly exposed to an outside of the laminate.
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公开(公告)号：US09730322B2
公开(公告)日：2017-08-08
申请号：US14878287
申请日：2015-10-08
发明人： Yuki Wakabayashi , Shigeru Tago , Daisuke Tsuruga , Masaki Kawata
IPC分类号： H05K1/16 , H05K1/11 , H05K1/18 , H05K3/46 , H03H7/01 , H05K1/02 , H05K3/00 , H05K3/32 , H03H1/00 , H05K3/34
CPC分类号： H05K1/115 , H03H7/0115 , H03H2001/0085 , H05K1/028 , H05K1/0298 , H05K1/165 , H05K1/186 , H05K3/0064 , H05K3/0094 , H05K3/32 , H05K3/3484 , H05K3/4617 , H05K3/4697 , H05K2201/0141 , H05K2201/09263 , H05K2201/10015 , H05K2201/10636 , H05K2203/046 , H05K2203/063 , H05K2203/1484 , Y02P70/611
摘要： A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.
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公开(公告)号：US10028388B2
公开(公告)日：2018-07-17
申请号：US15430869
申请日：2017-02-13
发明人： Shigeru Tago , Daisuke Tsuruga
摘要： A component-embedded substrate includes first to sixth thermoplastic resin bases, a first electronic component in the second thermoplastic resin base and including a first terminal, and a second electronic component in the fifth thermoplastic resin base and including a second terminal. The first terminal faces the second electronic component in a stacking direction. The second terminal faces the first electronic component in the stacking direction. A first planar conductor to which the first terminal is directly bonded is provided on the third thermoplastic resin base. An interlayer connection conductor to which the second terminal is directly bonded and in communication with the first planar conductor is provided in or on the fourth thermoplastic resin base.
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公开(公告)号：US20140356055A1
公开(公告)日：2014-12-04
申请号：US14459383
申请日：2014-08-14
IPC分类号： B23K20/00
CPC分类号： B23K20/00 , B23K1/0016 , B23K35/262 , B23K35/302 , B23K2101/42 , C21D9/50 , C22C9/00 , C22C9/01 , C22C9/05 , C22C9/06 , C22C13/00 , C22C13/02 , Y10T403/478
摘要： When a first joining object and a second joining object are joined to each other, the first joining object has a first metal composed of Sn or an alloy containing Sn, the second joining object has a second metal composed of an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu. The first joining object and the second joining object are subjected to heat treatment in a state of being in contact with each other to produce an intermetallic compound at an interface between both joining objects such that both joining object are joined to each other. An alloy containing Sn in an amount of 70% by weight or more is used as the first metal. An alloy containing Sn in an amount of 85% by weight or more is used as the first metal.
摘要翻译： 当第一接合对象和第二接合对象彼此接合时，第一接合对象具有由Sn或包含Sn的合金构成的第一金属，第二接合对象具有由包含至少一个选定的合金的合金构成的第二金属 来自Ni，Mn，Al和Cr以及Cu。 第一接合体和第二接合体在彼此接触的状态下进行热处理，以在两接合体之间的界面处形成金属间化合物，使得接合体彼此接合。 使用含有70重量％以上的Sn的合金作为第一金属。 使用含有85重量％以上的Sn的合金作为第一金属。
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