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公开(公告)号：US11266016B2
公开(公告)日：2022-03-01
申请号：US17319396
申请日：2021-05-13
发明人： Yusuke Kamitsubo , Ryosuke Takada , Tsuyoshi Katsube , Yasuhiro Kuratani , Shigeru Tago , Tomohiro Furumura
摘要： A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.
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公开(公告)号：US11246214B2
公开(公告)日：2022-02-08
申请号：US17186061
申请日：2021-02-26
发明人： Tomohiro Nagai , Shigeru Tago
摘要： A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.
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公开(公告)号：US10278289B2
公开(公告)日：2019-04-30
申请号：US15903064
申请日：2018-02-23
发明人： Kuniaki Yosui , Shigeru Tago , Masaki Kawata
摘要： A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers laminated together. The mounting land conductors are provided on a front surface of the multilayer body, and terminal conductors of a first component are bonded to the mounting land conductors by a thermal bonding method. The second components are disposed in the multilayer body and each has a modulus of elasticity greater than that of the multilayer body. When the multilayer body is seen in plan view, the second components are arranged such that a straight line connecting the second components passes through the center of gravity of the first component and such that the second components are superposed with the mounting land conductors.
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公开(公告)号：US10166747B2
公开(公告)日：2019-01-01
申请号：US15874021
申请日：2018-01-18
发明人： Keisuke Ikeno , Shigeru Tago , Hirohumi Shinagawa , Kuniaki Yosui , Yuki Ito
IPC分类号： H05K3/46 , B32B37/06 , B32B37/10 , H01L23/538 , C09K19/38
摘要： A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.
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公开(公告)号：US10028388B2
公开(公告)日：2018-07-17
申请号：US15430869
申请日：2017-02-13
发明人： Shigeru Tago , Daisuke Tsuruga
摘要： A component-embedded substrate includes first to sixth thermoplastic resin bases, a first electronic component in the second thermoplastic resin base and including a first terminal, and a second electronic component in the fifth thermoplastic resin base and including a second terminal. The first terminal faces the second electronic component in a stacking direction. The second terminal faces the first electronic component in the stacking direction. A first planar conductor to which the first terminal is directly bonded is provided on the third thermoplastic resin base. An interlayer connection conductor to which the second terminal is directly bonded and in communication with the first planar conductor is provided in or on the fourth thermoplastic resin base.
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公开(公告)号：US09813595B2
公开(公告)日：2017-11-07
申请号：US14840103
申请日：2015-08-31
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
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公开(公告)号：US09774070B2
公开(公告)日：2017-09-26
申请号：US14537059
申请日：2014-11-10
发明人： Nobuo Ikemoto , Yuki Wakabayashi , Shigeru Tago
IPC分类号： H01P3/08 , H01P11/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/36 , H01R12/62 , H05K3/00 , H05K3/46 , H01R103/00 , H01R24/50
CPC分类号： H01P3/082 , H01P3/08 , H01P11/003 , H01R12/62 , H01R24/50 , H01R2103/00 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/0242 , H05K1/0253 , H05K1/115 , H05K1/118 , H05K1/147 , H05K3/0052 , H05K3/363 , H05K3/4623 , H05K3/4632 , H05K2201/07 , H05K2201/09154 , H05K2201/0919 , H05K2201/09481 , H05K2201/09527 , H05K2201/096 , H05K2201/09618 , H05K2201/097 , H05K2201/09845 , H05K2201/10037 , H05K2201/10204 , Y10T29/49016
摘要： In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.
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公开(公告)号：US09673502B2
公开(公告)日：2017-06-06
申请号：US15285615
申请日：2016-10-05
发明人： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
CPC分类号： H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
摘要： A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
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公开(公告)号：US10455706B2
公开(公告)日：2019-10-22
申请号：US15928175
申请日：2018-03-22
发明人： Shigeru Tago , Kuniaki Yosui , Yuki Ito
IPC分类号： H05K5/00 , H05K3/32 , H05K3/46 , H05K1/11 , H05K3/00 , H05K1/02 , H05K7/00 , H05K1/18 , H05K3/40 , H05K3/34
摘要： A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.
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10.发明授权公开(公告)号：US09922918B2
公开(公告)日：2018-03-20
申请号：US15450093
申请日：2017-03-06
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/4867 , H01L23/49838 , H01L23/5383 , H01L23/5389 , H01L23/642 , H01L23/66 , H01L24/16 , H01L2021/60195 , H01L2223/6644 , H01L2223/6661 , H01L2224/16227 , H01L2224/16235 , H01L2224/18 , H01L2224/81 , H05K1/186 , H05K3/4617
摘要： A substrate for a stacked module includes a stacked insulator in which a plurality of insulator layers mainly composed of a thermoplastic resin are stacked, a conductor pattern arranged along the plurality of insulator layers in the stacked insulator, an embedded component connected to the conductor pattern, a pad provided on a surface of the stacked insulator and configured to be ultrasonically bonded to a bump of a mounted component to be mounted on the surface of the stacked insulator, and an auxiliary conductor pattern between the pad and the embedded component and extending in a range that covers the pad and the embedded component as viewed in a stacking direction of the plurality of insulator layers.
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